MY117567A - Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating - Google Patents
Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricatingInfo
- Publication number
- MY117567A MY117567A MYPI95001653A MYPI9501653A MY117567A MY 117567 A MY117567 A MY 117567A MY PI95001653 A MYPI95001653 A MY PI95001653A MY PI9501653 A MYPI9501653 A MY PI9501653A MY 117567 A MY117567 A MY 117567A
- Authority
- MY
- Malaysia
- Prior art keywords
- circuit
- metallic foil
- fabricating
- laminate
- foil sheet
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0108—Male die used for patterning, punching or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Burglar Alarm Systems (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A CIRCUIT-LIKE METALLIC FOIL SHEET FOR RESONANT TAGS AND THE LIKE, AND A PROCESS FOR FABRICATING THE SAME. THE CIRCUIT-LIKE METALLIC FOIL SHEET IS FABRICATED BY A PROCESS COMPRISING: FABRICATING A LAMINATE BY ADHERING, TO A CARRIER SHEET SUCH AS A PAPER OR A PLASTIC FILM, A METALLIC FOIL WHOSE SURFACE IS COATED WITH HOT-MELT ADHESIVE RESIN FILM, USING AN ADHESIVE WHOSE ADHESION FORCE DECREASES BY HEATING; STAMPING OUT THE METALLIC FOIL OF THE LAMINATE TO PROVIDE THERETO A PREDETERMINED CIRCUIT-LIKE PATTERN USING A STAMPING DIE; SUPERPOSING THE METALLIC FOIL SIDE OF THE LAMINATE ON A SUPPORT SUCH AS A PLASTIC FILM; AND TRANSFERRING THE CIRCUIT-LIKE METALLIC FOIL TO THE SURFACE OF THE SUPPORT BY HEATING THE CIRCUIT-LIKE FROM THE SUPPORT SIDE OR THE CARRIER SHEET SIDE. A CIRCUIT BOARD COMPRISING A RESONANT CIRCUIT OR A PRINTED WIRING CIRCUIT CAN BE OBTAINED WITH HIGH PRECISION WITHOUT EMPLOYING AN ETCHING PROCESS IN WHICH CHEMICALS ARE USED.(FIG. 8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32350694 | 1994-12-01 | ||
JP07167978A JP3116209B2 (en) | 1994-12-01 | 1995-06-10 | Method of manufacturing circuit-like metal foil sheet such as resonance tag |
Publications (1)
Publication Number | Publication Date |
---|---|
MY117567A true MY117567A (en) | 2004-07-31 |
Family
ID=26491853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI95001653A MY117567A (en) | 1994-12-01 | 1995-06-20 | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating |
Country Status (8)
Country | Link |
---|---|
KR (1) | KR100197509B1 (en) |
CN (1) | CN1100999C (en) |
AU (1) | AU700075B2 (en) |
BR (1) | BR9502961A (en) |
CA (1) | CA2153022C (en) |
MY (1) | MY117567A (en) |
SG (1) | SG71080A1 (en) |
TW (1) | TW404092B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5754110A (en) * | 1996-03-07 | 1998-05-19 | Checkpoint Systems, Inc. | Security tag and manufacturing method |
KR100605480B1 (en) | 2004-04-19 | 2006-07-31 | 고상근 | tag manufacturing method of RFID system |
JP5377096B2 (en) | 2008-09-08 | 2013-12-25 | 株式会社東芝 | High frequency package device and manufacturing method thereof |
KR20120028418A (en) | 2010-09-14 | 2012-03-23 | 삼성모바일디스플레이주식회사 | Method for manufacturing encapsulated substrate using organic luminescence display device and encapsulated substrate using organic luminescence display device |
CN103262668B (en) | 2010-11-19 | 2016-04-06 | 凸版印刷株式会社 | Metallic foil pattern duplexer, metal forming play the manufacture method of modeling method, circuit substrate |
EP3300125B1 (en) | 2011-06-06 | 2020-01-15 | DSM IP Assets B.V. | Metal foil, patterned-laminate and a solar cell module |
CN112621891B (en) * | 2019-09-24 | 2022-10-14 | 泰州隆基乐叶光伏科技有限公司 | Conductive metal foil stamping method and stamping device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3116078A1 (en) * | 1981-04-22 | 1983-01-20 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | "EMBOSSING FILM" |
CH677988A5 (en) * | 1986-07-30 | 1991-07-15 | Actron Entwicklungs Ag | |
CH680483A5 (en) * | 1989-10-20 | 1992-08-31 | Kobe Properties Ltd |
-
1995
- 1995-06-20 TW TW084106329A patent/TW404092B/en not_active IP Right Cessation
- 1995-06-20 SG SG1998000182A patent/SG71080A1/en unknown
- 1995-06-20 MY MYPI95001653A patent/MY117567A/en unknown
- 1995-06-27 AU AU23294/95A patent/AU700075B2/en not_active Ceased
- 1995-06-28 BR BR9502961A patent/BR9502961A/en not_active IP Right Cessation
- 1995-06-29 CN CN95108149A patent/CN1100999C/en not_active Expired - Lifetime
- 1995-06-29 CA CA002153022A patent/CA2153022C/en not_active Expired - Fee Related
- 1995-06-30 KR KR1019950018841A patent/KR100197509B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR960021510A (en) | 1996-07-18 |
CA2153022A1 (en) | 1996-06-02 |
AU700075B2 (en) | 1998-12-17 |
KR100197509B1 (en) | 1999-06-15 |
SG71080A1 (en) | 2000-03-21 |
TW404092B (en) | 2000-09-01 |
AU2329495A (en) | 1996-06-06 |
CN1126841A (en) | 1996-07-17 |
CN1100999C (en) | 2003-02-05 |
CA2153022C (en) | 1999-11-30 |
BR9502961A (en) | 1997-05-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0665705A3 (en) | Circuit-like metallic foil sheet and the like and process for producing them. | |
KR20020071021A (en) | Rfid foil or film antennas | |
CA2169547A1 (en) | Multiple Layer Printed Circuit Boards and Method of Manufacture | |
ATE167319T1 (en) | BASE FILM FOR CHIP CARD | |
EP0395443A3 (en) | Circuit board and overlay | |
CA2108969A1 (en) | Microwave package laminate with extrusion bonded susceptor | |
TW349269B (en) | Deformable substrate assembly for adhesively bonded electronic device | |
MXPA04002482A (en) | Security tag and process for making same. | |
EP0124847A3 (en) | A flexible base plate for printed circuit board and a method for the preparation thereof | |
KR850007317A (en) | Device board device-attached adhesive transfer device with preformed pattern | |
US20020018880A1 (en) | Stamping foils for use in making printed circuits and radio frequency antennas | |
MX9603163A (en) | Data carrier with an electronic module and process for producing the same. | |
US6549132B2 (en) | Deactivatable electronic article surveillance tag and method for making same | |
MY117567A (en) | Circuit-like metallic foil sheet for resonance frequency characteristic tag and the like and process for fabricating | |
KR910002316A (en) | Transfer sheet for printed wiring board by injection molding and its manufacturing method | |
KR910004077A (en) | Circuit board | |
DK0587403T3 (en) | Thermally transferable emblem species made from a thermoplastic synthetic resin and process for its manufacture | |
EP1154391A4 (en) | Adhesion label | |
EP0340670A3 (en) | Resonant frequency characteristic tag and method of manufacturing the same | |
EP0148601A3 (en) | Transfer lamination of electrical circuit patterns | |
DE59813999D1 (en) | Recyclable circuit board consisting of a foil and carrier system | |
EP0397177A3 (en) | Asymmetric adhesive sheet | |
FI20002543A (en) | Method for Attaching an Integrated Circuit to a Silicon Chip on a Smart Sticker and Method for Pretreating a Silicon Disc | |
JP2002083275A (en) | Electronic tag and electronic sign using the same | |
ATE341108T1 (en) | METHOD AND DEVICE FOR PRODUCING A ROLL OF ANTENNA ELEMENTS AND FOR ISSUEING SUCH ANTENNA ELEMENTS |