AU2001280821A1 - Method for fabricating electronics - Google Patents

Method for fabricating electronics

Info

Publication number
AU2001280821A1
AU2001280821A1 AU2001280821A AU8082101A AU2001280821A1 AU 2001280821 A1 AU2001280821 A1 AU 2001280821A1 AU 2001280821 A AU2001280821 A AU 2001280821A AU 8082101 A AU8082101 A AU 8082101A AU 2001280821 A1 AU2001280821 A1 AU 2001280821A1
Authority
AU
Australia
Prior art keywords
fabricating electronics
fabricating
electronics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001280821A
Inventor
Keyvan Sayyah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HRL Laboratories LLC
Original Assignee
HRL Laboratories LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HRL Laboratories LLC filed Critical HRL Laboratories LLC
Publication of AU2001280821A1 publication Critical patent/AU2001280821A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95091—Under pressure
    • H01L2224/95092—Atmospheric pressure, e.g. dry self-assembly
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/9512—Aligning the plurality of semiconductor or solid-state bodies
    • H01L2224/95121—Active alignment, i.e. by apparatus steering
    • H01L2224/95122—Active alignment, i.e. by apparatus steering by applying vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
AU2001280821A 2000-11-29 2001-07-26 Method for fabricating electronics Abandoned AU2001280821A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/728,639 US6291266B1 (en) 2000-11-29 2000-11-29 Method for fabricating large area flexible electronics
US09/728,639 2000-11-29
PCT/US2001/023584 WO2002045159A2 (en) 2000-11-29 2001-07-26 Method for fabricating electronics

Publications (1)

Publication Number Publication Date
AU2001280821A1 true AU2001280821A1 (en) 2002-06-11

Family

ID=24927666

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001280821A Abandoned AU2001280821A1 (en) 2000-11-29 2001-07-26 Method for fabricating electronics

Country Status (4)

Country Link
US (1) US6291266B1 (en)
AU (1) AU2001280821A1 (en)
TW (1) TW503529B (en)
WO (1) WO2002045159A2 (en)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794221B2 (en) * 2000-11-29 2004-09-21 Hrl Laboratories, Llc Method of placing elements into receptors in a substrate
US7368191B2 (en) 2001-07-25 2008-05-06 Biosource, Inc. Electrode array for use in electrochemical cells
US6791742B2 (en) * 2001-07-30 2004-09-14 Glimmerglass Networks, Inc. MEMS structure with raised electrodes
US6693735B1 (en) * 2001-07-30 2004-02-17 Glimmerglass Networks, Inc. MEMS structure with surface potential control
US6863219B1 (en) * 2001-08-17 2005-03-08 Alien Technology Corporation Apparatuses and methods for forming electronic assemblies
US7192998B2 (en) * 2001-12-21 2007-03-20 Dow Global Technologies Inc. Additive for rendering inert acidic or halogen-containing compounds contained in olefin polymers
US20050011409A1 (en) * 2001-12-25 2005-01-20 Yasuhide Isobe Inorganic oxide
JP2003197881A (en) * 2001-12-27 2003-07-11 Seiko Epson Corp Semiconductor integrated circuit, manufacturing method for the semiconductor integrated circuit, semiconductor element member, electrooptic device, and electronic equipment
EP1464080B1 (en) * 2002-01-18 2007-09-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for production of a bonding device
US7259106B2 (en) * 2004-09-10 2007-08-21 Versatilis Llc Method of making a microelectronic and/or optoelectronic circuitry sheet
AU2005322072A1 (en) * 2004-12-27 2006-07-06 Quantum Paper, Inc. Addressable and printable emissive display
US20060202944A1 (en) * 2005-03-11 2006-09-14 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Elements for self assembling displays
US8390537B2 (en) * 2005-03-11 2013-03-05 The Invention Science Fund I, Llc Method of assembling displays on substrates
US7662008B2 (en) * 2005-04-04 2010-02-16 Searete Llc Method of assembling displays on substrates
US8711063B2 (en) * 2005-03-11 2014-04-29 The Invention Science Fund I, Llc Self assembly of elements for displays
US7977130B2 (en) 2006-08-03 2011-07-12 The Invention Science Fund I, Llc Method of assembling displays on substrates
US8334819B2 (en) * 2005-03-11 2012-12-18 The Invention Science Fund I, Llc Superimposed displays
US9153163B2 (en) 2005-03-11 2015-10-06 The Invention Science Fund I, Llc Self assembly of elements for displays
US8300007B2 (en) * 2005-03-11 2012-10-30 The Invention Science Fund I, Llc Self assembling display with substrate
US7990349B2 (en) * 2005-04-22 2011-08-02 The Invention Science Fund I, Llc Superimposed displays
US8860635B2 (en) * 2005-04-04 2014-10-14 The Invention Science Fund I, Llc Self assembling display with substrate
WO2007037381A1 (en) * 2005-09-29 2007-04-05 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic circuit constituting member and relevant mounting apparatus
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8456393B2 (en) 2007-05-31 2013-06-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8889216B2 (en) * 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
DE102009008772A1 (en) * 2009-02-13 2011-01-27 Hochschule Furtwangen University Self-adjusting bonding method for positioning, fixing, contacting of chip on silicon surface, involves nano-structuring surface area of chip or chip carrier, where surface areas of needle are auxiliary nano-porous

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5355577A (en) * 1992-06-23 1994-10-18 Cohn Michael B Method and apparatus for the assembly of microfabricated devices
US5545291A (en) * 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5904545A (en) * 1993-12-17 1999-05-18 The Regents Of The University Of California Apparatus for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US6291896B1 (en) * 1999-02-16 2001-09-18 Alien Technology Corporation Functionally symmetric integrated circuit die

Also Published As

Publication number Publication date
TW503529B (en) 2002-09-21
US6291266B1 (en) 2001-09-18
WO2002045159A2 (en) 2002-06-06
WO2002045159A3 (en) 2003-04-10

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