JP5537947B2 - オーバーヘッド型搬送システム用搬送装置 - Google Patents
オーバーヘッド型搬送システム用搬送装置 Download PDFInfo
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- JP5537947B2 JP5537947B2 JP2009538569A JP2009538569A JP5537947B2 JP 5537947 B2 JP5537947 B2 JP 5537947B2 JP 2009538569 A JP2009538569 A JP 2009538569A JP 2009538569 A JP2009538569 A JP 2009538569A JP 5537947 B2 JP5537947 B2 JP 5537947B2
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- 235000012431 wafers Nutrition 0.000 claims description 56
- 238000003860 storage Methods 0.000 claims description 50
- 238000004519 manufacturing process Methods 0.000 claims description 10
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- 238000012432 intermediate storage Methods 0.000 claims description 5
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
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- 229910052757 nitrogen Inorganic materials 0.000 description 2
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- 238000003780 insertion Methods 0.000 description 1
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- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H29/00—Delivering or advancing articles from machines; Advancing articles to or into piles
- B65H29/003—Delivering or advancing articles from machines; Advancing articles to or into piles by grippers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67733—Overhead conveying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/30—Orientation, displacement, position of the handled material
- B65H2301/31—Features of transport path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/30—Orientation, displacement, position of the handled material
- B65H2301/32—Orientation of handled material
- B65H2301/323—Hanging
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/44—Moving, forwarding, guiding material
- B65H2301/447—Moving, forwarding, guiding material transferring material between transport devices
- B65H2301/4471—Grippers, e.g. moved in paths enclosing an area
- B65H2301/44712—Grippers, e.g. moved in paths enclosing an area carried by chains or bands
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2405/00—Parts for holding the handled material
- B65H2405/50—Gripping means
- B65H2405/55—Rail guided gripping means running in closed loop, e.g. without permanent interconnecting means
- B65H2405/552—Rail guided gripping means running in closed loop, e.g. without permanent interconnecting means with permanent interconnection and determined spacing between the grippers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
Description
2 搬送ボックス
2a カバー
3 ウェーハー
4 処理装置
5 搬送装置
6 ケーシング
7 第1の搬出入接続部
7a 送入位置
8 搬送ボックスチェンジャー
9 プラットホーム
10 第1のポジション
12 操作装置
13 第2のポジション
14 シングルグリッパー
15 スタックグリッパー
15a スタックグリッパーのグリッパー
16 スライダ担持体
20 3点支持部
21 3点支持部
22 3点支持部
24 蓄積装置
25 供給装置
26 下部搬出入接続部
27 搬出入蓄積器
28 ケーシング
29 閉鎖可能な開口部
30 蓄積スペース
31 開口部
32 開口部
33 管路
Claims (15)
- 電子部品またはディスプレイの製造領域から基板を搬送し、基板を処理装置へ供給するために設けられている搬送装置であって、基板搬送ボックスのためのオーバーヘッド型搬送システムに接続している第1の搬出入接続部と、処理装置に接続している第2の搬出入接続部とを有している閉鎖可能なケーシングを備え、第1の搬出入接続部が鉛直方向に関し第2の搬出入接続部の上方に配置されている前記搬送装置において、
基板を搬送ボックスおよび/または該搬送ボックスのマガジンから切り離して搬送装置内へ送入するための操作装置(12)と、基板を、搬送装置(5)内に配置されて第1および第2の搬出入接続部(7,26)の間に竪穴状の走行領域を有している前記操作装置(12)により、搬送ボックスおよび/または該搬送ボックスのマガジンから切り離して、一方の搬出入接続部(7または26)から他方の搬出入接続部(26、7)へ鉛直方向に搬送可能にするための手段とが設けられていることを特徴とする搬送装置。 - 搬送装置内に配置され、基板を中間保管するための蓄積スペースを備えた蓄積装置(24)が設けられていることを特徴とする、請求項1に記載の搬送装置。
- 蓄積装置(24)がケーシング(6)内部に配置され、該蓄積装置(24)は、互いにスタック可能で且つ互いに相対運動可能な、それぞれ1つの基板を受容するための蓄積要素を有していることを特徴とする、請求項2に記載の搬送装置。
- ケーシング(6)内部にウェーハースタックを形成させるための手段が設けられていることを特徴とする、請求項1から3までのいずれか一つに記載の搬送装置。
- 基板の方位位置を検出するための手段と、方位位置を変化させるための手段とが設けられていることを特徴とする、請求項1から4までのいずれか一つに記載の搬送装置。
- 搬送装置内に配置される操作装置(12)を用いて、ウェーハーを処理装置へ受け渡し可能であることを特徴とする、請求項1から5までのいずれか一つに記載の搬送装置。
- 操作装置(12)が、基板のスタックを把持するためのスタックグリッパー(15)と1つの基板を把持するための少なくとも1つのシングルグリッパー(14)の双方を有していることを特徴とする、請求項1から6までのいずれか一つに記載の搬送装置。
- 第2の搬出入接続部(26)の構成要素として搬出入蓄積器(27)が設けられ、該搬出入蓄積器(27)内で、基板が処理装置との交換のために降下可能且つ取り出し可能であることを特徴とする、請求項1から7までのいずれか一つに記載の搬送装置。
- 搬出入蓄積器(27)の運動手段、特に回転運動を生じさせるための運動手段が設けられていることを特徴とする、請求項8に記載の搬送装置。
- 搬送装置のケーシング(6)の前方または該ケーシング(6)上に配置される搬送ボックスを、搬出入接続部(7)に固定させるための積載ポジション(10)から、搬出のために該搬送ボックスを受容するバッファーポジション(13)へおよびその逆へ移送可能にするための搬送ボックスチェンジャー(8)が設けられていることを特徴とする、請求項1から9までのいずれか一つに記載の搬送装置。
- 搬送装置のケーシング(6)内部に浄化空間条件を生じさせるための手段が設けられていることを特徴とする、請求項1から10までのいずれか一つに記載の搬送装置。
- 少なくとも1つの基板を処理装置へ供給する方法であって、搬送ボックス内に配置される少なくとも1つの基板を、オーバーヘッド型搬送システム(1)から、処理装置(4)前方に配置される搬送装置(5)の閉鎖可能なケーシング(6)の第1の搬出入接続部(7)へ供給するようにした前記方法において、
少なくとも1つの基板を、搬送ボックスを搬送装置のケーシング内へ送入せずに第1の搬出入接続部(7)の領域において搬送ボックスから取り出し、次に搬送装置の第2の搬出入接続部へ移送してそこで処理装置に対する供給を行なうことを特徴とする方法。 - 基板を搬送装置のケーシング内部で開放状態で中間保管することを特徴とする、請求項12に記載の方法。
- 搬送装置内で基板を回転目標位置へ指向させることを特徴とする、請求項12または13に記載の方法。
- 搬送装置のケーシング内部で、基板を第2の搬出入接続部に配置することを特徴とする、請求項12から14までのいずれか一つに記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH19092006 | 2006-11-27 | ||
CH1909/06 | 2006-11-27 | ||
PCT/CH2007/000592 WO2008064507A1 (de) | 2006-11-27 | 2007-11-27 | Transfervorrichtung für eine überkopf-transportanlage |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010511294A JP2010511294A (ja) | 2010-04-08 |
JP5537947B2 true JP5537947B2 (ja) | 2014-07-02 |
Family
ID=38541959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009538569A Active JP5537947B2 (ja) | 2006-11-27 | 2007-11-27 | オーバーヘッド型搬送システム用搬送装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100183420A1 (ja) |
EP (1) | EP2097342B1 (ja) |
JP (1) | JP5537947B2 (ja) |
KR (1) | KR101601005B1 (ja) |
WO (1) | WO2008064507A1 (ja) |
Family Cites Families (19)
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JPS57117421A (en) * | 1981-01-12 | 1982-07-21 | Sony Corp | Parts feeder |
US5826129A (en) * | 1994-06-30 | 1998-10-20 | Tokyo Electron Limited | Substrate processing system |
US5662452A (en) * | 1996-08-26 | 1997-09-02 | H-Square Corporation | Apparatus and method of aligning notches using a free-floating rod |
JPH10321693A (ja) * | 1997-05-22 | 1998-12-04 | Daikin Ind Ltd | ワーク取り扱い装置 |
JPH11135596A (ja) * | 1997-10-31 | 1999-05-21 | Dainippon Screen Mfg Co Ltd | 基板処理装置および中間受け渡し装置 |
JP2002504744A (ja) * | 1997-11-28 | 2002-02-12 | マットソン テクノロジイ インコーポレイテッド | 真空処理を行う非加工物を、低汚染かつ高処理能力で取扱うためのシステムおよび方法 |
US6450755B1 (en) * | 1998-07-10 | 2002-09-17 | Equipe Technologies | Dual arm substrate handling robot with a batch loader |
US6641349B1 (en) * | 1999-04-30 | 2003-11-04 | Tdk Corporation | Clean box, clean transfer method and system |
US6395648B1 (en) * | 2000-02-25 | 2002-05-28 | Wafermasters, Inc. | Wafer processing system |
US20020025244A1 (en) * | 2000-04-12 | 2002-02-28 | Kim Ki-Sang | Transfer system and apparatus for workpiece containers and method of transferring the workpiece containers using the same |
AU2001286946A1 (en) * | 2000-09-01 | 2002-03-13 | Asyst Technologies, Inc. | Edge grip aligner with buffering capabilities |
WO2003024673A1 (fr) * | 2001-09-12 | 2003-03-27 | Takehide Hayashi | Main de robot a fonction de positionnement pour tranche en semiconducteur et substrat de verre a cristaux liquides |
TWI274393B (en) * | 2002-04-08 | 2007-02-21 | Acm Res Inc | Electropolishing and/or electroplating apparatus and methods |
JP3635574B2 (ja) * | 2002-07-29 | 2005-04-06 | 株式会社日立国際電気 | 半導体製造装置及び半導体製造方法 |
EP1394840B1 (en) * | 2002-08-31 | 2008-11-19 | Applied Materials, Inc. | System for transporting substrate carriers |
US6779760B2 (en) * | 2002-12-19 | 2004-08-24 | Taiwan Semiconductor Manufacturing Co., Ltd | Safety system for overhead transport vehicle |
US7682455B2 (en) * | 2003-07-11 | 2010-03-23 | Tec-Sem Ag | Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components |
JP2006032808A (ja) * | 2004-07-21 | 2006-02-02 | Nikon Corp | 位置ずれ検出装置、マスク搬送システム及び露光装置 |
JP4642032B2 (ja) * | 2004-10-25 | 2011-03-02 | 東京エレクトロン株式会社 | 搬送システム、及び基板処理装置 |
-
2007
- 2007-11-27 JP JP2009538569A patent/JP5537947B2/ja active Active
- 2007-11-27 EP EP07816275.7A patent/EP2097342B1/de active Active
- 2007-11-27 US US12/516,261 patent/US20100183420A1/en not_active Abandoned
- 2007-11-27 KR KR1020097013063A patent/KR101601005B1/ko active IP Right Grant
- 2007-11-27 WO PCT/CH2007/000592 patent/WO2008064507A1/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2008064507A1 (de) | 2008-06-05 |
US20100183420A1 (en) | 2010-07-22 |
EP2097342B1 (de) | 2023-03-22 |
EP2097342A1 (de) | 2009-09-09 |
KR20090088418A (ko) | 2009-08-19 |
JP2010511294A (ja) | 2010-04-08 |
KR101601005B1 (ko) | 2016-03-08 |
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