AU2001284341A1 - Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire - Google Patents

Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire

Info

Publication number
AU2001284341A1
AU2001284341A1 AU2001284341A AU8434101A AU2001284341A1 AU 2001284341 A1 AU2001284341 A1 AU 2001284341A1 AU 2001284341 A AU2001284341 A AU 2001284341A AU 8434101 A AU8434101 A AU 8434101A AU 2001284341 A1 AU2001284341 A1 AU 2001284341A1
Authority
AU
Australia
Prior art keywords
wire
workpiece
sawn
producing
relative reciprocating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284341A
Other languages
English (en)
Inventor
Charles Hauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Switzerland SARL
Original Assignee
HCT Shaping Systems SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HCT Shaping Systems SA filed Critical HCT Shaping Systems SA
Publication of AU2001284341A1 publication Critical patent/AU2001284341A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0046—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for feeding, conveying or clamping work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/005—Devices for the automatic drive or the program control of the machines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/869—Means to drive or to guide tool
    • Y10T83/8798—With simple oscillating motion only
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Sawing (AREA)
AU2001284341A 2000-09-28 2001-09-07 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire Abandoned AU2001284341A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH01896/00A CH697024A5 (fr) 2000-09-28 2000-09-28 Dispositif de sciage par fil.
CH1896/00 2000-09-28
PCT/IB2001/001624 WO2002026431A1 (fr) 2000-09-28 2001-09-07 Dispositif de sciage par fil avec des moyens pour effectuer un mouvement d'oscillatin relatif entre la piece a scier et le fil

Publications (1)

Publication Number Publication Date
AU2001284341A1 true AU2001284341A1 (en) 2002-04-08

Family

ID=4566706

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284341A Abandoned AU2001284341A1 (en) 2000-09-28 2001-09-07 Wire saw with means for producing a relative reciprocating motion between the workpiece to be sawn and the wire

Country Status (8)

Country Link
US (1) US6886550B2 (fr)
EP (1) EP1320438B1 (fr)
JP (1) JP2004509776A (fr)
AT (1) ATE285866T1 (fr)
AU (1) AU2001284341A1 (fr)
CH (1) CH697024A5 (fr)
DE (1) DE60108140T2 (fr)
WO (1) WO2002026431A1 (fr)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH696431A5 (fr) * 2003-04-01 2007-06-15 Hct Shaping Systems Sa Procédé et dispositif de sciage par fil.
GB2414204B (en) * 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
DE102005031200B4 (de) * 2004-07-02 2009-08-20 Schott Ag Verfahren und Vorrichtung zum Herstellen eines kristallachsenorientierten Saphir-Substrats, Saphir-Substrat und Halbleitersubstrat
EP1819473A1 (fr) * 2004-12-10 2007-08-22 Freiberger Compound Materials GmbH Support de piece a usiner et procede pour scier au fil
DE102005026547B4 (de) * 2005-05-31 2007-07-12 Technische Universität Dresden Vorrichtung zum Drahttrennläppen
JP2008229752A (ja) * 2007-03-19 2008-10-02 Sumitomo Metal Mining Co Ltd ワイヤソーによる切断方法
DE102007028439A1 (de) 2007-06-18 2008-12-24 Schott Ag Verfahren zum Abtrennen einer Mehrzahl von Halbleiterscheiben von einem Halbleitermaterial-Rohblock
JP5151851B2 (ja) * 2008-09-19 2013-02-27 信越半導体株式会社 バンドソー切断装置及びインゴットの切断方法
CN102049820A (zh) * 2010-12-15 2011-05-11 湖南宇晶机器实业有限公司 多线切割机工作台
CN102189612A (zh) * 2011-04-25 2011-09-21 唐山晶玉科技有限公司 一种蓝宝石专用多线切割机
JP2013008769A (ja) * 2011-06-23 2013-01-10 Sumitomo Electric Ind Ltd 炭化珪素基板の製造方法
DE102011084454B3 (de) * 2011-10-13 2013-01-17 Solarworld Innovations Gmbh Drahtführungsrolle
CN102581971B (zh) * 2011-11-02 2014-10-08 江苏吉星新材料有限公司 一种蓝宝石切片电动摆动机构
US9156187B2 (en) * 2011-12-29 2015-10-13 Sunedison Semiconductor Ltd. Methods for mounting an ingot on a wire saw
EP2610026B1 (fr) 2011-12-30 2015-11-18 Agie Charmilles SA Procédé de coupe à fil
CN102626805A (zh) * 2012-02-14 2012-08-08 上海五同机械制造有限公司 一种线切割机工作台
EP2633937A1 (fr) 2012-02-28 2013-09-04 Meyer Burger AG Dispositif de maintien
EP2633936A1 (fr) 2012-02-28 2013-09-04 Meyer Burger AG Dispositif de maintien
CN102886831B (zh) * 2012-09-21 2015-04-22 中国电子科技集团公司第四十八研究所 一种蓝宝石多线切割装置
CN102873776A (zh) * 2012-09-26 2013-01-16 上海汉虹精密机械有限公司 带有摇动机构的多线切割装置
MY183892A (en) * 2012-10-15 2021-03-17 Toyo Advanced Tech Co Ltd Wire saw apparatus and cut-machining method
KR101449572B1 (ko) * 2013-03-25 2014-10-13 한국생산기술연구원 리프트-업 스윙을 구현하는 와이어 쏘
US20140318523A1 (en) * 2013-04-29 2014-10-30 Corning Incorporated Method of making a glass forming apparatus with reduced weight
JP6168689B2 (ja) * 2013-07-12 2017-07-26 株式会社タカトリ ワイヤソー及び切断加工方法
JP2015147293A (ja) * 2014-01-09 2015-08-20 株式会社コベルコ科研 被加工物の切断方法
US9776264B2 (en) 2014-03-05 2017-10-03 Mike Shaw Reciprocating cutter
EP2954965A1 (fr) * 2014-06-11 2015-12-16 Applied Materials Switzerland Sàrl Procédé et système de sciage d'un lingot
DE102014224902B4 (de) * 2014-12-04 2018-12-20 Technische Universität Bergakademie Freiberg Verfahren und Vorrichtung zum Trennen von Werkstücken aus sprödharten Werkstoffen
JP6272801B2 (ja) * 2015-07-27 2018-01-31 信越半導体株式会社 ワークホルダー及びワークの切断方法
CN107009531A (zh) * 2017-06-06 2017-08-04 山东大学 一种提高线锯切割加工表面质量的工件加载装置
JP2020146785A (ja) * 2019-03-12 2020-09-17 トーヨーエイテック株式会社 ワイヤソー装置及びワークの切断加工方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0635107B2 (ja) 1987-12-26 1994-05-11 株式会社タカトリハイテック ワイヤソー
CH690845A5 (de) * 1994-05-19 2001-02-15 Tokyo Seimitsu Co Ltd Verfahren zum Positionieren eines Werkstücks und Vorrichtung hierfür.
JP3539773B2 (ja) * 1994-09-19 2004-07-07 信越化学工業株式会社 ワイヤソーおよびワイヤソーによる切断方法
JPH0985736A (ja) * 1995-09-22 1997-03-31 Toray Eng Co Ltd ワイヤ式切断装置
CH690907A5 (fr) * 1996-05-23 2001-02-28 Hct Shaping Systems Sa Dispositif de sciage par fil
WO1998000273A1 (fr) 1996-06-28 1998-01-08 Crystal Systems, Inc. Procede et appareil de production de profil de coupe radial
US6371101B1 (en) * 1997-05-07 2002-04-16 Hct Shaping Systems Sa Slicing device using yarn for cutting thin wafers using the angular intersection of at least two yarn layers
EP1009569A2 (fr) * 1997-07-07 2000-06-21 Laser Technology West Limited Appareil et procede de decoupe en tranches d'une piece a travailler au moyen d'un fil diamante
JPH11188602A (ja) * 1997-12-22 1999-07-13 Tokyo Seimitsu Co Ltd 固定砥粒付エンドレスワイヤソー
JPH11309660A (ja) * 1998-04-30 1999-11-09 Shin Etsu Chem Co Ltd ワイヤー式切断機及びワークを切断する方法
DE19851070A1 (de) * 1998-11-05 2000-05-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Werkstück

Also Published As

Publication number Publication date
ATE285866T1 (de) 2005-01-15
US20030145707A1 (en) 2003-08-07
CH697024A5 (fr) 2008-03-31
US6886550B2 (en) 2005-05-03
JP2004509776A (ja) 2004-04-02
WO2002026431A1 (fr) 2002-04-04
DE60108140D1 (de) 2005-02-03
EP1320438A1 (fr) 2003-06-25
DE60108140T2 (de) 2006-01-12
EP1320438B1 (fr) 2004-12-29

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