AU7585600A - Compliant and crosslinkable thermal interface materials - Google Patents

Compliant and crosslinkable thermal interface materials

Info

Publication number
AU7585600A
AU7585600A AU75856/00A AU7585600A AU7585600A AU 7585600 A AU7585600 A AU 7585600A AU 75856/00 A AU75856/00 A AU 75856/00A AU 7585600 A AU7585600 A AU 7585600A AU 7585600 A AU7585600 A AU 7585600A
Authority
AU
Australia
Prior art keywords
compliant
thermal interface
interface materials
crosslinkable thermal
crosslinkable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU75856/00A
Other languages
English (en)
Inventor
James Grundy
My Nguyen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Honeywell International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell International Inc filed Critical Honeywell International Inc
Publication of AU7585600A publication Critical patent/AU7585600A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
    • C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L15/00—Compositions of rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S524/00—Synthetic resins or natural rubbers -- part of the class 520 series
    • Y10S524/91—Antistatic compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Organic Insulating Materials (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
AU75856/00A 1999-09-17 2000-09-14 Compliant and crosslinkable thermal interface materials Abandoned AU7585600A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/398,988 US6238596B1 (en) 1999-03-09 1999-09-17 Compliant and crosslinkable thermal interface materials
US09398988 1999-09-17
PCT/US2000/025447 WO2001020618A1 (fr) 1999-09-17 2000-09-14 Materiaux interface thermiques polymerisables et compliant

Publications (1)

Publication Number Publication Date
AU7585600A true AU7585600A (en) 2001-04-17

Family

ID=23577653

Family Applications (1)

Application Number Title Priority Date Filing Date
AU75856/00A Abandoned AU7585600A (en) 1999-09-17 2000-09-14 Compliant and crosslinkable thermal interface materials

Country Status (9)

Country Link
US (1) US6238596B1 (fr)
EP (1) EP1224669B1 (fr)
JP (1) JP2003509574A (fr)
KR (1) KR100723101B1 (fr)
CN (2) CN1940007A (fr)
AT (1) ATE323939T1 (fr)
AU (1) AU7585600A (fr)
DE (1) DE60027452T2 (fr)
WO (1) WO2001020618A1 (fr)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6706219B2 (en) * 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6797382B2 (en) * 1999-12-01 2004-09-28 Honeywell International Inc. Thermal interface materials
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US6469379B1 (en) 2001-03-30 2002-10-22 Intel Corporation Chain extension for thermal materials
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
US7608324B2 (en) 2001-05-30 2009-10-27 Honeywell International Inc. Interface materials and methods of production and use thereof
CN1313541C (zh) * 2001-12-17 2007-05-02 大金工业株式会社 交联性弹性体组合物及由该组合物形成的成型品
US6597575B1 (en) 2002-01-04 2003-07-22 Intel Corporation Electronic packages having good reliability comprising low modulus thermal interface materials
US7147367B2 (en) 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
US20040077773A1 (en) * 2002-07-12 2004-04-22 Tavares Manuel J Low viscosity, flexible, hydrolytically stable potting compounds
EP1531985A4 (fr) * 2002-07-15 2008-03-19 Honeywell Int Inc Systemes d'interconnexion et d'interface thermiques, leurs procedes de production et leurs utilisations
CN1318536C (zh) * 2003-12-13 2007-05-30 鸿富锦精密工业（深圳）有限公司 散热装置及其相变导热片
CN100389166C (zh) * 2004-04-29 2008-05-21 鸿富锦精密工业（深圳）有限公司 一种热界面材料及其制造方法
JP4714432B2 (ja) * 2004-07-09 2011-06-29 スリーエム イノベイティブ プロパティズ カンパニー 熱伝導性シート
US20070097651A1 (en) * 2005-11-01 2007-05-03 Techfilm, Llc Thermal interface material with multiple size distribution thermally conductive fillers
US20070128931A1 (en) * 2005-12-05 2007-06-07 Ziwei Liu Polyester gel adapted for use with polycarbonate components
CN1978583A (zh) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 热介面材料
US20080023665A1 (en) * 2006-07-25 2008-01-31 Weiser Martin W Thermal interconnect and interface materials, methods of production and uses thereof
US20080063873A1 (en) * 2006-09-08 2008-03-13 Russell Stapleton Flexible microelectronics adhesive
WO2009131913A2 (fr) * 2008-04-21 2009-10-29 Honeywell International Inc. Matériaux isolants thermiques pour interconnexions et interfaces, leurs procédés de production et leurs utilisations
US20100112360A1 (en) * 2008-10-31 2010-05-06 Delano Andrew D Layered thermal interface systems methods of production and uses thereof
CN104194733B (zh) * 2009-03-02 2018-04-27 霍尼韦尔国际公司 热界面材料及制造和使用它的方法
US8299159B2 (en) * 2009-08-17 2012-10-30 Laird Technologies, Inc. Highly thermally-conductive moldable thermoplastic composites and compositions
JP5218364B2 (ja) * 2009-10-02 2013-06-26 横浜ゴム株式会社 熱伝導性組成物
JP5814688B2 (ja) * 2010-08-31 2015-11-17 三木ポリマー株式会社 熱伝導性樹脂組成物およびそれを含む放熱材
US9428680B2 (en) 2013-03-14 2016-08-30 Dow Corning Corporation Conductive silicone materials and uses
EP2970728A1 (fr) 2013-03-14 2016-01-20 Dow Corning Corporation Compositions de silicone vulcanisables, adhésif de silicone électro-conducteur, procédé de fabrication et d'utilisation associé, et dispositifs électriques associés
EP3077578A4 (fr) 2013-12-05 2017-07-26 Honeywell International Inc. Solution de méthanesulfonate stanneux à ph ajusté
CN105980512A (zh) 2014-02-13 2016-09-28 霍尼韦尔国际公司 可压缩热界面材料
US9615486B2 (en) 2014-03-26 2017-04-04 General Electric Company Thermal interface devices
CA2951437C (fr) 2014-07-07 2022-03-15 Honeywell International Inc. Materiau d'interface thermique avec agent piegeur d'ions
DE102015103118A1 (de) * 2014-10-06 2016-04-07 Siltectra Gmbh Splitting-Verfahren und Verwendung eines Materials in einem Splitting-Verfahren
US10287471B2 (en) 2014-12-05 2019-05-14 Honeywell International Inc. High performance thermal interface materials with low thermal impedance
CN104726076B (zh) * 2015-01-29 2017-09-22 海门市瑞泰纺织科技有限公司 一种燃烧炉内胆用导热材料
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
CN109072051B (zh) * 2016-03-08 2023-12-26 霍尼韦尔国际公司 相变材料
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
CN113015621B (zh) * 2018-11-16 2023-09-29 3M创新有限公司 可固化组合物、由其制得的制品，及其制造和使用方法
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
KR20220043761A (ko) * 2020-09-29 2022-04-05 주식회사 엘지에너지솔루션 경화성 조성물
CN115572439B (zh) * 2022-10-08 2023-07-14 长沙理工大学 一种铝基柔性热界面材料及其制备方法和应用

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0737548B2 (ja) * 1985-10-03 1995-04-26 昭和電工株式会社 放熱シ−ト
US5891951A (en) * 1987-09-14 1999-04-06 Idemitsu Kosan Co., Ltd. Styrene-based resin composition
US5094769A (en) 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound
JPH0216135A (ja) * 1988-07-05 1990-01-19 Tokuyama Soda Co Ltd ゴム組成物
FR2635110B1 (fr) * 1988-08-05 1990-11-09 Saim Adhesifs Insonorisants Mo Adhesif pregelifiable
EP0476224A1 (fr) 1990-08-21 1992-03-25 Ricon Resins, Inc. Composition adhésive de caoutchouc
US5859105A (en) * 1997-02-11 1999-01-12 Johnson Matthey, Inc. Organosilicon-containing compositions capable of rapid curing at low temperature
JPH09283955A (ja) * 1996-04-10 1997-10-31 Matsushita Electric Works Ltd 放熱シート
JP3780603B2 (ja) * 1997-02-27 2006-05-31 日立化成工業株式会社 放熱シート及び放熱板
JP3290127B2 (ja) * 1998-01-27 2002-06-10 松下電工株式会社 熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート
US5989459A (en) * 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials

Also Published As

Publication number Publication date
CN1940007A (zh) 2007-04-04
CN1280836C (zh) 2006-10-18
JP2003509574A (ja) 2003-03-11
KR20020075360A (ko) 2002-10-04
EP1224669B1 (fr) 2006-04-19
US6238596B1 (en) 2001-05-29
CN1402875A (zh) 2003-03-12
ATE323939T1 (de) 2006-05-15
EP1224669A1 (fr) 2002-07-24
DE60027452T2 (de) 2006-10-12
WO2001020618A1 (fr) 2001-03-22
KR100723101B1 (ko) 2007-06-04
DE60027452D1 (de) 2006-05-24
EP1224669A4 (fr) 2003-05-02

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Legal Events

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MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase