CA2153022A1 - Circuit-Like Metallic Foil Sheet for Resonance Frequency Characteristic Tag and the Like and Process for Fabricating It - Google Patents
Circuit-Like Metallic Foil Sheet for Resonance Frequency Characteristic Tag and the Like and Process for Fabricating ItInfo
- Publication number
- CA2153022A1 CA2153022A1 CA2153022A CA2153022A CA2153022A1 CA 2153022 A1 CA2153022 A1 CA 2153022A1 CA 2153022 A CA2153022 A CA 2153022A CA 2153022 A CA2153022 A CA 2153022A CA 2153022 A1 CA2153022 A1 CA 2153022A1
- Authority
- CA
- Canada
- Prior art keywords
- circuit
- metallic foil
- fabricating
- laminate
- foil sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 5
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000002985 plastic film Substances 0.000 abstract 2
- 229920006255 plastic film Polymers 0.000 abstract 2
- 239000004831 Hot glue Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 229920006223 adhesive resin Polymers 0.000 abstract 1
- 230000007423 decrease Effects 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Abstract
A circuit-like metallic foil sheet for resonant tags and the like, and a process for fabricating the same. The circuit-like metallic foil sheet is fabricated by a process comprising: fabricating a laminate by adhering, to a carrier sheet such as a paper or a plastic film, a metallic foil whose surface is coated with hot-melt adhesive resin film, using an adhesive whose adhesion force decreases by heating; stamping out the metallic foil of the laminate to provide a predetermined circuit-like pattern using a stamping die;
superposing the metallic foil side of the laminate on a support such as a plastic film; and transferring the circuit-like metallic foil to the surface of the support by heating the circuit-like pattern from the support side or the carrier sheet side. The process may be used to produce a circuit board comprising a resonant circuit or a printed wiring circuit with high precision without employing an etching process in which chemicals are used.
superposing the metallic foil side of the laminate on a support such as a plastic film; and transferring the circuit-like metallic foil to the surface of the support by heating the circuit-like pattern from the support side or the carrier sheet side. The process may be used to produce a circuit board comprising a resonant circuit or a printed wiring circuit with high precision without employing an etching process in which chemicals are used.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPHEI6-323506 | 1994-12-01 | ||
JP32350694 | 1994-12-01 | ||
JPHEI7-167978 | 1995-06-10 | ||
JP07167978A JP3116209B2 (en) | 1994-12-01 | 1995-06-10 | Method of manufacturing circuit-like metal foil sheet such as resonance tag |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2153022A1 true CA2153022A1 (en) | 1996-06-02 |
CA2153022C CA2153022C (en) | 1999-11-30 |
Family
ID=26491853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002153022A Expired - Fee Related CA2153022C (en) | 1994-12-01 | 1995-06-29 | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating it |
Country Status (8)
Country | Link |
---|---|
KR (1) | KR100197509B1 (en) |
CN (1) | CN1100999C (en) |
AU (1) | AU700075B2 (en) |
BR (1) | BR9502961A (en) |
CA (1) | CA2153022C (en) |
MY (1) | MY117567A (en) |
SG (1) | SG71080A1 (en) |
TW (1) | TW404092B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5754110A (en) * | 1996-03-07 | 1998-05-19 | Checkpoint Systems, Inc. | Security tag and manufacturing method |
KR100605480B1 (en) | 2004-04-19 | 2006-07-31 | 고상근 | tag manufacturing method of RFID system |
JP5377096B2 (en) | 2008-09-08 | 2013-12-25 | 株式会社東芝 | High frequency package device and manufacturing method thereof |
KR20120028418A (en) | 2010-09-14 | 2012-03-23 | 삼성모바일디스플레이주식회사 | Method for manufacturing encapsulated substrate using organic luminescence display device and encapsulated substrate using organic luminescence display device |
WO2012067225A1 (en) | 2010-11-19 | 2012-05-24 | 凸版印刷株式会社 | Metal foil pattern laminate, method for punching metal foil, circuit board, method for producing same, and solar cell module |
CN103597915B (en) | 2011-06-06 | 2017-05-24 | 帝斯曼知识产权资产管理有限公司 | Metal foil patterned-laminate, metal foil laminate, metal foil laminate substrate, solar cell module and manufacturing method for metal foil patterned-laminate |
CN112621891B (en) * | 2019-09-24 | 2022-10-14 | 泰州隆基乐叶光伏科技有限公司 | Conductive metal foil stamping method and stamping device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3116078A1 (en) * | 1981-04-22 | 1983-01-20 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | "EMBOSSING FILM" |
CH677988A5 (en) * | 1986-07-30 | 1991-07-15 | Actron Entwicklungs Ag | |
CH680483A5 (en) * | 1989-10-20 | 1992-08-31 | Kobe Properties Ltd |
-
1995
- 1995-06-20 TW TW084106329A patent/TW404092B/en not_active IP Right Cessation
- 1995-06-20 SG SG1998000182A patent/SG71080A1/en unknown
- 1995-06-20 MY MYPI95001653A patent/MY117567A/en unknown
- 1995-06-27 AU AU23294/95A patent/AU700075B2/en not_active Ceased
- 1995-06-28 BR BR9502961A patent/BR9502961A/en not_active IP Right Cessation
- 1995-06-29 CN CN95108149A patent/CN1100999C/en not_active Expired - Lifetime
- 1995-06-29 CA CA002153022A patent/CA2153022C/en not_active Expired - Fee Related
- 1995-06-30 KR KR1019950018841A patent/KR100197509B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN1100999C (en) | 2003-02-05 |
AU2329495A (en) | 1996-06-06 |
SG71080A1 (en) | 2000-03-21 |
MY117567A (en) | 2004-07-31 |
CN1126841A (en) | 1996-07-17 |
KR100197509B1 (en) | 1999-06-15 |
TW404092B (en) | 2000-09-01 |
CA2153022C (en) | 1999-11-30 |
KR960021510A (en) | 1996-07-18 |
AU700075B2 (en) | 1998-12-17 |
BR9502961A (en) | 1997-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0665705A3 (en) | Circuit-like metallic foil sheet and the like and process for producing them. | |
EP1955298B1 (en) | Label with electronic components and method of making same | |
CA2396750C (en) | Rfid foil or film antennas | |
CA2169547A1 (en) | Multiple Layer Printed Circuit Boards and Method of Manufacture | |
US20020018880A1 (en) | Stamping foils for use in making printed circuits and radio frequency antennas | |
EP0395443A3 (en) | Circuit board and overlay | |
CA2108969A1 (en) | Microwave package laminate with extrusion bonded susceptor | |
EP1130542A4 (en) | Method of manufacturing card | |
US6549132B2 (en) | Deactivatable electronic article surveillance tag and method for making same | |
CA2338670A1 (en) | Resin/copper/metal laminate and method of producing same | |
EP0404177A3 (en) | Transfer sheet for making printed-wiring board by injection molding and method for producing same | |
CA2153022A1 (en) | Circuit-Like Metallic Foil Sheet for Resonance Frequency Characteristic Tag and the Like and Process for Fabricating It | |
KR910004077A (en) | Circuit board | |
EP1154391A4 (en) | Adhesion label | |
WO1994011846A1 (en) | Roll identification device and method for fabricating the same | |
EP0340670A3 (en) | Resonant frequency characteristic tag and method of manufacturing the same | |
DE59813999D1 (en) | Recyclable circuit board consisting of a foil and carrier system | |
EP0397177A3 (en) | Asymmetric adhesive sheet | |
JP2002083275A (en) | Electronic tag and electronic sign using the same | |
JP4693295B2 (en) | Circuit formation method | |
ATE341108T1 (en) | METHOD AND DEVICE FOR PRODUCING A ROLL OF ANTENNA ELEMENTS AND FOR ISSUEING SUCH ANTENNA ELEMENTS | |
EP1316640A3 (en) | Dewatering member with a composite body for a paper or board machine and method for manufacturing a dewatering member with a composite body for a paper or board machine | |
JP2005190279A (en) | Foil tooling film having conductivity and method for producing non-contact ic label using foil tooling film having conductivity | |
KR950001555A (en) | Manufacturing method of tag for wireless recognition | |
JPH08107262A (en) | Simple substrate manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |