AU2001256313A1 - Method for examining a pre-determined area of a printed circuit board and devicefor carrying out said method - Google Patents

Method for examining a pre-determined area of a printed circuit board and devicefor carrying out said method

Info

Publication number
AU2001256313A1
AU2001256313A1 AU2001256313A AU5631301A AU2001256313A1 AU 2001256313 A1 AU2001256313 A1 AU 2001256313A1 AU 2001256313 A AU2001256313 A AU 2001256313A AU 5631301 A AU5631301 A AU 5631301A AU 2001256313 A1 AU2001256313 A1 AU 2001256313A1
Authority
AU
Australia
Prior art keywords
devicefor
examining
carrying
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001256313A
Other languages
English (en)
Inventor
Andrej Biazik
Mariusz Piecek
Victor Romanov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ATG Test Systems GmbH and Co KG
Original Assignee
ATG Test Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATG Test Systems GmbH and Co KG filed Critical ATG Test Systems GmbH and Co KG
Publication of AU2001256313A1 publication Critical patent/AU2001256313A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
AU2001256313A 2000-05-24 2001-04-20 Method for examining a pre-determined area of a printed circuit board and devicefor carrying out said method Abandoned AU2001256313A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10025751 2000-05-24
DE10025751A DE10025751A1 (de) 2000-05-24 2000-05-24 Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens
PCT/EP2001/004518 WO2001091053A1 (de) 2000-05-24 2001-04-20 Verfahren zum untersuchen einer leiterplatte an einem vorbestimmten bereich der leiterplatte und vorrichtung zum durchführen des verfahrens

Publications (1)

Publication Number Publication Date
AU2001256313A1 true AU2001256313A1 (en) 2001-12-03

Family

ID=7643421

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001256313A Abandoned AU2001256313A1 (en) 2000-05-24 2001-04-20 Method for examining a pre-determined area of a printed circuit board and devicefor carrying out said method

Country Status (9)

Country Link
US (1) US7149342B2 (de)
EP (1) EP1285408B1 (de)
JP (1) JP2004503919A (de)
KR (1) KR100554119B1 (de)
CN (1) CN1221926C (de)
AU (1) AU2001256313A1 (de)
DE (2) DE10025751A1 (de)
TW (1) TWI235840B (de)
WO (1) WO2001091053A1 (de)

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EP1549072A4 (de) * 2002-08-20 2006-12-06 Olympus Corp Bildvergleichseinrichtung, bildvergleichsverfahren und programm, das bewirkt, dass ein computer einen bildvergleich ausf hrt
US20050157170A1 (en) * 2002-08-20 2005-07-21 Olympus Corporation Image comparison apparatus, image comparison method, and program to execute image comparison by computer
KR20060044032A (ko) * 2004-11-11 2006-05-16 삼성전자주식회사 표시패널용 검사 장치 및 이의 검사 방법
DE102004058606B4 (de) * 2004-12-03 2006-10-05 Eads Deutschland Gmbh Verfahren zur Prüfung der Dichtigkeit von Behältern
JP2006235762A (ja) * 2005-02-22 2006-09-07 Orion Denki Kk プリント基板用ｃａｄシステム
US7860319B2 (en) * 2005-05-11 2010-12-28 Hewlett-Packard Development Company, L.P. Image management
DE102006005800B4 (de) 2006-02-08 2007-12-06 Atg Test Systems Gmbh Verfahren und Vorrichtung zum Testen von unbestückten Leiterplatten
JP2008014701A (ja) * 2006-07-04 2008-01-24 Olympus Corp 基板検査装置
KR101269660B1 (ko) * 2006-10-09 2013-05-30 삼성디스플레이 주식회사 패널 검사 장치 및 이를 이용한 패널 검사 방법
DE102007028723B3 (de) * 2007-06-21 2008-11-06 Klaus Kornhaas Verfahren und Vorrichtung zur Inspektion von Leiterplatten
US8521480B2 (en) * 2009-03-12 2013-08-27 Etegent Technologies, Ltd. Managing non-destructive evaluation data
US8108168B2 (en) 2009-03-12 2012-01-31 Etegent Technologies, Ltd. Managing non-destructive evaluation data
US20100287493A1 (en) * 2009-05-06 2010-11-11 Cadence Design Systems, Inc. Method and system for viewing and editing an image in a magnified view
CN102346154A (zh) * 2010-08-03 2012-02-08 神讯电脑(昆山)有限公司 自动光学检测模型图的生成方法
CN102074031B (zh) * 2011-01-13 2013-08-07 广东正业科技股份有限公司 一种印刷电路板外观检查机的建标方法
KR101821449B1 (ko) 2011-11-16 2018-01-23 디씨지 시스템스 인코포레이티드 편광 다이버시티 이미징 및 정렬을 위한 장치 및 방법
KR101337881B1 (ko) * 2012-03-28 2013-12-06 주식회사 고영테크놀러지 Ｐｃｂ 검사장치의 작업 데이터 생성 및 검사방법
AU2013350323A1 (en) * 2012-11-23 2015-06-11 Alexander Phillip DAVIES Method for detection of faults on circuit boards
US11543811B2 (en) 2013-03-15 2023-01-03 Etegent Technologies Ltd. Manufacture modeling and monitoring
US9864366B2 (en) 2013-03-15 2018-01-09 Etegent Technologies Ltd. Manufacture modeling and monitoring
CN103308849B (zh) * 2013-06-05 2016-01-20 青岛歌尔声学科技有限公司 电视触控笔信号板放大能力的测试系统
KR102099112B1 (ko) * 2015-02-26 2020-04-09 한화정밀기계 주식회사 부품 정보 티칭 방법
CN104898040B (zh) * 2015-06-19 2018-01-02 上海斐讯数据通信技术有限公司 印刷电路板的自动化测试方法及系统
US10049442B2 (en) * 2016-01-28 2018-08-14 Mentor Graphics Corporation Video inspection system with augmented display content
CN107977953A (zh) * 2016-10-20 2018-05-01 英业达科技有限公司 工件导电特征检查方法及工件导电特征检查系统
CN108387591A (zh) * 2017-12-29 2018-08-10 苏州通富超威半导体有限公司 一种半导体器件的失效分析方法及其设备
US20220183197A1 (en) * 2019-04-01 2022-06-09 Ebosistant Ltd. System and methods for assisting with manual assembly and testing of printed circuit boards
TWI735365B (zh) * 2020-10-29 2021-08-01 技嘉科技股份有限公司 電容器極性判定方法
CN112666182A (zh) * 2020-12-29 2021-04-16 苏州天准科技股份有限公司 柔性电路板用自动视觉检测方法及装置
US11363713B1 (en) 2021-10-13 2022-06-14 Albert Moses Haim System and method for trace generation and reconfiguration on a breadboard or printed circuit board
TWI830110B (zh) * 2022-01-04 2024-01-21 文坦自動化股份有限公司 電路板通孔複判維修設備

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JPS62173731A (ja) * 1986-01-28 1987-07-30 Toshiba Corp 被検査物の表面検査装置
DE3737869A1 (de) * 1987-11-09 1989-05-24 Wagner Hans Juergen Dipl Ing Verfahren und einrichtung zum optischen pruefen von gegenstaenden
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JPH08114554A (ja) * 1994-10-18 1996-05-07 Nikon Corp 欠陥検査方法及び欠陥検査装置
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JP4332933B2 (ja) * 1999-06-10 2009-09-16 ソニー株式会社 検査装置
DE10025751A1 (de) 2000-05-24 2001-12-06 Atg Test Systems Gmbh Verfahren zum Untersuchen einer leiterplatte an einem vorbestimmten Bereich der Leiterplatte und Vorrichtung zum Durchführen des Verfahrens

Also Published As

Publication number Publication date
EP1285408B1 (de) 2006-03-01
EP1285408A1 (de) 2003-02-26
WO2001091053A1 (de) 2001-11-29
DE10025751A1 (de) 2001-12-06
CN1221926C (zh) 2005-10-05
DE50109076D1 (de) 2006-04-27
TWI235840B (en) 2005-07-11
US7149342B2 (en) 2006-12-12
CN1430768A (zh) 2003-07-16
KR20030009430A (ko) 2003-01-29
US20030059102A1 (en) 2003-03-27
JP2004503919A (ja) 2004-02-05
KR100554119B1 (ko) 2006-02-20

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