AU700075B2 - Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it - Google Patents
Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it Download PDFInfo
- Publication number
- AU700075B2 AU700075B2 AU23294/95A AU2329495A AU700075B2 AU 700075 B2 AU700075 B2 AU 700075B2 AU 23294/95 A AU23294/95 A AU 23294/95A AU 2329495 A AU2329495 A AU 2329495A AU 700075 B2 AU700075 B2 AU 700075B2
- Authority
- AU
- Australia
- Prior art keywords
- metallic foil
- circuit
- laminate
- support
- fabricating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000011888 foil Substances 0.000 title claims description 220
- 238000000034 method Methods 0.000 title claims description 81
- 229920005989 resin Polymers 0.000 claims description 101
- 239000011347 resin Substances 0.000 claims description 101
- 239000000853 adhesive Substances 0.000 claims description 52
- 230000001070 adhesive effect Effects 0.000 claims description 51
- 229920006255 plastic film Polymers 0.000 claims description 42
- 239000002985 plastic film Substances 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims description 35
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 29
- 229910052782 aluminium Inorganic materials 0.000 claims description 28
- 229920006223 adhesive resin Polymers 0.000 claims description 18
- 239000004840 adhesive resin Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000059 patterning Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004831 Hot glue Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000000123 paper Substances 0.000 description 33
- 239000010410 layer Substances 0.000 description 17
- 239000003990 capacitor Substances 0.000 description 16
- 238000005520 cutting process Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 15
- 239000007788 liquid Substances 0.000 description 14
- 238000003825 pressing Methods 0.000 description 7
- 238000009998 heat setting Methods 0.000 description 6
- -1 polyethylene Polymers 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 239000000945 filler Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000003000 extruded plastic Substances 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- BSYNRYMUTXBXSQ-UHFFFAOYSA-N Aspirin Chemical compound CC(=O)OC1=CC=CC=C1C(O)=O BSYNRYMUTXBXSQ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011088 parchment paper Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Burglar Alarm Systems (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU87868/98A AU723222B2 (en) | 1994-12-01 | 1998-10-01 | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32350694 | 1994-12-01 | ||
| JP6-323506 | 1995-05-23 | ||
| JP07167978A JP3116209B2 (ja) | 1994-12-01 | 1995-06-10 | 共振タグ等の回路様金属箔シートの製造方法 |
| JP7-167978 | 1995-06-10 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU87868/98A Division AU723222B2 (en) | 1994-12-01 | 1998-10-01 | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2329495A AU2329495A (en) | 1996-06-06 |
| AU700075B2 true AU700075B2 (en) | 1998-12-17 |
Family
ID=26491853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU23294/95A Ceased AU700075B2 (en) | 1994-12-01 | 1995-06-27 | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it |
Country Status (8)
| Country | Link |
|---|---|
| KR (1) | KR100197509B1 (pt) |
| CN (1) | CN1100999C (pt) |
| AU (1) | AU700075B2 (pt) |
| BR (1) | BR9502961A (pt) |
| CA (1) | CA2153022C (pt) |
| MY (1) | MY117567A (pt) |
| SG (1) | SG71080A1 (pt) |
| TW (1) | TW404092B (pt) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10651320B2 (en) | 2010-11-19 | 2020-05-12 | Dsm Ip Assets B.V. | Method of manufacturing a circuit board by punching |
| US10672928B2 (en) | 2011-06-06 | 2020-06-02 | Dsm Ip Assets B.V. | Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5754110A (en) * | 1996-03-07 | 1998-05-19 | Checkpoint Systems, Inc. | Security tag and manufacturing method |
| KR100605480B1 (ko) | 2004-04-19 | 2006-07-31 | 고상근 | 알에프아이디 시스템의 태그 제조방법 |
| JP5377096B2 (ja) | 2008-09-08 | 2013-12-25 | 株式会社東芝 | 高周波パッケージ装置およびその製造方法 |
| KR20120028418A (ko) | 2010-09-14 | 2012-03-23 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치용 밀봉기판의 제조 방법 및 유기 발광 표시 장치용 밀봉기판 |
| CN112621891B (zh) * | 2019-09-24 | 2022-10-14 | 泰州隆基乐叶光伏科技有限公司 | 导电金属箔冲压方法及冲压装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0063347A1 (de) * | 1981-04-22 | 1982-10-27 | IVO Irion & Vosseler Zählerfabrik GmbH & Co. | Prägefolie zum Aufbringen von Leiterbahnen |
| EP0255073A1 (de) * | 1986-07-30 | 1988-02-03 | Actron Entwicklungs AG | Schaltungsanordnung und Resonanzetikette sowie Verfahren zu ihrer Herstellung |
| EP0423651A1 (de) * | 1989-10-20 | 1991-04-24 | Kobe Properties Limited | Verfahren zur Herstellung einer Schaltungsanordnung, sowie Schaltungsanordnung auf einer Trägerfolie |
-
1995
- 1995-06-20 SG SG1998000182A patent/SG71080A1/en unknown
- 1995-06-20 TW TW084106329A patent/TW404092B/zh not_active IP Right Cessation
- 1995-06-20 MY MYPI95001653A patent/MY117567A/en unknown
- 1995-06-27 AU AU23294/95A patent/AU700075B2/en not_active Ceased
- 1995-06-28 BR BR9502961A patent/BR9502961A/pt not_active IP Right Cessation
- 1995-06-29 CN CN95108149A patent/CN1100999C/zh not_active Expired - Lifetime
- 1995-06-29 CA CA002153022A patent/CA2153022C/en not_active Expired - Fee Related
- 1995-06-30 KR KR1019950018841A patent/KR100197509B1/ko active IP Right Grant
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0063347A1 (de) * | 1981-04-22 | 1982-10-27 | IVO Irion & Vosseler Zählerfabrik GmbH & Co. | Prägefolie zum Aufbringen von Leiterbahnen |
| EP0255073A1 (de) * | 1986-07-30 | 1988-02-03 | Actron Entwicklungs AG | Schaltungsanordnung und Resonanzetikette sowie Verfahren zu ihrer Herstellung |
| EP0423651A1 (de) * | 1989-10-20 | 1991-04-24 | Kobe Properties Limited | Verfahren zur Herstellung einer Schaltungsanordnung, sowie Schaltungsanordnung auf einer Trägerfolie |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10651320B2 (en) | 2010-11-19 | 2020-05-12 | Dsm Ip Assets B.V. | Method of manufacturing a circuit board by punching |
| US10672928B2 (en) | 2011-06-06 | 2020-06-02 | Dsm Ip Assets B.V. | Metal foil pattern layered body, metal foil layered body, metal foil multi-layer substrate, solar cell module, and method of manufacturing metal foil pattern layered body |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2329495A (en) | 1996-06-06 |
| BR9502961A (pt) | 1997-05-27 |
| CN1126841A (zh) | 1996-07-17 |
| KR100197509B1 (ko) | 1999-06-15 |
| TW404092B (en) | 2000-09-01 |
| CA2153022A1 (en) | 1996-06-02 |
| SG71080A1 (en) | 2000-03-21 |
| CN1100999C (zh) | 2003-02-05 |
| MY117567A (en) | 2004-07-31 |
| CA2153022C (en) | 1999-11-30 |
| KR960021510A (ko) | 1996-07-18 |
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