AU2001263978A1 - A method and an apparatus for manufacturing a smart label inlet web - Google Patents

A method and an apparatus for manufacturing a smart label inlet web

Info

Publication number
AU2001263978A1
AU2001263978A1 AU2001263978A AU6397801A AU2001263978A1 AU 2001263978 A1 AU2001263978 A1 AU 2001263978A1 AU 2001263978 A AU2001263978 A AU 2001263978A AU 6397801 A AU6397801 A AU 6397801A AU 2001263978 A1 AU2001263978 A1 AU 2001263978A1
Authority
AU
Australia
Prior art keywords
manufacturing
smart label
inlet web
label inlet
web
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001263978A
Other languages
English (en)
Inventor
Marko Hanhikorpi
Lari Kytola
Timo Lindstrom
Ilkka Nuorela
Samuli Stromberg
Mikko Tirkkonen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UPM Raflatac Oy
Original Assignee
Rafsec Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rafsec Oy filed Critical Rafsec Oy
Publication of AU2001263978A1 publication Critical patent/AU2001263978A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Making Paper Articles (AREA)
  • Credit Cards Or The Like (AREA)
AU2001263978A 2000-06-06 2001-05-31 A method and an apparatus for manufacturing a smart label inlet web Abandoned AU2001263978A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20001344A FI20001344A (fi) 2000-06-06 2000-06-06 Menetelmä ja laitteisto älytarrasyöttörainan valmistamiseksi
FI20001344 2000-06-06
PCT/FI2001/000520 WO2001095241A1 (en) 2000-06-06 2001-05-31 A method and an apparatus for manufacturing a smart label inlet web

Publications (1)

Publication Number Publication Date
AU2001263978A1 true AU2001263978A1 (en) 2001-12-17

Family

ID=8558503

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001263978A Abandoned AU2001263978A1 (en) 2000-06-06 2001-05-31 A method and an apparatus for manufacturing a smart label inlet web

Country Status (7)

Country Link
US (1) US20030121986A1 (fi)
EP (1) EP1292455B1 (fi)
JP (1) JP2003536149A (fi)
KR (1) KR100858979B1 (fi)
AU (1) AU2001263978A1 (fi)
FI (1) FI20001344A (fi)
WO (1) WO2001095241A1 (fi)

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US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US6848162B2 (en) 2002-08-02 2005-02-01 Matrics, Inc. System and method of transferring dies using an adhesive surface
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US20050005434A1 (en) 2003-06-12 2005-01-13 Matrics, Inc. Method, system, and apparatus for high volume transfer of dies
EP1733337A4 (en) 2004-01-12 2008-06-25 Symbol Technologies Inc INLAY SORTING AND MODULE OF A HIGH FREQUENCY IDENTIFICATION LABEL
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
JP2005306470A (ja) * 2004-03-25 2005-11-04 Tatsuo Sasazaki シート状成形材
WO2006023620A2 (en) 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation of radio frequency identification (rfid) tags for testing and/or programming
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
JP4091096B2 (ja) 2004-12-03 2008-05-28 株式会社 ハリーズ インターポーザ接合装置
DE602006016425D1 (de) 2005-04-06 2010-10-07 Hallys Corp Vorrichtung zur herstellung elektronischer komponenten
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
GB2430783B (en) * 2005-10-03 2010-12-22 Fracture Code Corp Aps Two-part code
US7456748B2 (en) * 2005-10-20 2008-11-25 National Starch And Chemical Investment Holding Corporation RFID antenna with pre-applied adhesives
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US20070163704A1 (en) * 2006-01-18 2007-07-19 Upm Rafsec Oy Method for manufacturing a label comprising a transponder
US8763898B2 (en) 2010-03-02 2014-07-01 First Data Corporation Advanced card merge machine
CN114013112A (zh) * 2021-10-21 2022-02-08 上海晶路电子科技有限公司 一种卷对卷电子吊牌的生产工艺

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BE792488A (fr) * 1971-12-08 1973-03-30 Dainippon Printing Co Ltd Cartes d'identification et procede de fabrication de ces cartes
DE3130032A1 (de) * 1981-07-30 1983-02-17 Agfa-Gevaert Ag, 5090 Leverkusen Faelschungssicheres dokument
NL8601404A (nl) 1986-05-30 1987-12-16 Papier Plastic Coating Groning Gegevensdragende kaart, werkwijze voor het vervaardigen van een dergelijke kaart en inrichting voor het uitvoeren van deze werkwijze.
JPS6359592A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法
US4846922A (en) * 1986-09-29 1989-07-11 Monarch Marking Systems, Inc. Method of making deactivatable tags
US4954814A (en) * 1986-09-29 1990-09-04 Monarch Marking Systems, Inc. Tag and method of making same
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
KR0147813B1 (ko) * 1989-05-16 1998-08-01 월터 클리웨인, 한스-피터 위트린 적층 구조물 및 그의 제조방법
JPH03239595A (ja) * 1990-02-16 1991-10-25 Dainippon Printing Co Ltd カード製造方法
JPH04321190A (ja) * 1991-04-22 1992-11-11 Mitsubishi Electric Corp 非接触型携帯記憶装置のアンテナ回路
JPH07242081A (ja) * 1994-03-08 1995-09-19 Dainippon Printing Co Ltd カード付き連続帳票
US5936847A (en) * 1996-05-02 1999-08-10 Hei, Inc. Low profile electronic circuit modules
US5918363A (en) * 1996-05-20 1999-07-06 Motorola, Inc. Method for marking functional integrated circuit chips with underfill material
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DE19634473C2 (de) * 1996-07-11 2003-06-26 David Finn Verfahren zur Herstellung einer Chipkarte
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WO1999013444A1 (en) * 1997-09-11 1999-03-18 Precision Dynamics Corporation Laminated radio frequency identification device
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JPH1191275A (ja) * 1997-09-25 1999-04-06 Dainippon Printing Co Ltd 非接触型ｉｃカードの製造方法および非接触型ｉｃカード
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JP3400329B2 (ja) * 1998-01-07 2003-04-28 日本電信電話株式会社 半導体装置
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JPH11330148A (ja) * 1998-03-13 1999-11-30 Toshiba Corp 半導体装置
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JP2000001069A (ja) * 1998-06-18 2000-01-07 Konica Corp Ｉｄカードの製造方法及びｉｄカードの製造装置
ATE398814T1 (de) * 1998-09-11 2008-07-15 Motorola Inc Rfid-etikettenvorrichtung und verfahren
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Also Published As

Publication number Publication date
WO2001095241A8 (en) 2002-04-04
FI20001344A (fi) 2001-12-07
KR100858979B1 (ko) 2008-09-17
EP1292455A1 (en) 2003-03-19
WO2001095241A1 (en) 2001-12-13
FI20001344A0 (fi) 2000-06-06
JP2003536149A (ja) 2003-12-02
US20030121986A1 (en) 2003-07-03
KR20030028750A (ko) 2003-04-10
EP1292455B1 (en) 2012-04-11

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