AU2001275795A1 - Electrochemical treating method such as electroplating and electrochemical reaction device therefor - Google Patents

Electrochemical treating method such as electroplating and electrochemical reaction device therefor

Info

Publication number
AU2001275795A1
AU2001275795A1 AU2001275795A AU7579501A AU2001275795A1 AU 2001275795 A1 AU2001275795 A1 AU 2001275795A1 AU 2001275795 A AU2001275795 A AU 2001275795A AU 7579501 A AU7579501 A AU 7579501A AU 2001275795 A1 AU2001275795 A1 AU 2001275795A1
Authority
AU
Australia
Prior art keywords
electrochemical
electroplating
reaction device
treating method
device therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001275795A
Inventor
Hiroe Asai
Yoshihiro Asai
Humiko Iwao
Seizo Miyata
Masato Sone
Hideo Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000253572A external-priority patent/JP3571627B2/en
Priority claimed from JP2000401301A external-priority patent/JP3703132B2/en
Priority claimed from JP2001137191A external-priority patent/JP3613335B2/en
Application filed by Individual filed Critical Individual
Publication of AU2001275795A1 publication Critical patent/AU2001275795A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H3/00—Electrochemical machining, i.e. removing metal by passing current between an electrode and a workpiece in the presence of an electrolyte
    • B23H3/08—Working media
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1685—Process conditions with supercritical condition, e.g. chemical fluid deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/73—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals characterised by the process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/005—Apparatus specially adapted for electrolytic conversion coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/07—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
    • C23C22/08—Orthophosphates
    • C23C22/18—Orthophosphates containing manganese cations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
AU2001275795A 2000-08-24 2001-07-30 Electrochemical treating method such as electroplating and electrochemical reaction device therefor Abandoned AU2001275795A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2000253572A JP3571627B2 (en) 2000-08-24 2000-08-24 Electrochemical reaction method
JP2000-253572 2000-08-24
JP2000401301A JP3703132B2 (en) 2000-12-28 2000-12-28 Electrochemical treatment method such as electroplating and electrochemical reaction apparatus thereof
JP2000-401301 2000-12-28
JP2001-137191 2001-05-08
JP2001137191A JP3613335B2 (en) 2001-05-08 2001-05-08 Electrochemical treatment method such as electroplating and electrochemical reaction apparatus thereof
PCT/JP2001/006525 WO2002016673A1 (en) 2000-08-24 2001-07-30 Electrochemical treating method such as electroplating and electrochemical reaction device therefor

Publications (1)

Publication Number Publication Date
AU2001275795A1 true AU2001275795A1 (en) 2002-03-04

Family

ID=27344419

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001275795A Abandoned AU2001275795A1 (en) 2000-08-24 2001-07-30 Electrochemical treating method such as electroplating and electrochemical reaction device therefor

Country Status (5)

Country Link
US (1) US6793793B2 (en)
EP (1) EP1314799B1 (en)
AU (1) AU2001275795A1 (en)
TW (1) TW588119B (en)
WO (1) WO2002016673A1 (en)

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JP3695703B2 (en) * 2001-10-25 2005-09-14 株式会社日立製作所 Electroplating method, electroplating apparatus and semiconductor device manufacturing method and manufacturing apparatus
EP1445353A4 (en) * 2001-11-14 2007-03-07 Asahi Engineering Method and device for surface treatment of treated object
JP3830386B2 (en) * 2001-12-20 2006-10-04 英夫 吉田 Anodizing method and processing equipment therefor
JP2004225152A (en) * 2003-01-27 2004-08-12 Tokyo Electron Ltd Method for treating substrate and method for manufacturing semiconductor device
JP4673612B2 (en) * 2004-02-12 2011-04-20 ダイキン工業株式会社 Electroplating in the presence of CO2
JP4557570B2 (en) * 2004-03-01 2010-10-06 成之 上宮 Method for producing thin film for hydrogen separation
JP4311448B2 (en) * 2004-08-02 2009-08-12 ダイキン工業株式会社 Oxygen electrode
US7906210B2 (en) * 2004-10-27 2011-03-15 Nissei Plastic Industrial Co., Ltd. Fibrous nanocarbon and metal composite and a method of manufacturing the same
SE0403042D0 (en) * 2004-12-14 2004-12-14 Polymer Kompositer I Goeteborg Improved stabilization and performance of autocatalytic electroless process
JP2006265729A (en) * 2005-02-23 2006-10-05 Daikin Ind Ltd Production method of multilayer film structure, multilayer film structure and plating equipment
WO2006090775A1 (en) * 2005-02-23 2006-08-31 Daikin Industries, Ltd. Coating film, article covered with coating film, and method for corrosion-resistant coating
WO2006090785A1 (en) * 2005-02-23 2006-08-31 Daikin Industries, Ltd. Plated member for fuel cell, and method and apparatus for manufacturing same
WO2007007617A1 (en) * 2005-07-08 2007-01-18 Daikin Industries, Ltd. Surface treatment in presence of organic solvent
US7579117B1 (en) * 2005-08-25 2009-08-25 Kirby Beard Electrochemical cell energy device based on novel electrolyte
FR2898138B1 (en) * 2006-03-03 2008-05-16 Commissariat Energie Atomique METHOD FOR ELECTROCHEMICAL STRUCTURING OF A CONDUCTIVE OR SEMICONDUCTOR MATERIAL, AND DEVICE FOR CARRYING OUT SAID METHOD
US20070264451A1 (en) * 2006-05-11 2007-11-15 Hitachi Maxell, Ltd. Method of manufacturing polymer member and polymer member
JP4919262B2 (en) 2006-06-02 2012-04-18 日立マクセル株式会社 Storage container, resin molding method and plating film forming method
JP4163728B2 (en) * 2006-10-02 2008-10-08 エス・イー・エス株式会社 Electroplating method
JP4177400B2 (en) * 2006-11-10 2008-11-05 エス・イー・エス株式会社 Electroless plating method
JP5398175B2 (en) * 2008-06-03 2014-01-29 富士フイルム株式会社 Method for manufacturing ink jet recording head
EP2143828B1 (en) * 2008-07-08 2016-12-28 Enthone, Inc. Electrolyte and method for the deposition of a matt metal layer
TWI404826B (en) * 2009-02-27 2013-08-11 Univ Fooyin Stainless steel golf head supercritical fluid polishing method and stainless steel golf head
US8673445B2 (en) * 2009-07-17 2014-03-18 Nissei Plastic Industrial Co. Ltd. Composite-plated article and method for producing same
TW201121680A (en) * 2009-12-18 2011-07-01 Metal Ind Res & Dev Ct Electrochemical machining device and machining method and electrode unit thereof.
JP5267526B2 (en) 2010-09-24 2013-08-21 株式会社デンソー Plating apparatus and plating method
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KR101318197B1 (en) * 2011-07-01 2013-10-17 주승기 Electroplating system and electroplating method
CN103173795B (en) * 2012-03-27 2016-08-03 上海域高环境技术有限公司 A kind of electric plating method
EP3069401B1 (en) * 2013-11-15 2018-11-07 The Regents of the University of California Electrochemical devices comprising compressed gas solvent electrolytes
CN104724663A (en) * 2013-12-20 2015-06-24 中国科学院兰州化学物理研究所 Silicon-based bionic micro-nano structure surface preparation method
US10011918B2 (en) * 2014-12-23 2018-07-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and process of electro-chemical plating
JP6400512B2 (en) * 2015-03-18 2018-10-03 株式会社東芝 Electroplating method and electroplating apparatus
CN104846406B (en) * 2015-05-12 2017-03-08 江苏理工学院 supercritical composite electroforming system recycling device and working method thereof
CN108754479B (en) * 2018-07-02 2020-04-21 杨景峰 Zero-emission phosphating and saponification method based on high-pressure closed circulation system

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Also Published As

Publication number Publication date
US20030019756A1 (en) 2003-01-30
EP1314799A1 (en) 2003-05-28
EP1314799A4 (en) 2007-03-07
EP1314799B1 (en) 2013-10-16
WO2002016673A1 (en) 2002-02-28
TW588119B (en) 2004-05-21
US6793793B2 (en) 2004-09-21

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