AU2003290921A1 - Method of using a soft subpad for chemical mechanical polishing - Google Patents

Method of using a soft subpad for chemical mechanical polishing

Info

Publication number
AU2003290921A1
AU2003290921A1 AU2003290921A AU2003290921A AU2003290921A1 AU 2003290921 A1 AU2003290921 A1 AU 2003290921A1 AU 2003290921 A AU2003290921 A AU 2003290921A AU 2003290921 A AU2003290921 A AU 2003290921A AU 2003290921 A1 AU2003290921 A1 AU 2003290921A1
Authority
AU
Australia
Prior art keywords
mechanical polishing
chemical mechanical
subpad
soft
soft subpad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003290921A
Other languages
English (en)
Inventor
John J. Gagliardi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2003290921A1 publication Critical patent/AU2003290921A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AU2003290921A 2003-01-10 2003-11-17 Method of using a soft subpad for chemical mechanical polishing Abandoned AU2003290921A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/339,963 US6908366B2 (en) 2003-01-10 2003-01-10 Method of using a soft subpad for chemical mechanical polishing
US10/339,963 2003-01-10
PCT/US2003/036487 WO2004062853A1 (en) 2003-01-10 2003-11-17 Method of using a soft subpad for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
AU2003290921A1 true AU2003290921A1 (en) 2004-08-10

Family

ID=32711209

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003290921A Abandoned AU2003290921A1 (en) 2003-01-10 2003-11-17 Method of using a soft subpad for chemical mechanical polishing

Country Status (9)

Country Link
US (1) US6908366B2 (https=)
EP (1) EP1583639A1 (https=)
JP (1) JP2006513571A (https=)
KR (1) KR101062088B1 (https=)
CN (1) CN1735481B (https=)
AU (1) AU2003290921A1 (https=)
MY (1) MY136807A (https=)
TW (1) TWI309190B (https=)
WO (1) WO2004062853A1 (https=)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6946384B2 (en) * 2003-06-06 2005-09-20 Intel Corporation Stacked device underfill and a method of fabrication
US7320928B2 (en) * 2003-06-20 2008-01-22 Intel Corporation Method of forming a stacked device filler
US7198549B2 (en) * 2004-06-16 2007-04-03 Cabot Microelectronics Corporation Continuous contour polishing of a multi-material surface
US20060089095A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089093A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US20060089094A1 (en) * 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US6997785B1 (en) 2004-12-23 2006-02-14 3M Innovative Properties Company Wafer planarization composition and method of use
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
KR100772034B1 (ko) * 2006-12-08 2007-10-31 주식회사 썬텍인더스트리 코팅된 3차원 연마재 구조물을 갖는 연마포지의 제조방법
WO2009140622A2 (en) * 2008-05-15 2009-11-19 3M Innovative Properties Company Polishing pad with endpoint window and systems and method using the same
KR20110019442A (ko) * 2008-06-26 2011-02-25 쓰리엠 이노베이티브 프로퍼티즈 캄파니 다공성 요소를 구비한 연마 패드 및 이 연마 패드의 제작 방법 및 이용 방법
US20110183583A1 (en) * 2008-07-18 2011-07-28 Joseph William D Polishing Pad with Floating Elements and Method of Making and Using the Same
DE102009030297B3 (de) * 2009-06-24 2011-01-20 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
WO2011082155A2 (en) 2009-12-30 2011-07-07 3M Innovative Properties Company Polishing pads including phase-separated polymer blend and method of making and using the same
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
WO2012071243A2 (en) 2010-11-22 2012-05-31 3M Innovative Properties Company Assembly and electronic devices including the same
CN102601747B (zh) * 2011-01-20 2015-12-09 中芯国际集成电路制造(上海)有限公司 一种研磨垫及其制备方法、使用方法
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US10556316B2 (en) 2015-05-13 2020-02-11 3M Innovative Properties Company Polishing pads and systems for and methods of using same
CN106903621A (zh) * 2017-04-02 2017-06-30 长葛市老城昌宝建筑机械配件厂 两种研磨颗粒的耐磨砂布和其制造方法
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
KR102777772B1 (ko) * 2018-11-27 2025-03-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4927432A (en) 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5110843A (en) 1991-05-01 1992-05-05 Minnesota Mining And Manufacturing Company Absorbent, non-skinned foam and the method of preparation
US5514245A (en) * 1992-01-27 1996-05-07 Micron Technology, Inc. Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches
CA2134156A1 (en) 1993-11-22 1995-05-23 Thomas P. Klun Coatable compositions, abrasive articles made therefrom, and methods of making and using same
JPH0955362A (ja) * 1995-08-09 1997-02-25 Cypress Semiconductor Corp スクラッチを減少する集積回路の製造方法
CN1197542A (zh) 1995-09-13 1998-10-28 株式会社日立制作所 抛光方法和设备
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US5968843A (en) 1996-12-18 1999-10-19 Advanced Micro Devices, Inc. Method of planarizing a semiconductor topography using multiple polish pads
US6231629B1 (en) 1997-03-07 2001-05-15 3M Innovative Properties Company Abrasive article for providing a clear surface finish on glass
US6194317B1 (en) 1998-04-30 2001-02-27 3M Innovative Properties Company Method of planarizing the upper surface of a semiconductor wafer
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
US5897426A (en) 1998-04-24 1999-04-27 Applied Materials, Inc. Chemical mechanical polishing with multiple polishing pads
US6461226B1 (en) * 1998-11-25 2002-10-08 Promos Technologies, Inc. Chemical mechanical polishing of a metal layer using a composite polishing pad
EP1068928A3 (en) * 1999-02-11 2003-08-13 Applied Materials, Inc. Chemical mechanical polishing processes and components
TW474852B (en) 1999-04-29 2002-02-01 Ebara Corp Method and apparatus for polishing workpieces
US6234875B1 (en) 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
EP1077108B1 (en) 1999-08-18 2006-12-20 Ebara Corporation Polishing method and polishing apparatus
JP2001077060A (ja) 1999-09-08 2001-03-23 Toshiba Corp 半導体装置の製造方法
US6620725B1 (en) * 1999-09-13 2003-09-16 Taiwan Semiconductor Manufacturing Company Reduction of Cu line damage by two-step CMP
US6746311B1 (en) 2000-01-24 2004-06-08 3M Innovative Properties Company Polishing pad with release layer
AU2001251318A1 (en) * 2000-04-07 2001-10-23 Cabot Microelectronics Corporation Integrated chemical-mechanical polishing
JP2001334458A (ja) 2000-05-26 2001-12-04 Ebara Corp ポリッシング方法
JP2001345297A (ja) 2000-05-30 2001-12-14 Hitachi Ltd 半導体集積回路装置の製造方法及び研磨装置
KR100373846B1 (ko) 2000-06-12 2003-02-26 지앤피테크놀로지 주식회사 반도체 및 광학부품용 연마패드 및 그 제조방법
US6383066B1 (en) 2000-06-23 2002-05-07 International Business Machines Corporation Multilayered polishing pad, method for fabricating, and use thereof
JP3797861B2 (ja) 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6645624B2 (en) * 2000-11-10 2003-11-11 3M Innovative Properties Company Composite abrasive particles and method of manufacture
US6612916B2 (en) 2001-01-08 2003-09-02 3M Innovative Properties Company Article suitable for chemical mechanical planarization processes
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6817923B2 (en) 2001-05-24 2004-11-16 Applied Materials, Inc. Chemical mechanical processing system with mobile load cup

Also Published As

Publication number Publication date
KR101062088B1 (ko) 2011-09-02
TWI309190B (en) 2009-05-01
MY136807A (en) 2008-11-28
WO2004062853A1 (en) 2004-07-29
US20040137826A1 (en) 2004-07-15
KR20050092395A (ko) 2005-09-21
JP2006513571A (ja) 2006-04-20
TW200416107A (en) 2004-09-01
CN1735481B (zh) 2010-06-16
US6908366B2 (en) 2005-06-21
CN1735481A (zh) 2006-02-15
EP1583639A1 (en) 2005-10-12

Similar Documents

Publication Publication Date Title
AU2003290921A1 (en) Method of using a soft subpad for chemical mechanical polishing
EP1362670B8 (en) Method and apparatus for chemical mechanical polishing
AU2001279133A1 (en) Method of chemical mechanical polishing
AU2002341583A1 (en) Chemical mechanical polishing tool, apparatus and method
EP1578695B8 (en) Method for removal of biofilm
AU2002250430A1 (en) Rigid polishing pad conditioner for chemical mechanical polishing tool
AU2003278606A1 (en) Polishing apparatus
AU2003270725A1 (en) Polishing media for chemical mechanical planarization (cmp)
AU2003253208A1 (en) A method of polishing a wafer of material
AU2003296430A1 (en) Modular method for chemical mechanical planarization
GB2426535B (en) A method of abandoning a well
AU2003250002A1 (en) Device for cleaning wafers after a cmp process
AU2003302117A1 (en) Method of making a molecule-surface interface
AU2003227414A1 (en) Polishing method
AU2003286421A1 (en) Polishing method
AU2003225601A1 (en) Electrochemical method for producing ferrate (vi) compounds
AU2003298177A1 (en) Abrasive tool for dental use
PL1685926T3 (pl) Sposób szlifowania
AU2003275653A1 (en) Polishing apparatus
SG120107A1 (en) Method of planarizing a surface of a semiconductorwafer
AU2003280059A1 (en) Method for polishing intraocular lenses
AU2003242797A1 (en) A method for logging a user out of a service
AU2003222240A1 (en) Method for making a semiconductor device by variable chemical mechanical polish downforce
AU2003292680A1 (en) Method of selecting novel immunosuppressant
AU2002367888A1 (en) Chemical surface treatment method of piston

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase