AU2003297025A1 - Fast localization of electrical failures on an integrated circuit system and method - Google Patents

Fast localization of electrical failures on an integrated circuit system and method

Info

Publication number
AU2003297025A1
AU2003297025A1 AU2003297025A AU2003297025A AU2003297025A1 AU 2003297025 A1 AU2003297025 A1 AU 2003297025A1 AU 2003297025 A AU2003297025 A AU 2003297025A AU 2003297025 A AU2003297025 A AU 2003297025A AU 2003297025 A1 AU2003297025 A1 AU 2003297025A1
Authority
AU
Australia
Prior art keywords
integrated circuit
circuit system
electrical failures
fast localization
localization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003297025A
Other languages
English (en)
Other versions
AU2003297025A8 (en
Inventor
Dennis Ciplickas
Christopher Hess
Sherry Lee
Larg H. Weiland
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PDF Solutions Inc
Original Assignee
PDF Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PDF Solutions Inc filed Critical PDF Solutions Inc
Publication of AU2003297025A1 publication Critical patent/AU2003297025A1/en
Publication of AU2003297025A8 publication Critical patent/AU2003297025A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • H10P74/277—Circuits for electrically characterising or monitoring manufacturing processes, e.g. circuits in tested chips or circuits in testing wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams
    • G01R31/307—Contactless testing using electron beams of integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
AU2003297025A 2002-12-11 2003-12-11 Fast localization of electrical failures on an integrated circuit system and method Abandoned AU2003297025A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US43278602P 2002-12-11 2002-12-11
US60/432,786 2002-12-11
PCT/US2003/039698 WO2004053944A2 (en) 2002-12-11 2003-12-11 Fast localization of electrical failures on an integrated circuit system and method

Publications (2)

Publication Number Publication Date
AU2003297025A1 true AU2003297025A1 (en) 2004-06-30
AU2003297025A8 AU2003297025A8 (en) 2004-06-30

Family

ID=32507992

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003297025A Abandoned AU2003297025A1 (en) 2002-12-11 2003-12-11 Fast localization of electrical failures on an integrated circuit system and method

Country Status (6)

Country Link
US (1) US7527987B2 (https=)
EP (1) EP1570510A2 (https=)
JP (1) JP2006515464A (https=)
CN (1) CN1723544A (https=)
AU (1) AU2003297025A1 (https=)
WO (1) WO2004053944A2 (https=)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3834008B2 (ja) * 2003-03-19 2006-10-18 株式会社東芝 不良解析装置、不良解析方法および不良解析プログラム
US7415378B2 (en) * 2005-01-31 2008-08-19 Texas Instruments Incorporated Methods for analyzing critical defects in analog integrated circuits
US7902849B2 (en) 2006-01-03 2011-03-08 Applied Materials Israel, Ltd. Apparatus and method for test structure inspection
US20080312875A1 (en) * 2007-06-12 2008-12-18 Yu Guanyuan M Monitoring and control of integrated circuit device fabrication processes
TWI469235B (zh) * 2007-08-20 2015-01-11 Kla Tencor Corp 決定實際缺陷是潛在系統性缺陷或潛在隨機缺陷之由電腦實施之方法
US8362480B1 (en) * 2007-09-25 2013-01-29 Pdf Solutions, Inc. Reusable test chip for inline probing of three dimensionally arranged experiments
CN101576565B (zh) * 2008-05-09 2013-07-10 上海华碧检测技术有限公司 集成电路缺陷定位测试系统
US8018367B2 (en) * 2009-01-07 2011-09-13 Intersil Americas Inc. N-bit ADC reader
JP5478133B2 (ja) * 2009-07-03 2014-04-23 株式会社日本マイクロニクス 集積回路の試験に用いるテストチップ
CN102339331B (zh) * 2010-07-19 2013-06-05 中国科学院微电子研究所 一种电路问题设计布图定位调整的方法
JP2012037314A (ja) * 2010-08-05 2012-02-23 Fujitsu Ltd 評価用基板および基板評価方法
CN102148132B (zh) * 2010-11-19 2013-02-27 上海微曦自动控制技术有限公司 光学检测装置
US8765602B2 (en) 2012-08-30 2014-07-01 International Business Machines Corporation Doping of copper wiring structures in back end of line processing
TW201418738A (zh) 2012-11-02 2014-05-16 Kinsus Interconnect Tech Corp 終端檢驗系統
US9349662B2 (en) * 2012-12-03 2016-05-24 Taiwan Semiconductor Manufacturing Company, Ltd. Test structure placement on a semiconductor wafer
US20140303912A1 (en) * 2013-04-07 2014-10-09 Kla-Tencor Corporation System and method for the automatic determination of critical parametric electrical test parameters for inline yield monitoring
US9799575B2 (en) 2015-12-16 2017-10-24 Pdf Solutions, Inc. Integrated circuit containing DOEs of NCEM-enabled fill cells
US10199283B1 (en) 2015-02-03 2019-02-05 Pdf Solutions, Inc. Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage
US10593604B1 (en) 2015-12-16 2020-03-17 Pdf Solutions, Inc. Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells
US10978438B1 (en) 2015-12-16 2021-04-13 Pdf Solutions, Inc. IC with test structures and E-beam pads embedded within a contiguous standard cell area
US9905553B1 (en) 2016-04-04 2018-02-27 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells
US9653446B1 (en) 2016-04-04 2017-05-16 Pdf Solutions, Inc. Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and AA-short-configured, NCEM-enabled fill cells
US9929063B1 (en) 2016-04-04 2018-03-27 Pdf Solutions, Inc. Process for making an integrated circuit that includes NCEM-Enabled, tip-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
TWI598610B (zh) * 2017-02-16 2017-09-11 致茂電子股份有限公司 通用控制系統
US9748153B1 (en) 2017-03-29 2017-08-29 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-side short configure
US9773774B1 (en) 2017-03-30 2017-09-26 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells
US9768083B1 (en) 2017-06-27 2017-09-19 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells
US9786649B1 (en) 2017-06-27 2017-10-10 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including via open configured fill cells, and the second DOE including stitch open configured fill cells
US9865583B1 (en) 2017-06-28 2018-01-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including snake open configured fill cells, and the second DOE including stitch open configured fill cells
US10096530B1 (en) 2017-06-28 2018-10-09 Pdf Solutions, Inc. Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cells
CN107861045A (zh) * 2017-10-13 2018-03-30 天津市英贝特航天科技有限公司 一种基于直流ct技术的短路芯片查找装置及方法
US10970834B2 (en) * 2018-01-05 2021-04-06 Kla-Tencor Corporation Defect discovery using electron beam inspection and deep learning with real-time intelligence to reduce nuisance
CN110398617B (zh) * 2018-04-25 2022-03-25 晶豪科技股份有限公司 测试装置及折叠探针卡测试系统
KR102747247B1 (ko) * 2019-04-18 2024-12-31 삼성전자주식회사 패턴 디자인 및 상기 패턴 디자인을 검사하기 위한 방법
KR102925871B1 (ko) * 2022-05-03 2026-02-10 삼성디스플레이 주식회사 표시 장치의 검사 방법 및 표시 장치의 검사 장치

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065691B2 (ja) 1987-09-26 1994-01-19 株式会社東芝 半導体素子の試験方法および試験装置
US5457400A (en) * 1992-04-10 1995-10-10 Micron Technology, Inc. Semiconductor array having built-in test circuit for wafer level testing
KR970010656B1 (ko) * 1992-09-01 1997-06-30 마쯔시다 덴기 산교 가부시끼가이샤 반도체 테스트 장치, 반도체 테스트 회로칩 및 프로브 카드
KR950015768A (ko) * 1993-11-17 1995-06-17 김광호 불휘발성 반도체 메모리 장치의 배선단락 검출회로 및 그 방법
US5500603A (en) 1994-08-31 1996-03-19 Sgs-Thomson Microelectronics, Inc. Methodology to quickly isolate functional failures associated with integrated circuit manufacturing defects
JPH0917834A (ja) * 1995-06-30 1997-01-17 Sony Corp 評価用素子群およびこれを用いた評価方法
JP3528363B2 (ja) * 1995-10-13 2004-05-17 ヤマハ株式会社 試験用半導体装置の評価方法
US5969538A (en) * 1996-10-31 1999-10-19 Texas Instruments Incorporated Semiconductor wafer with interconnect between dies for testing and a process of testing
US5831446A (en) * 1996-07-12 1998-11-03 Stmicroelectronics, Inc. Process monitor test chip and methodology
US6551844B1 (en) * 1997-01-15 2003-04-22 Formfactor, Inc. Test assembly including a test die for testing a semiconductor product die
US6057171A (en) * 1997-09-25 2000-05-02 Frequency Technology, Inc. Methods for determining on-chip interconnect process parameters
TW369692B (en) 1997-12-26 1999-09-11 Samsung Electronics Co Ltd Test and burn-in apparatus, in-line system using the apparatus, and test method using the system
US20020053694A1 (en) * 1998-06-10 2002-05-09 Sutcliffe Victor C. Method of forming a memory cell with self-aligned contacts
US6233184B1 (en) * 1998-11-13 2001-05-15 International Business Machines Corporation Structures for wafer level test and burn-in
US6137303A (en) * 1998-12-14 2000-10-24 Sony Corporation Integrated testing method and apparatus for semiconductor test operations processing
KR100328809B1 (ko) * 1999-07-22 2002-03-14 윤종용 웨이퍼 레벨 테스트 기능을 갖는 반도체 메모리 장치
JP2001035188A (ja) * 1999-07-26 2001-02-09 Fujitsu Ltd 半導体装置の試験方法及び半導体装置
US6449748B1 (en) 1999-08-09 2002-09-10 Lsi Logic Corporation Non-destructive method of detecting die crack problems
JP2001072989A (ja) * 1999-09-08 2001-03-21 Minebea Co Ltd 高効率電動機用軸受
JP2001091544A (ja) 1999-09-27 2001-04-06 Hitachi Ltd 半導体検査装置の製造方法
AU1616101A (en) * 1999-11-18 2001-05-30 Pdf Solutions, Inc. The passive multiplexor test structure for intergrated circuit manufacturing
US6449749B1 (en) * 1999-11-18 2002-09-10 Pdf Solutions, Inc. System and method for product yield prediction
US6771806B1 (en) * 1999-12-14 2004-08-03 Kla-Tencor Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices
US7173444B2 (en) * 2000-04-04 2007-02-06 Ali Pourkeramati Structure and method for parallel testing of dies on a semiconductor wafer
JP3920003B2 (ja) * 2000-04-25 2007-05-30 株式会社ルネサステクノロジ 検査データ処理方法およびその装置
US6462568B1 (en) * 2000-08-31 2002-10-08 Micron Technology, Inc. Conductive polymer contact system and test method for semiconductor components
US6577149B2 (en) * 2001-01-05 2003-06-10 Taiwan Semiconductor Manufacturing Co., Ltd. Method and device for addressable failure site test structure
US6462569B2 (en) 2001-02-20 2002-10-08 Andy Chen Probe card
CN1262960C (zh) * 2001-03-12 2006-07-05 Pdf技术公司 缺陷密度与尺寸分布的提取方法
TW559970B (en) * 2001-04-05 2003-11-01 Kawasaki Microelectronics Inc Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit
US6871307B2 (en) * 2001-10-10 2005-03-22 Tower Semiconductorltd. Efficient test structure for non-volatile memory and other semiconductor integrated circuits

Also Published As

Publication number Publication date
US7527987B2 (en) 2009-05-05
AU2003297025A8 (en) 2004-06-30
WO2004053944A2 (en) 2004-06-24
US20060105475A1 (en) 2006-05-18
CN1723544A (zh) 2006-01-18
JP2006515464A (ja) 2006-05-25
WO2004053944A3 (en) 2004-11-04
EP1570510A2 (en) 2005-09-07

Similar Documents

Publication Publication Date Title
AU2003297025A1 (en) Fast localization of electrical failures on an integrated circuit system and method
AU2003272829A1 (en) System and method for defect localization on electrical test structures
AU2002307129A1 (en) Electronic circuit device, system and method
AU2003285417A1 (en) Method and device for synthesising an electrical architecture
GB2392251B (en) Automatic integrated circuit testing system and device using an integrative computer and method for the same
AU2003241278A1 (en) System and method for indexing videos based on speaker distinction
AU2003268068A1 (en) Insulated implantable electrical circuit
AU2003225711A1 (en) Equipment tracking system and method
AU2003297666A1 (en) Circuit and method for testing high speed data circuits
AU2003234771A1 (en) Connector for measuring electric resistance, apparatus and method for measuring electric resistance of circuit board
AU2003258396A1 (en) System and method for integrated circuit design
AU2003212931A1 (en) Semiconductor device and method of isolating circuit regions
AU2002346057A1 (en) System and method for calibration of data in an electric power monitoring system
AU2003250688A1 (en) Power down system and method for integrated circuits
AU2003283932A1 (en) An interventional simulator system
AU2003270251A1 (en) Device and method for converting and adding circuit
AU2003227772A1 (en) System for the mechanical and electrical connection of printed circuits
AU2003283931A1 (en) An interventional simulator system
AU2003241031A1 (en) An electrical connector
AU2002364274A1 (en) Insulation trench for an integrated circuit and method for production thereof
SG110150A1 (en) Electrical circuit and method for testing integrate circuits
AU2003227874A1 (en) An electrical connector
AU2002356680A1 (en) Method and device for producing an electrical strip conductor on a substrate
AU2002343470A1 (en) An electrical control circuit and method
AU2002252602A1 (en) Apparatus and circuit having reduced leakage current and method therefor

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase