WO2004032178A3 - Plasma processing system and method - Google Patents

Plasma processing system and method Download PDF

Info

Publication number
WO2004032178A3
WO2004032178A3 PCT/US2003/030051 US0330051W WO2004032178A3 WO 2004032178 A3 WO2004032178 A3 WO 2004032178A3 US 0330051 W US0330051 W US 0330051W WO 2004032178 A3 WO2004032178 A3 WO 2004032178A3
Authority
WO
WIPO (PCT)
Prior art keywords
plasma processing
processing system
diagnostic
plasma
sensor
Prior art date
Application number
PCT/US2003/030051
Other languages
French (fr)
Other versions
WO2004032178A2 (en
Inventor
Audunn Ludviksson
Eric J Strang
Andrej S Mitrovic
Original Assignee
Tokyo Electron Ltd
Audunn Ludviksson
Eric J Strang
Andrej S Mitrovic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Audunn Ludviksson, Eric J Strang, Andrej S Mitrovic filed Critical Tokyo Electron Ltd
Priority to AU2003278885A priority Critical patent/AU2003278885A1/en
Priority to JP2004541630A priority patent/JP2006501681A/en
Publication of WO2004032178A2 publication Critical patent/WO2004032178A2/en
Publication of WO2004032178A3 publication Critical patent/WO2004032178A3/en
Priority to US11/082,246 priority patent/US20050189069A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32871—Means for trapping or directing unwanted particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32972—Spectral analysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/028—Particle traps

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)

Abstract

A plasma processing system and method for operating a diagnostic system in conjunction with a plasma processing system are provided. The diagnostic system is in communication with a plasma processing chamber of the plasma processing system and includes a diagnostic sensor to detect a plasma process condition. The diagnostic system is configured to substantially reduce contamination of the diagnostic sensor. The method includes substantially reducing contamination of the diagnostic sensor and detecting a condition of the plasma process and/or a substrate in the processing chamber.
PCT/US2003/030051 2002-09-30 2003-09-25 Plasma processing system and method WO2004032178A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2003278885A AU2003278885A1 (en) 2002-09-30 2003-09-25 Plasma processing system and method
JP2004541630A JP2006501681A (en) 2002-09-30 2003-09-25 Plasma processing system and method
US11/082,246 US20050189069A1 (en) 2002-09-30 2005-03-17 Plasma processing system and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41434902P 2002-09-30 2002-09-30
US60/414,349 2002-09-30

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/082,246 Continuation US20050189069A1 (en) 2002-09-30 2005-03-17 Plasma processing system and method

Publications (2)

Publication Number Publication Date
WO2004032178A2 WO2004032178A2 (en) 2004-04-15
WO2004032178A3 true WO2004032178A3 (en) 2004-08-12

Family

ID=32069728

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/030051 WO2004032178A2 (en) 2002-09-30 2003-09-25 Plasma processing system and method

Country Status (5)

Country Link
US (1) US20050189069A1 (en)
JP (1) JP2006501681A (en)
AU (1) AU2003278885A1 (en)
TW (1) TWI238680B (en)
WO (1) WO2004032178A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4389424B2 (en) 2001-12-25 2009-12-24 東京エレクトロン株式会社 To-be-processed object conveyance mechanism and processing system
US7604701B2 (en) 2003-07-14 2009-10-20 Tokyo Electron Limited Method and apparatus for removing external components from a process chamber without compromising process vacuum
JP4972277B2 (en) * 2004-11-10 2012-07-11 東京エレクトロン株式会社 Substrate processing apparatus recovery method, apparatus recovery program, and substrate processing apparatus
FR2887072A1 (en) * 2005-06-08 2006-12-15 Alcatel Sa IMPROVED SPECTOGRAPHIC SYSTEM WITH PLASMA SOURCE
US7537671B2 (en) * 2006-09-29 2009-05-26 Tokyo Electron Limited Self-calibrating optical emission spectroscopy for plasma monitoring
JP5149610B2 (en) * 2007-12-19 2013-02-20 株式会社日立ハイテクノロジーズ Plasma processing equipment
JP2009206344A (en) * 2008-02-28 2009-09-10 Hitachi High-Technologies Corp Apparatus and method for processing plasma
US20110256692A1 (en) * 2010-04-14 2011-10-20 Applied Materials, Inc. Multiple precursor concentric delivery showerhead
US9885493B2 (en) * 2013-07-17 2018-02-06 Lam Research Corporation Air cooled faraday shield and methods for using the same
TWI640039B (en) * 2014-07-03 2018-11-01 美商西凱渥資訊處理科技公司 Endpoint booster systems and methods for optical endpoint detection in wafer etch process
KR102489837B1 (en) * 2017-03-21 2023-01-18 도쿄엘렉트론가부시키가이샤 Substrate processing apparatus and substrate processing method
US11670490B2 (en) * 2017-09-29 2023-06-06 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit fabrication system with adjustable gas injector

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232725A (en) * 1988-03-14 1989-09-18 Oki Electric Ind Co Ltd Dry-etching device
JPH029121A (en) * 1988-06-28 1990-01-12 Tokuda Seisakusho Ltd Plasma etching apparatus
US5851842A (en) * 1996-05-16 1998-12-22 Kabushiki Kaisha Toshiba Measurement system and measurement method
JP2001077092A (en) * 1999-09-03 2001-03-23 Hitachi Ltd Plasma processing device
US6344151B1 (en) * 1997-12-31 2002-02-05 Lam Research Corporation Gas purge protection of sensors and windows in a gas phase processing reactor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5290383A (en) * 1991-03-24 1994-03-01 Tokyo Electron Limited Plasma-process system with improved end-point detecting scheme
US5759424A (en) * 1994-03-24 1998-06-02 Hitachi, Ltd. Plasma processing apparatus and processing method
KR0159224B1 (en) * 1995-12-13 1999-02-01 김광호 End point detecting device of plasma etching system
US6390019B1 (en) * 1998-06-11 2002-05-21 Applied Materials, Inc. Chamber having improved process monitoring window

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01232725A (en) * 1988-03-14 1989-09-18 Oki Electric Ind Co Ltd Dry-etching device
JPH029121A (en) * 1988-06-28 1990-01-12 Tokuda Seisakusho Ltd Plasma etching apparatus
US5851842A (en) * 1996-05-16 1998-12-22 Kabushiki Kaisha Toshiba Measurement system and measurement method
US6344151B1 (en) * 1997-12-31 2002-02-05 Lam Research Corporation Gas purge protection of sensors and windows in a gas phase processing reactor
JP2001077092A (en) * 1999-09-03 2001-03-23 Hitachi Ltd Plasma processing device
US6503364B1 (en) * 1999-09-03 2003-01-07 Hitachi, Ltd. Plasma processing apparatus

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0135, no. 61 (E - 859) 13 December 1989 (1989-12-13) *
PATENT ABSTRACTS OF JAPAN vol. 0141, no. 45 (E - 0905) 19 March 1990 (1990-03-19) *

Also Published As

Publication number Publication date
AU2003278885A1 (en) 2004-04-23
WO2004032178A2 (en) 2004-04-15
TW200414832A (en) 2004-08-01
TWI238680B (en) 2005-08-21
US20050189069A1 (en) 2005-09-01
JP2006501681A (en) 2006-01-12

Similar Documents

Publication Publication Date Title
WO2004032178A3 (en) Plasma processing system and method
WO2007038514A3 (en) Apparatus and method for substrate edge etching
WO2003023363A3 (en) Microcantilever apparatus and methods for detection of enzymes
WO2002029384A3 (en) Method and apparatus for embedded substrate and system status monitoring
AU2003280259A1 (en) Method, device and system for detecting the presence of microorganisms
AU2000269056A1 (en) Bacteria and bacteriophage detection using immobilized enzyme substrates
AU2003284186A1 (en) Method and apparatus for detection of drownsiness and for monitoring biological processes
AU2003231167A1 (en) Method ans system for detecting blockage of an automotive side object detection sensor
AU5169699A (en) Method and device for surface processing with plasma at atmospheric pressure
WO2003096382A3 (en) Methods and apparatus for plasma processing control
WO2002066671A3 (en) Improved method for detection of atp
AU2002360853A1 (en) System and method of detecting, neutralizing, and containing suspected contaminated articles
AU2003205076A1 (en) Detection method using dissociated rolling circle amplification
AU2003288897A1 (en) System and process for detecting leaks in sealed articles
AU2003219945A1 (en) Enumeration method of analyte detection
WO2003091732A3 (en) Diffusion-based method and system for detecting and monitoring activity of biologic and chemical species
AU2003245592A1 (en) Transfer chamber for vacuum processing system
AU2003284890A1 (en) Method and apparatus for detecting endpoint during plasma etching of thin films
AU2003302254A1 (en) Analyte detecting article and method
WO2001042473A3 (en) Device and method for accelerated hydration of dry chemical sensors
AU2003268036A1 (en) Atmospheric pressure plasma processing reactor
AU2002338348A1 (en) Method for detecting chronic dementia diseases, and corresponding peptides and detection reagents
WO2002070946A3 (en) In-ground pipeline monitoring
WO2004078021A3 (en) A method for detecting and reducing energy leakage
AU2002357714A1 (en) Sensors and methods of detection for proteinase enzymes

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 11082246

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2004541630

Country of ref document: JP

122 Ep: pct application non-entry in european phase