AU2001275454A1 - Method for identifying the cause of yield loss in integrated circuit manufacture - Google Patents

Method for identifying the cause of yield loss in integrated circuit manufacture

Info

Publication number
AU2001275454A1
AU2001275454A1 AU2001275454A AU7545401A AU2001275454A1 AU 2001275454 A1 AU2001275454 A1 AU 2001275454A1 AU 2001275454 A AU2001275454 A AU 2001275454A AU 7545401 A AU7545401 A AU 7545401A AU 2001275454 A1 AU2001275454 A1 AU 2001275454A1
Authority
AU
Australia
Prior art keywords
identifying
cause
integrated circuit
yield loss
circuit manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001275454A
Inventor
Julie Segal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEURISTICS PHYSICS LABORATORIES
Original Assignee
HEURISTICS PHYSICS LAB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEURISTICS PHYSICS LAB filed Critical HEURISTICS PHYSICS LAB
Publication of AU2001275454A1 publication Critical patent/AU2001275454A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU2001275454A 2000-06-09 2001-06-08 Method for identifying the cause of yield loss in integrated circuit manufacture Abandoned AU2001275454A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/591,603 US6701477B1 (en) 2000-06-09 2000-06-09 Method for identifying the cause of yield loss in integrated circuit manufacture
US09591603 2000-06-09
PCT/US2001/018732 WO2001096835A2 (en) 2000-06-09 2001-06-08 Method for identifying the cause of yield loss in integrated circuit manufacture

Publications (1)

Publication Number Publication Date
AU2001275454A1 true AU2001275454A1 (en) 2001-12-24

Family

ID=24367119

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001275454A Abandoned AU2001275454A1 (en) 2000-06-09 2001-06-08 Method for identifying the cause of yield loss in integrated circuit manufacture

Country Status (3)

Country Link
US (1) US6701477B1 (en)
AU (1) AU2001275454A1 (en)
WO (1) WO2001096835A2 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3870052B2 (en) * 2001-09-20 2007-01-17 株式会社日立製作所 Semiconductor device manufacturing method and defect inspection data processing method
US7114143B2 (en) * 2003-10-29 2006-09-26 Lsi Logic Corporation Process yield learning
TW200622275A (en) * 2004-09-06 2006-07-01 Mentor Graphics Corp Integrated circuit yield and quality analysis methods and systems
US7310788B2 (en) * 2005-02-24 2007-12-18 International Business Machines Corporation Sample probability of fault function determination using critical defect size map
US7218984B1 (en) 2005-12-16 2007-05-15 International Business Machines Corporation Dynamically determining yield expectation
US7596736B2 (en) * 2006-03-24 2009-09-29 International Business Machines Corporation Iterative process for identifying systematics in data
US7954018B2 (en) * 2007-02-02 2011-05-31 Rudolph Technologies, Inc Analysis techniques for multi-level memory
US7853848B2 (en) * 2007-10-22 2010-12-14 International Business Machines Corporation System and method for signature-based systematic condition detection and analysis
US7890900B2 (en) * 2008-08-19 2011-02-15 Synopsys, Inc. Various methods and apparatuses for effective yield enhancement of good chip dies having memories per wafer
JP5342199B2 (en) * 2008-09-19 2013-11-13 ルネサスエレクトロニクス株式会社 Failure rate prediction method, failure rate prediction program, semiconductor manufacturing device management method, and semiconductor device manufacturing method
JP2010192026A (en) * 2009-02-17 2010-09-02 Toshiba Corp Failure analysis method, failure analysis system, and memory macro system
US8799732B2 (en) * 2012-02-09 2014-08-05 International Business Machines Corporation Methodology for correlated memory fail estimations
US9411007B2 (en) * 2012-10-29 2016-08-09 The Regents Of The University Of Michigan System and method for statistical post-silicon validation

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5475695A (en) 1993-03-19 1995-12-12 Semiconductor Diagnosis & Test Corporation Automatic failure analysis system
US5497381A (en) * 1993-10-15 1996-03-05 Analog Devices, Inc. Bitstream defect analysis method for integrated circuits
US5515384A (en) * 1994-03-01 1996-05-07 International Business Machines Corporation Method and system of fault diagnosis of application specific electronic circuits
US5991699A (en) * 1995-05-04 1999-11-23 Kla Instruments Corporation Detecting groups of defects in semiconductor feature space
US5539752A (en) 1995-06-30 1996-07-23 Advanced Micro Devices, Inc. Method and system for automated analysis of semiconductor defect data
US5777901A (en) 1995-09-29 1998-07-07 Advanced Micro Devices, Inc. Method and system for automated die yield prediction in semiconductor manufacturing
US5822218A (en) 1996-08-27 1998-10-13 Clemson University Systems, methods and computer program products for prediction of defect-related failures in integrated circuits
US5982920A (en) * 1997-01-08 1999-11-09 Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory Automated defect spatial signature analysis for semiconductor manufacturing process
US6408219B2 (en) * 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
US6507933B1 (en) * 1999-07-12 2003-01-14 Advanced Micro Devices, Inc. Automatic defect source classification
US6507800B1 (en) * 2000-03-13 2003-01-14 Promos Technologies, Inc. Method for testing semiconductor wafers

Also Published As

Publication number Publication date
WO2001096835A3 (en) 2002-05-30
WO2001096835A8 (en) 2002-02-21
WO2001096835A2 (en) 2001-12-20
US6701477B1 (en) 2004-03-02

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