AU2001241521A1 - Wafer processing system - Google Patents
Wafer processing systemInfo
- Publication number
- AU2001241521A1 AU2001241521A1 AU2001241521A AU4152101A AU2001241521A1 AU 2001241521 A1 AU2001241521 A1 AU 2001241521A1 AU 2001241521 A AU2001241521 A AU 2001241521A AU 4152101 A AU4152101 A AU 4152101A AU 2001241521 A1 AU2001241521 A1 AU 2001241521A1
- Authority
- AU
- Australia
- Prior art keywords
- processing system
- wafer processing
- wafer
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/513,106 US6395648B1 (en) | 2000-02-25 | 2000-02-25 | Wafer processing system |
US09513106 | 2000-02-25 | ||
PCT/US2001/005050 WO2001063651A2 (en) | 2000-02-25 | 2001-02-16 | Wafer processing system |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001241521A1 true AU2001241521A1 (en) | 2001-09-03 |
Family
ID=24041913
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001241521A Abandoned AU2001241521A1 (en) | 2000-02-25 | 2001-02-16 | Wafer processing system |
Country Status (6)
Country | Link |
---|---|
US (2) | US6395648B1 (ko) |
EP (1) | EP1258028A2 (ko) |
JP (1) | JP2003524897A (ko) |
KR (1) | KR100757142B1 (ko) |
AU (1) | AU2001241521A1 (ko) |
WO (1) | WO2001063651A2 (ko) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101894779B (zh) * | 2003-08-29 | 2013-05-01 | 交叉自动控制公司 | 用于半导体处理的方法和装置 |
JP4719010B2 (ja) * | 2005-01-21 | 2011-07-06 | 日本電産サンキョー株式会社 | 産業用ロボット |
US7467916B2 (en) * | 2005-03-08 | 2008-12-23 | Asm Japan K.K. | Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same |
JP4789551B2 (ja) * | 2005-09-06 | 2011-10-12 | 株式会社半導体エネルギー研究所 | 有機el成膜装置 |
JP5537947B2 (ja) * | 2006-11-27 | 2014-07-02 | テック・セム アーゲー | オーバーヘッド型搬送システム用搬送装置 |
KR100867825B1 (ko) | 2006-12-12 | 2008-11-10 | 현대자동차주식회사 | 연료전지 하이브리드 전기차량의 비상시동제어방법 |
US7737702B2 (en) * | 2007-08-15 | 2010-06-15 | Applied Materials, Inc. | Apparatus for wafer level arc detection at an electrostatic chuck electrode |
US7750644B2 (en) * | 2007-08-15 | 2010-07-06 | Applied Materials, Inc. | System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating |
US7750645B2 (en) * | 2007-08-15 | 2010-07-06 | Applied Materials, Inc. | Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation |
US7733095B2 (en) | 2007-08-15 | 2010-06-08 | Applied Materials, Inc. | Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode |
US7768269B2 (en) * | 2007-08-15 | 2010-08-03 | Applied Materials, Inc. | Method of multi-location ARC sensing with adaptive threshold comparison |
CN103237634B (zh) * | 2010-10-08 | 2016-12-14 | 布鲁克斯自动化公司 | 同轴驱动的真空机器人 |
JP2014093489A (ja) * | 2012-11-06 | 2014-05-19 | Tokyo Electron Ltd | 基板処理装置 |
JP6493339B2 (ja) * | 2016-08-26 | 2019-04-03 | 村田機械株式会社 | 搬送容器、及び収容物の移載方法 |
DE102018102762B3 (de) * | 2018-02-07 | 2019-08-01 | Uwe Beier | Ladeschleuse für einen Substratbehälter, Vorrichtung mit einer Ladeschleuse und Verfahren zum Betrieb einer Ladeschleuse |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4680451A (en) | 1985-07-29 | 1987-07-14 | A. G. Associates | Apparatus using high intensity CW lamps for improved heat treating of semiconductor wafers |
JPH0636582Y2 (ja) * | 1987-07-10 | 1994-09-21 | 株式会社日立製作所 | エッチング装置 |
JPH0184428U (ko) * | 1987-11-27 | 1989-06-05 | ||
US4886954A (en) | 1988-04-15 | 1989-12-12 | Thermco Systems, Inc. | Hot wall diffusion furnace and method for operating the furnace |
US5155336A (en) | 1990-01-19 | 1992-10-13 | Applied Materials, Inc. | Rapid thermal heating apparatus and method |
US5208643A (en) | 1990-10-05 | 1993-05-04 | Varian Associates, Inc. | Method of and apparatus for non-contact temperature measurement |
US5114242A (en) | 1990-12-07 | 1992-05-19 | Ag Processing Technologies, Inc. | Bichannel radiation detection method |
US5165796A (en) | 1990-12-07 | 1992-11-24 | Ag Processing Technologies, Inc. | Bichannel radiation detection apparatus |
US5257323A (en) | 1991-05-29 | 1993-10-26 | Canon Kabushiki Kaisha | Selection agent for a symbol determination system with multiple character recognition processors |
KR0162102B1 (ko) | 1991-05-29 | 1999-02-01 | 이노우에 아키라 | 반도체 제조장치 |
US5443382A (en) * | 1992-08-27 | 1995-08-22 | Matsushita Electric Industrial Co., Ltd. | Atmospheric oven |
US5418885A (en) | 1992-12-29 | 1995-05-23 | North Carolina State University | Three-zone rapid thermal processing system utilizing wafer edge heating means |
TW276353B (ko) * | 1993-07-15 | 1996-05-21 | Hitachi Seisakusyo Kk | |
JP3560633B2 (ja) * | 1994-03-15 | 2004-09-02 | 東芝機械株式会社 | 加熱処理装置 |
US5645419A (en) * | 1994-03-29 | 1997-07-08 | Tokyo Electron Kabushiki Kaisha | Heat treatment method and device |
US5654904A (en) | 1994-05-18 | 1997-08-05 | Micron Technology, Inc. | Control and 3-dimensional simulation model of temperature variations in a rapid thermal processing machine |
JP3196917B2 (ja) | 1994-06-17 | 2001-08-06 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JPH08213442A (ja) * | 1995-02-06 | 1996-08-20 | Hitachi Ltd | マルチチャンバプロセス装置 |
US5715361A (en) | 1995-04-13 | 1998-02-03 | Cvc Products, Inc. | Rapid thermal processing high-performance multizone illuminator for wafer backside heating |
US5654417A (en) | 1995-04-14 | 1997-08-05 | Children's Hospital And Medical Center | Nucleic acid probes for detecting E. coli O157:H7 |
US5830277A (en) | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
US5584936A (en) | 1995-12-14 | 1996-12-17 | Cvd, Incorporated | Susceptor for semiconductor wafer processing |
US5837555A (en) | 1996-04-12 | 1998-11-17 | Ast Electronik | Apparatus and method for rapid thermal processing |
JPH1064973A (ja) * | 1996-08-22 | 1998-03-06 | Kokusai Electric Co Ltd | 半導体製造装置 |
JP3774283B2 (ja) | 1996-11-19 | 2006-05-10 | 東京エレクトロン株式会社 | 処理システム |
GB9625186D0 (en) | 1996-12-04 | 1997-01-22 | Smiths Industries Plc | Manufacture |
JPH11163075A (ja) * | 1997-12-01 | 1999-06-18 | Hitachi Ltd | 半導体装置の製造方法および半導体製造装置 |
-
2000
- 2000-02-25 US US09/513,106 patent/US6395648B1/en not_active Expired - Fee Related
-
2001
- 2001-02-16 KR KR1020027011078A patent/KR100757142B1/ko not_active IP Right Cessation
- 2001-02-16 WO PCT/US2001/005050 patent/WO2001063651A2/en active Application Filing
- 2001-02-16 AU AU2001241521A patent/AU2001241521A1/en not_active Abandoned
- 2001-02-16 EP EP01912775A patent/EP1258028A2/en not_active Withdrawn
- 2001-02-16 JP JP2001562740A patent/JP2003524897A/ja active Pending
-
2002
- 2002-02-14 US US10/076,834 patent/US6840763B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100757142B1 (ko) | 2007-09-10 |
US6395648B1 (en) | 2002-05-28 |
US6840763B2 (en) | 2005-01-11 |
WO2001063651A2 (en) | 2001-08-30 |
US20020090836A1 (en) | 2002-07-11 |
JP2003524897A (ja) | 2003-08-19 |
WO2001063651A3 (en) | 2001-12-06 |
EP1258028A2 (en) | 2002-11-20 |
KR20020086574A (ko) | 2002-11-18 |
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