AU2002346599A1 - Process for optically erasing charge buildup during fabrication of an integrated circuit - Google Patents

Process for optically erasing charge buildup during fabrication of an integrated circuit

Info

Publication number
AU2002346599A1
AU2002346599A1 AU2002346599A AU2002346599A AU2002346599A1 AU 2002346599 A1 AU2002346599 A1 AU 2002346599A1 AU 2002346599 A AU2002346599 A AU 2002346599A AU 2002346599 A AU2002346599 A AU 2002346599A AU 2002346599 A1 AU2002346599 A1 AU 2002346599A1
Authority
AU
Australia
Prior art keywords
integrated circuit
during fabrication
charge buildup
buildup during
erasing charge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002346599A
Other languages
English (en)
Inventor
Ivan Berry
Alan Janos
Anthony Sinnott
Kevin Stewart
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axcelis Technologies Inc
Original Assignee
Axcelis Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axcelis Technologies Inc filed Critical Axcelis Technologies Inc
Publication of AU2002346599A1 publication Critical patent/AU2002346599A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008—Making conductor-insulator-semiconductor electrodes
    • H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
    • H01L21/28158—Making the insulator
    • H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
    • H01L21/28176—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation with a treatment, e.g. annealing, after the formation of the definitive gate conductor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0411—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having floating gates

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Solid State Image Pick-Up Elements (AREA)
AU2002346599A 2001-11-30 2002-12-02 Process for optically erasing charge buildup during fabrication of an integrated circuit Abandoned AU2002346599A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/000,772 US6605484B2 (en) 2001-11-30 2001-11-30 Process for optically erasing charge buildup during fabrication of an integrated circuit
US10/000,772 2001-11-30
PCT/US2002/038310 WO2003049182A2 (en) 2001-11-30 2002-12-02 Process for optically erasing charge buildup during fabrication of an integrated circuit

Publications (1)

Publication Number Publication Date
AU2002346599A1 true AU2002346599A1 (en) 2003-06-17

Family

ID=21692962

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002346599A Abandoned AU2002346599A1 (en) 2001-11-30 2002-12-02 Process for optically erasing charge buildup during fabrication of an integrated circuit

Country Status (7)

Country Link
US (2) US6605484B2 (enExample)
EP (1) EP1451868A2 (enExample)
JP (1) JP4784851B2 (enExample)
KR (1) KR20040068925A (enExample)
CN (2) CN100565807C (enExample)
AU (1) AU2002346599A1 (enExample)
WO (1) WO2003049182A2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6787484B2 (en) * 2002-12-17 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd Method of reducing visible light induced arcing in a semiconductor wafer manufacturing process
US20050250346A1 (en) * 2004-05-06 2005-11-10 Applied Materials, Inc. Process and apparatus for post deposition treatment of low k dielectric materials
US20060249175A1 (en) * 2005-05-09 2006-11-09 Applied Materials, Inc. High efficiency UV curing system
US20060251827A1 (en) * 2005-05-09 2006-11-09 Applied Materials, Inc. Tandem uv chamber for curing dielectric materials
CN103364706B (zh) * 2013-07-26 2017-03-08 上海华虹宏力半导体制造有限公司 验收测试装置及一次性可编程器件的验收测试方法
CN103820772B (zh) * 2014-02-12 2016-07-06 清华大学 去除pecvd装置的电荷的系统及其控制方法
US9576801B2 (en) * 2014-12-01 2017-02-21 Qualcomm Incorporated High dielectric constant/metal gate (HK/MG) compatible floating gate (FG)/ferroelectric dipole non-volatile memory

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US541475A (en) * 1895-06-25 Crank-planer
US4179627A (en) * 1977-06-10 1979-12-18 Tom Swift Enterprises, Inc. Electrical apparatus
WO1981003507A1 (fr) * 1980-05-30 1981-12-10 Gao Ges Automation Org Papier-valeur avec marque d'authenticite en matiere luminescente
US4665426A (en) * 1985-02-01 1987-05-12 Advanced Micro Devices, Inc. EPROM with ultraviolet radiation transparent silicon nitride passivation layer
US4885047A (en) 1986-08-11 1989-12-05 Fusion Systems Corporation Apparatus for photoresist stripping
JPH01310577A (ja) 1988-06-08 1989-12-14 Seiko Instr Inc 半導体不揮発性メモリ
JPH04152519A (ja) * 1990-10-16 1992-05-26 Oki Electric Ind Co Ltd 半導体装置の製造方法
US5170091A (en) * 1990-12-10 1992-12-08 Ultraviolet Energy Generators, Inc. Linear ultraviolet flash lamp with self-replenishing cathode
US5117312A (en) * 1991-01-04 1992-05-26 Fusion Systems Corporation Apparatus including concave reflectors and a line of optical fibers
EP0942457A3 (en) * 1992-09-30 2001-04-04 Fusion Lighting, Inc. Electrodeless lamp
US5712715A (en) * 1992-12-23 1998-01-27 Lucent Technologies Inc. Optical transmission system with spatially-varying Bragg reflector
US5541475A (en) 1993-04-16 1996-07-30 Fusion Lighting, Inc. Electrodeless lamp with profiled wall thickness
FR2707796B1 (fr) * 1993-06-30 1995-10-06 Sgs Thomson Microelectronics Procédé de gravure sous plasma d'une couche conductrice sur une tranche de silicium avec interposition d'une couche isolante mince.
US5530247A (en) * 1994-08-05 1996-06-25 Trw Inc. Millimeter wave imager device using pyroelectric effect
US5587330A (en) * 1994-10-20 1996-12-24 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US5633424A (en) * 1994-12-29 1997-05-27 Graves; Clinton G. Device and methods for plasma sterilization
US5656521A (en) * 1995-01-12 1997-08-12 Advanced Micro Devices, Inc. Method of erasing UPROM transistors
US5648669A (en) * 1995-05-26 1997-07-15 Cypress Semiconductor High speed flash memory cell structure and method
JP3502498B2 (ja) * 1996-01-22 2004-03-02 大日本スクリーン製造株式会社 基板処理装置
JP3872535B2 (ja) * 1996-03-14 2007-01-24 株式会社オーク製作所 ワークの電荷の消去中和装置
EP0848422B1 (en) * 1996-12-16 2002-03-27 STMicroelectronics S.r.l. Process for the manufacture of floating-gate non-volatile memories
US6081334A (en) * 1998-04-17 2000-06-27 Applied Materials, Inc Endpoint detection for semiconductor processes
US6369420B1 (en) * 1998-07-02 2002-04-09 Silicon Storage Technology, Inc. Method of self-aligning a floating gate to a control gate and to an isolation in an electrically erasable and programmable memory cell, and a cell made thereby
US6091652A (en) * 1998-12-11 2000-07-18 Lsi Logic Corporation Testing semiconductor devices for data retention
US6207989B1 (en) 1999-03-16 2001-03-27 Vantis Corporation Non-volatile memory device having a high-reliability composite insulation layer
US6350651B1 (en) * 1999-06-10 2002-02-26 Intel Corporation Method for making flash memory with UV opaque passivation layer
US6350699B1 (en) * 2000-05-30 2002-02-26 Sharp Laboratories Of America, Inc. Method for anisotropic plasma etching using non-chlorofluorocarbon, fluorine-based chemistry

Also Published As

Publication number Publication date
US6605484B2 (en) 2003-08-12
JP4784851B2 (ja) 2011-10-05
EP1451868A2 (en) 2004-09-01
CN100336205C (zh) 2007-09-05
WO2003049182A3 (en) 2003-09-12
CN1596467A (zh) 2005-03-16
WO2003049182A2 (en) 2003-06-12
CN101145520A (zh) 2008-03-19
US6803319B2 (en) 2004-10-12
JP2005512324A (ja) 2005-04-28
US20030104644A1 (en) 2003-06-05
KR20040068925A (ko) 2004-08-02
US20030180976A1 (en) 2003-09-25
CN100565807C (zh) 2009-12-02

Similar Documents

Publication Publication Date Title
AU2002339981A1 (en) Method for creating adhesion during fabrication of electronic devices
GB2355312B (en) Method of fabricating an integrated optical component
AU5543600A (en) Method of modifying an integrated circuit
AU2003247695A1 (en) Silicon-on-insulator wafer for integrated circuit
AU2003207439A1 (en) High density integrated optical chip
AU2002247383A1 (en) In-street integrated circuit wafer via
AU1784401A (en) Method for making an integrated optical circuit
AU2001267853A1 (en) Method of manufacturing integrated circuit
AU2002241860A1 (en) Method for manufacturing an optical head
AU4481100A (en) Treatment method of cleaved film for the manufacture of substrates
AU2002211793A1 (en) Method for optimizing the characteristics of integrated circuits components fromcircuit speficications
AU1986800A (en) Method for protecting an integrated circuit chip
AU2002334044A1 (en) Method for making an article comprising at least a silicon chip
AU7104900A (en) Method for integration of integrated circuit devices
AU4937100A (en) Production of an integrated optical device
AU2002346599A1 (en) Process for optically erasing charge buildup during fabrication of an integrated circuit
AU2001275454A1 (en) Method for identifying the cause of yield loss in integrated circuit manufacture
AU2001243161A1 (en) Method for fabrication of vertically coupled integrated optical structures
AU2003252099A1 (en) Method of making an integrated circuit using a photomask having a dual antireflective coating
AU2600500A (en) Apparatus for insertion of an intraocular lens
AU2002361357A1 (en) Method for monosulphonylation of an aminobenzofuran compound
AU2002246741A1 (en) Integrated circuit for optical clock signal distribution
AU2001295000A1 (en) Method of detecting residue on a polished wafer
AU2003280059A1 (en) Method for polishing intraocular lenses
AU2001272413A1 (en) Process for manufacturing an oxirane

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase