AU2003221363A1 - Plasma processing system and method for interrupting plasma processing - Google Patents

Plasma processing system and method for interrupting plasma processing

Info

Publication number
AU2003221363A1
AU2003221363A1 AU2003221363A AU2003221363A AU2003221363A1 AU 2003221363 A1 AU2003221363 A1 AU 2003221363A1 AU 2003221363 A AU2003221363 A AU 2003221363A AU 2003221363 A AU2003221363 A AU 2003221363A AU 2003221363 A1 AU2003221363 A1 AU 2003221363A1
Authority
AU
Australia
Prior art keywords
plasma processing
interrupting
processing system
interrupting plasma
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003221363A
Other languages
English (en)
Inventor
Hiroshi Azuma
Hiroshi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003221363A1 publication Critical patent/AU2003221363A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/3299—Feedback systems

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
  • Chemical Vapour Deposition (AREA)
AU2003221363A 2002-03-12 2003-03-12 Plasma processing system and method for interrupting plasma processing Abandoned AU2003221363A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002066370A JP4493896B2 (ja) 2002-03-12 2002-03-12 プラズマ処理装置及びプラズマ処理停止方法
JP2002-66370 2002-03-12
PCT/JP2003/002933 WO2003077304A1 (fr) 2002-03-12 2003-03-12 Systeme de traitement par plasma et methode d'interruption du traitement par plasma

Publications (1)

Publication Number Publication Date
AU2003221363A1 true AU2003221363A1 (en) 2003-09-22

Family

ID=27800251

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003221363A Abandoned AU2003221363A1 (en) 2002-03-12 2003-03-12 Plasma processing system and method for interrupting plasma processing

Country Status (3)

Country Link
JP (1) JP4493896B2 (ja)
AU (1) AU2003221363A1 (ja)
WO (1) WO2003077304A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4838525B2 (ja) * 2005-03-31 2011-12-14 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置及び可変整合器におけるインピーダンスのプリセット値を決定するためのプログラム
JP4905304B2 (ja) * 2007-09-10 2012-03-28 東京エレクトロン株式会社 プラズマ処理装置、プラズマ処理方法及び記憶媒体
WO2010018786A1 (ja) * 2008-08-11 2010-02-18 住友精密工業株式会社 プラズマ制御装置
JP6144917B2 (ja) * 2013-01-17 2017-06-07 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理装置の運転方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3122618B2 (ja) * 1996-08-23 2001-01-09 東京エレクトロン株式会社 プラズマ処理装置
JP3350390B2 (ja) * 1997-02-28 2002-11-25 株式会社日立製作所 プラズマ処理方法
US6365060B1 (en) * 1997-08-22 2002-04-02 Tokyo Electron Limited Method for controlling plasma processor
US6184687B1 (en) * 1997-10-20 2001-02-06 Kabushiki Kaisha Toshiba Plasma process end point determination method and apparatus, and plasma evaluation method and apparatus
US6762129B2 (en) * 2000-04-19 2004-07-13 Matsushita Electric Industrial Co., Ltd. Dry etching method, fabrication method for semiconductor device, and dry etching apparatus

Also Published As

Publication number Publication date
JP2003264180A (ja) 2003-09-19
JP4493896B2 (ja) 2010-06-30
WO2003077304A1 (fr) 2003-09-18

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase