AU2003278885A1 - Plasma processing system and method - Google Patents

Plasma processing system and method

Info

Publication number
AU2003278885A1
AU2003278885A1 AU2003278885A AU2003278885A AU2003278885A1 AU 2003278885 A1 AU2003278885 A1 AU 2003278885A1 AU 2003278885 A AU2003278885 A AU 2003278885A AU 2003278885 A AU2003278885 A AU 2003278885A AU 2003278885 A1 AU2003278885 A1 AU 2003278885A1
Authority
AU
Australia
Prior art keywords
processing system
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003278885A
Inventor
Audunn Ludviksson
Andrej S. Mitrovic
Eric J. Strang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003278885A1 publication Critical patent/AU2003278885A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32871—Means for trapping or directing unwanted particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/028—Particle traps
AU2003278885A 2002-09-30 2003-09-25 Plasma processing system and method Abandoned AU2003278885A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US41434902P 2002-09-30 2002-09-30
US60/414,349 2002-09-30
PCT/US2003/030051 WO2004032178A2 (en) 2002-09-30 2003-09-25 Plasma processing system and method

Publications (1)

Publication Number Publication Date
AU2003278885A1 true AU2003278885A1 (en) 2004-04-23

Family

ID=32069728

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003278885A Abandoned AU2003278885A1 (en) 2002-09-30 2003-09-25 Plasma processing system and method

Country Status (5)

Country Link
US (1) US20050189069A1 (en)
JP (1) JP2006501681A (en)
AU (1) AU2003278885A1 (en)
TW (1) TWI238680B (en)
WO (1) WO2004032178A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4389424B2 (en) 2001-12-25 2009-12-24 東京エレクトロン株式会社 To-be-processed object conveyance mechanism and processing system
US7604701B2 (en) 2003-07-14 2009-10-20 Tokyo Electron Limited Method and apparatus for removing external components from a process chamber without compromising process vacuum
JP4972277B2 (en) * 2004-11-10 2012-07-11 東京エレクトロン株式会社 Substrate processing apparatus recovery method, apparatus recovery program, and substrate processing apparatus
FR2887072A1 (en) * 2005-06-08 2006-12-15 Alcatel Sa IMPROVED SPECTOGRAPHIC SYSTEM WITH PLASMA SOURCE
US7537671B2 (en) * 2006-09-29 2009-05-26 Tokyo Electron Limited Self-calibrating optical emission spectroscopy for plasma monitoring
JP5149610B2 (en) * 2007-12-19 2013-02-20 株式会社日立ハイテクノロジーズ Plasma processing equipment
JP2009206344A (en) * 2008-02-28 2009-09-10 Hitachi High-Technologies Corp Apparatus and method for processing plasma
US20110256692A1 (en) * 2010-04-14 2011-10-20 Applied Materials, Inc. Multiple precursor concentric delivery showerhead
US9885493B2 (en) * 2013-07-17 2018-02-06 Lam Research Corporation Air cooled faraday shield and methods for using the same
TWI640039B (en) * 2014-07-03 2018-11-01 美商西凱渥資訊處理科技公司 Endpoint booster systems and methods for optical endpoint detection in wafer etch process
JP6735905B2 (en) * 2017-03-21 2020-08-05 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
US11670490B2 (en) * 2017-09-29 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit fabrication system with adjustable gas injector

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232725A (en) * 1988-03-14 1989-09-18 Oki Electric Ind Co Ltd Dry-etching device
JPH029121A (en) * 1988-06-28 1990-01-12 Tokuda Seisakusho Ltd Plasma etching apparatus
US5290383A (en) * 1991-03-24 1994-03-01 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
KR0152355B1 (en) * 1994-03-24 1998-12-01 가나이 쓰토무 Plasma processing method and its device
KR0159224B1 (en) * 1995-12-13 1999-02-01 김광호 End point detecting device of plasma etching system
JP3329685B2 (en) * 1996-05-16 2002-09-30 株式会社東芝 Measuring device and measuring method
US6071375A (en) * 1997-12-31 2000-06-06 Lam Research Corporation Gas purge protection of sensors and windows in a gas phase processing reactor
US6390019B1 (en) * 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window
JP3709552B2 (en) * 1999-09-03 2005-10-26 株式会社日立製作所 Plasma processing apparatus and plasma processing method

Also Published As

Publication number Publication date
WO2004032178A3 (en) 2004-08-12
WO2004032178A2 (en) 2004-04-15
TWI238680B (en) 2005-08-21
US20050189069A1 (en) 2005-09-01
TW200414832A (en) 2004-08-01
JP2006501681A (en) 2006-01-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase