AU2003279587A1 - Apparatus for treating surfaces of a substrate with atmospheric pressure plasma - Google Patents
Apparatus for treating surfaces of a substrate with atmospheric pressure plasmaInfo
- Publication number
- AU2003279587A1 AU2003279587A1 AU2003279587A AU2003279587A AU2003279587A1 AU 2003279587 A1 AU2003279587 A1 AU 2003279587A1 AU 2003279587 A AU2003279587 A AU 2003279587A AU 2003279587 A AU2003279587 A AU 2003279587A AU 2003279587 A1 AU2003279587 A1 AU 2003279587A1
- Authority
- AU
- Australia
- Prior art keywords
- substrate
- atmospheric pressure
- pressure plasma
- treating surfaces
- treating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32541—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32816—Pressure
- H01J37/32825—Working under atmospheric pressure or higher
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma Technology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0076071 | 2002-12-02 | ||
KR10-2002-0076071A KR100476136B1 (ko) | 2002-12-02 | 2002-12-02 | 대기압 플라즈마를 이용한 표면처리장치 |
PCT/KR2003/002485 WO2004051702A2 (en) | 2002-12-02 | 2003-11-19 | Apparatus for treating surfaces of a substrate with atmospheric pressure plasma |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003279587A8 AU2003279587A8 (en) | 2004-06-23 |
AU2003279587A1 true AU2003279587A1 (en) | 2004-06-23 |
Family
ID=36165408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003279587A Abandoned AU2003279587A1 (en) | 2002-12-02 | 2003-11-19 | Apparatus for treating surfaces of a substrate with atmospheric pressure plasma |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP4409439B2 (ko) |
KR (1) | KR100476136B1 (ko) |
CN (1) | CN100471993C (ko) |
AU (1) | AU2003279587A1 (ko) |
TW (1) | TWI227951B (ko) |
WO (1) | WO2004051702A2 (ko) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100708320B1 (ko) * | 2004-04-22 | 2007-04-17 | 김기현 | 대기압 마이크로웨이브 플라즈마를 이용한 외장재 부품표면개질 장치 및 방법 |
US8193096B2 (en) | 2004-12-13 | 2012-06-05 | Novellus Systems, Inc. | High dose implantation strip (HDIS) in H2 base chemistry |
DE102005040596B4 (de) * | 2005-06-17 | 2009-02-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Entfernung einer dotierten Oberflächenschicht an Rückseiten von kristallinen Silizium-Solarwafern |
EP1907596A4 (en) * | 2005-07-26 | 2009-09-16 | Psm Inc | PLASMA TREATMENT DEVICE AND METHOD OF INJECTION TYPE |
WO2007017271A2 (de) * | 2005-08-11 | 2007-02-15 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V: | Plasmaerzeugungsvorrichtung und plasmaerzeugungsverfahren |
JP4782529B2 (ja) * | 2005-10-06 | 2011-09-28 | エア・ウォーター株式会社 | 表示装置の製造方法 |
KR100708212B1 (ko) * | 2005-10-07 | 2007-04-16 | 주식회사 피에스엠 | 대기압 플라즈마 샤워유닛 이를 이용한 와이어본딩 장치 및방법 |
KR100720527B1 (ko) * | 2005-12-28 | 2007-05-22 | 동부일렉트로닉스 주식회사 | 시모스 이미지 센서 및 그 제조 방법 |
KR100760651B1 (ko) * | 2006-01-24 | 2007-09-21 | 주식회사 셈테크놀러지 | 처리가스 공급관을 구비하는 기판 표면처리장치 |
KR101293119B1 (ko) * | 2006-11-28 | 2013-08-05 | 엘아이지에이디피 주식회사 | 플라즈마 처리장치와 플라즈마 표면처리방법 |
US8435895B2 (en) | 2007-04-04 | 2013-05-07 | Novellus Systems, Inc. | Methods for stripping photoresist and/or cleaning metal regions |
KR101333878B1 (ko) * | 2007-11-20 | 2013-11-27 | 엘지전자 주식회사 | 대기압 플라즈마를 이용한 표면처리장치 |
KR100975665B1 (ko) * | 2008-01-25 | 2010-08-17 | (주)에스이 플라즈마 | 양산용 상압 플라즈마 발생장치 |
EP2283510B1 (en) | 2008-05-02 | 2013-01-23 | Oerlikon Solar AG, Trübbach | Plasma treatment apparatus and method for plasma-assisted treatment of substrates |
KR101791685B1 (ko) * | 2008-10-14 | 2017-11-20 | 노벨러스 시스템즈, 인코포레이티드 | 수소 이용 화학 반응으로 고용량 주입 스트립(hdis) 방법 및 장치 |
US8454850B2 (en) | 2009-09-02 | 2013-06-04 | Air Products And Chemicals, Inc. | Method for the removal of surface oxides by electron attachment |
US20110143548A1 (en) | 2009-12-11 | 2011-06-16 | David Cheung | Ultra low silicon loss high dose implant strip |
KR101770008B1 (ko) | 2009-12-11 | 2017-08-21 | 노벨러스 시스템즈, 인코포레이티드 | 고주입량 주입 박리 전에 실리콘을 보호하기 위한 개선된 패시베이션 공정 |
WO2012010299A1 (en) * | 2010-07-21 | 2012-01-26 | Dow Corning France | Plasma treatment of substrates |
JP2014514140A (ja) * | 2011-03-11 | 2014-06-19 | パーデュー・リサーチ・ファウンデーション | 制御されたガス組成物を利用したパッケージ内部での殺菌剤の生成 |
US9613825B2 (en) | 2011-08-26 | 2017-04-04 | Novellus Systems, Inc. | Photoresist strip processes for improved device integrity |
US20130087287A1 (en) * | 2011-10-10 | 2013-04-11 | Korea Institute Of Machinery & Materials | Plasma reactor for removal of contaminants |
KR101513423B1 (ko) | 2013-04-04 | 2015-04-21 | 주식회사 테스 | 플라즈마 발생장치 및 이를 포함하는 박막증착용 반응챔버 |
CN104779136A (zh) * | 2014-01-10 | 2015-07-15 | 上海和辉光电有限公司 | 一种去除光致抗蚀剂的方法和设备 |
US9514954B2 (en) | 2014-06-10 | 2016-12-06 | Lam Research Corporation | Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films |
KR101657762B1 (ko) * | 2014-06-23 | 2016-09-19 | 광운대학교 산학협력단 | 전기적 안전성 및 방열 기능을 구비한 플라즈마 제트 장치 |
CN104936371B (zh) * | 2015-06-09 | 2017-07-07 | 北京三十四科技有限公司 | 一种空心电极介质阻挡结构 |
CN105047514B (zh) * | 2015-07-27 | 2017-06-13 | 郑州大学 | 在玻璃表面等离子体刻蚀形成纹理结构的方法 |
KR102201183B1 (ko) * | 2018-12-11 | 2021-01-13 | 한국과학기술원 | 수소 플라즈마를 활용한 이차원 물질의 전기적 특성 회복 방법 및 이의 장치 |
CN109526131A (zh) * | 2018-12-26 | 2019-03-26 | 哈尔滨工业大学 | 一种气体流动环境下利用多地电极强化等离子体放电的方法 |
KR102524433B1 (ko) * | 2019-11-27 | 2023-04-24 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 활성 가스 생성 장치 |
CN112139151A (zh) * | 2020-09-11 | 2020-12-29 | 韩山师范学院 | 一种大型设备表面清理装置 |
JPWO2022114013A1 (ko) * | 2020-11-30 | 2022-06-02 | ||
KR20230069274A (ko) * | 2021-11-11 | 2023-05-19 | 삼성디스플레이 주식회사 | 표시 장치 및 그것의 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02213480A (ja) * | 1989-02-14 | 1990-08-24 | Nippon Light Metal Co Ltd | 高周波プラズマ発生用アルミニウム電極 |
JPH07278850A (ja) * | 1994-04-15 | 1995-10-24 | Fujitsu Ltd | プラズマ処理装置及びプラズマ処理方法 |
DE19521548A1 (de) * | 1995-06-13 | 1996-12-19 | Ipsen Ind Int Gmbh | Verfahren und Vorrichtung zur Steuerung der elektrischen Stromdichte über einem Werkstück bei der Wärmebehandlung im Plasma |
JPH0963132A (ja) * | 1995-08-23 | 1997-03-07 | Seiko Epson Corp | 光学的情報記録媒体用基板の製造方法及びその製造装置 |
JPH09279350A (ja) * | 1996-04-11 | 1997-10-28 | Anelva Corp | 表面処理装置 |
JP4161533B2 (ja) * | 2000-12-28 | 2008-10-08 | 松下電工株式会社 | プラズマ処理方法及びプラズマ処理装置 |
JP2002253952A (ja) * | 2001-02-28 | 2002-09-10 | Okura Ind Co Ltd | プラズマ表面処理方法及び装置 |
-
2002
- 2002-12-02 KR KR10-2002-0076071A patent/KR100476136B1/ko not_active IP Right Cessation
-
2003
- 2003-11-19 AU AU2003279587A patent/AU2003279587A1/en not_active Abandoned
- 2003-11-19 WO PCT/KR2003/002485 patent/WO2004051702A2/en active Application Filing
- 2003-11-19 JP JP2004556947A patent/JP4409439B2/ja not_active Expired - Fee Related
- 2003-11-19 CN CNB2003801046854A patent/CN100471993C/zh not_active Expired - Fee Related
- 2003-11-24 TW TW092132938A patent/TWI227951B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU2003279587A8 (en) | 2004-06-23 |
TW200414577A (en) | 2004-08-01 |
JP4409439B2 (ja) | 2010-02-03 |
WO2004051702A3 (en) | 2004-12-02 |
WO2004051702A2 (en) | 2004-06-17 |
CN100471993C (zh) | 2009-03-25 |
JP2006509331A (ja) | 2006-03-16 |
KR100476136B1 (ko) | 2005-03-10 |
KR20040048272A (ko) | 2004-06-07 |
CN1720349A (zh) | 2006-01-11 |
TWI227951B (en) | 2005-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |