AU2002358257A1 - Method and apparatus for applying downward force on wafer during cmp - Google Patents

Method and apparatus for applying downward force on wafer during cmp

Info

Publication number
AU2002358257A1
AU2002358257A1 AU2002358257A AU2002358257A AU2002358257A1 AU 2002358257 A1 AU2002358257 A1 AU 2002358257A1 AU 2002358257 A AU2002358257 A AU 2002358257A AU 2002358257 A AU2002358257 A AU 2002358257A AU 2002358257 A1 AU2002358257 A1 AU 2002358257A1
Authority
AU
Australia
Prior art keywords
downward force
wafer during
during cmp
applying downward
cmp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002358257A
Other languages
English (en)
Other versions
AU2002358257A8 (en
Inventor
Anthony De La Llera
Tony Luong
Tuan A. Nguyen
Xuyen Pham
Andrew Siu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2002358257A8 publication Critical patent/AU2002358257A8/xx
Publication of AU2002358257A1 publication Critical patent/AU2002358257A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H10P52/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
AU2002358257A 2001-12-27 2002-12-20 Method and apparatus for applying downward force on wafer during cmp Abandoned AU2002358257A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/033,671 2001-12-27
US10/033,671 US6712670B2 (en) 2001-12-27 2001-12-27 Method and apparatus for applying downward force on wafer during CMP
PCT/US2002/040942 WO2003057404A2 (en) 2001-12-27 2002-12-20 Method and apparatus for applying downward force on wafer during cmp

Publications (2)

Publication Number Publication Date
AU2002358257A8 AU2002358257A8 (en) 2003-07-24
AU2002358257A1 true AU2002358257A1 (en) 2003-07-24

Family

ID=21871758

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002358257A Abandoned AU2002358257A1 (en) 2001-12-27 2002-12-20 Method and apparatus for applying downward force on wafer during cmp

Country Status (8)

Country Link
US (2) US6712670B2 (enExample)
EP (1) EP1467839A4 (enExample)
JP (1) JP2005514780A (enExample)
KR (1) KR20040066195A (enExample)
CN (1) CN1607994A (enExample)
AU (1) AU2002358257A1 (enExample)
TW (1) TWI226083B (enExample)
WO (1) WO2003057404A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2869604B1 (fr) * 2004-04-28 2006-06-23 Saint Gobain Activation d'une surface de verre
EP1628202A1 (de) * 2004-08-19 2006-02-22 Ubs Ag Daten-Ausgabe-System und Daten-Ausgabe-Verfahren mit Daten-Ausgabe-Überwachung
KR100796466B1 (ko) * 2006-08-31 2008-01-21 인하대학교 산학협력단 반도체 웨이퍼 폴리싱 장치의 유동헤드장치
JP5365243B2 (ja) * 2009-02-19 2013-12-11 凸版印刷株式会社 ベルト搬送研磨機
FR2980386B1 (fr) * 2011-09-27 2014-09-12 Visioptimum Internat Dispositif de polissage de lentilles optiques
JP5973883B2 (ja) * 2012-11-15 2016-08-23 株式会社荏原製作所 基板保持装置および研磨装置
US9662761B2 (en) * 2013-12-02 2017-05-30 Ebara Corporation Polishing apparatus
US10350722B2 (en) 2016-02-05 2019-07-16 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
US10363647B2 (en) 2016-02-05 2019-07-30 Toshiba Kikai Kabushiki Kaisha Grinding tool
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
CN117381656B (zh) * 2023-11-27 2025-08-26 北京晶亦精微科技股份有限公司 一种晶圆加载状态检测装置及抛光装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
US5795215A (en) * 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
GB9512262D0 (en) * 1995-06-16 1995-08-16 Bingham Richard G Tool for computer-controlled machine for optical polishing and figuring
US5653622A (en) * 1995-07-25 1997-08-05 Vlsi Technology, Inc. Chemical mechanical polishing system and method for optimization and control of film removal uniformity
DE29513946U1 (de) * 1995-08-30 1997-01-09 Weber, Georg, 96317 Kronach Vorrichtung zum Andrücken eines umlaufenden Schleifbandes
US5762536A (en) * 1996-04-26 1998-06-09 Lam Research Corporation Sensors for a linear polisher
JPH1071560A (ja) * 1996-08-27 1998-03-17 Speedfam Co Ltd ウエハ加圧装置
US5738568A (en) * 1996-10-04 1998-04-14 International Business Machines Corporation Flexible tilted wafer carrier
JP3763975B2 (ja) * 1998-07-21 2006-04-05 株式会社荏原製作所 トップリング制御装置及びポリッシング装置
US6352466B1 (en) * 1998-08-31 2002-03-05 Micron Technology, Inc. Method and apparatus for wireless transfer of chemical-mechanical planarization measurements
US6241593B1 (en) * 1999-07-09 2001-06-05 Applied Materials, Inc. Carrier head with pressurizable bladder
US6439978B1 (en) * 2000-09-07 2002-08-27 Oliver Design, Inc. Substrate polishing system using roll-to-roll fixed abrasive

Also Published As

Publication number Publication date
EP1467839A4 (en) 2008-06-18
KR20040066195A (ko) 2004-07-23
AU2002358257A8 (en) 2003-07-24
TW200305211A (en) 2003-10-16
US20030139115A1 (en) 2003-07-24
JP2005514780A (ja) 2005-05-19
EP1467839A2 (en) 2004-10-20
US6712670B2 (en) 2004-03-30
US20040161939A1 (en) 2004-08-19
CN1607994A (zh) 2005-04-20
TWI226083B (en) 2005-01-01
WO2003057404A3 (en) 2003-12-04
WO2003057404A2 (en) 2003-07-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase