AU2003213383A1 - Transfer palette for fpc board and method for mounting semiconductor chip on fpc board - Google Patents

Transfer palette for fpc board and method for mounting semiconductor chip on fpc board

Info

Publication number
AU2003213383A1
AU2003213383A1 AU2003213383A AU2003213383A AU2003213383A1 AU 2003213383 A1 AU2003213383 A1 AU 2003213383A1 AU 2003213383 A AU2003213383 A AU 2003213383A AU 2003213383 A AU2003213383 A AU 2003213383A AU 2003213383 A1 AU2003213383 A1 AU 2003213383A1
Authority
AU
Australia
Prior art keywords
fpc board
semiconductor chip
mounting semiconductor
palette
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003213383A
Other languages
English (en)
Inventor
Hirofumi Iida
Takeyuki Tsunekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Plastics Inc
Original Assignee
Mitsubishi Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002072757A external-priority patent/JP4097185B2/ja
Priority claimed from JP2002072756A external-priority patent/JP4097184B2/ja
Priority claimed from JP2002380156A external-priority patent/JP4188076B2/ja
Application filed by Mitsubishi Plastics Inc filed Critical Mitsubishi Plastics Inc
Publication of AU2003213383A1 publication Critical patent/AU2003213383A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Packaging Frangible Articles (AREA)
  • Laminated Bodies (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2003213383A 2002-03-15 2003-03-14 Transfer palette for fpc board and method for mounting semiconductor chip on fpc board Abandoned AU2003213383A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2002-72757 2002-03-15
JP2002-72756 2002-03-15
JP2002072757A JP4097185B2 (ja) 2002-03-15 2002-03-15 Ｆｐｃ基板搬送用パレット及びｆｐｃ基板への半導体チップ実装方法
JP2002072756A JP4097184B2 (ja) 2002-03-15 2002-03-15 Ｆｐｃ基板搬送用パレット及びｆｐｃ基板への半導体チップ実装方法
JP2002-380156 2002-12-27
JP2002380156A JP4188076B2 (ja) 2002-12-27 2002-12-27 薄型基板の仮固定用テープ及びこれを用いた薄型基板実装用パレット
PCT/JP2003/003088 WO2003079744A1 (fr) 2002-03-15 2003-03-14 Palette de transfert pour plaquette fpc, et procede de montage de puce a semi-conducteur sur plaquette fpc

Publications (1)

Publication Number Publication Date
AU2003213383A1 true AU2003213383A1 (en) 2003-09-29

Family

ID=28046086

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003213383A Abandoned AU2003213383A1 (en) 2002-03-15 2003-03-14 Transfer palette for fpc board and method for mounting semiconductor chip on fpc board

Country Status (5)

Country Link
KR (1) KR100694609B1 (ko)
CN (1) CN100349502C (ko)
AU (1) AU2003213383A1 (ko)
TW (1) TW592000B (ko)
WO (1) WO2003079744A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111164396B (zh) * 2017-12-06 2021-11-30 Nok株式会社 温度测量装置和温度测量机构

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6050986A (ja) * 1983-08-30 1985-03-22 ソニー株式会社 フレキシブルプリント回路基板の製造方法
JPS63204696A (ja) * 1986-10-23 1988-08-24 株式会社小糸製作所 可撓性プリント基板への部品ハンダ付け実装法
JP2001210998A (ja) * 2000-01-21 2001-08-03 Denso Corp フレキシブル基板の実装方法とそれに使用する補強板

Also Published As

Publication number Publication date
WO2003079744A1 (fr) 2003-09-25
TW200305356A (en) 2003-10-16
CN100349502C (zh) 2007-11-14
KR100694609B1 (ko) 2007-03-13
TW592000B (en) 2004-06-11
KR20040097170A (ko) 2004-11-17
CN1644005A (zh) 2005-07-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase