ATE652T1 - METHOD OF ETCHING COPPER OR COPPER ALLOY SURFACES. - Google Patents

METHOD OF ETCHING COPPER OR COPPER ALLOY SURFACES.

Info

Publication number
ATE652T1
ATE652T1 AT79104575T AT79104575T ATE652T1 AT E652 T1 ATE652 T1 AT E652T1 AT 79104575 T AT79104575 T AT 79104575T AT 79104575 T AT79104575 T AT 79104575T AT E652 T1 ATE652 T1 AT E652T1
Authority
AT
Austria
Prior art keywords
copper
etching solution
etching
oxidizing agent
cathode
Prior art date
Application number
AT79104575T
Other languages
German (de)
Inventor
Wolfgang Faul
Leander Fuerst
Bertel Prof. Dr. Kastening
Original Assignee
Wolfgang Faul
Leander Fuerst
Bertel Prof. Dr. Kastening
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfgang Faul, Leander Fuerst, Bertel Prof. Dr. Kastening filed Critical Wolfgang Faul
Application granted granted Critical
Publication of ATE652T1 publication Critical patent/ATE652T1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/46Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crushing And Grinding (AREA)
  • Manufacture And Refinement Of Metals (AREA)

Abstract

Method of etching of surfaces of copper or copper alloys by way of an acidic solution containing an oxidizing agent. After removal of the copper surface, the etching solution is passed for regeneration of the oxidizing agent through an electrolysis cell having an anode and a cathode, with copper being deposited on the cathode. The etching solution is maintained free of chloride ions and contains as the oxidizing agent ferric sulfate in a concentration of up to about 140 g of Fe/1 etching solution, whereby the copper content of the etching solution is adjusted to at least 10 g Cu per liter etching solution, while the current density in the electrolysis cell is maintained at at least 2A/dm2.
AT79104575T 1978-11-22 1979-11-19 METHOD OF ETCHING COPPER OR COPPER ALLOY SURFACES. ATE652T1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2850542A DE2850542C2 (en) 1978-11-22 1978-11-22 Process for etching surfaces made of copper or copper alloys
EP79104575A EP0011800B1 (en) 1978-11-22 1979-11-19 Etching process for copper and copper alloy surfaces

Publications (1)

Publication Number Publication Date
ATE652T1 true ATE652T1 (en) 1982-02-15

Family

ID=6055278

Family Applications (1)

Application Number Title Priority Date Filing Date
AT79104575T ATE652T1 (en) 1978-11-22 1979-11-19 METHOD OF ETCHING COPPER OR COPPER ALLOY SURFACES.

Country Status (8)

Country Link
US (1) US4265722A (en)
EP (1) EP0011800B1 (en)
JP (1) JPS5573872A (en)
AT (1) ATE652T1 (en)
AU (1) AU527609B2 (en)
BE (1) BE893883Q (en)
CA (1) CA1152939A (en)
DE (1) DE2850542C2 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4416725A (en) * 1982-12-30 1983-11-22 International Business Machines Corporation Copper texturing process
DE3539886A1 (en) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H METHOD AND DEVICE FOR ETCHING AN AT LEAST PARTLY OF METAL, PREFERABLY COPPER, EXISTING AGENT
US4879045A (en) * 1986-01-13 1989-11-07 Eggerichs Terry L Method and apparatus for electromagnetically treating a fluid
US5531874A (en) * 1994-06-17 1996-07-02 International Business Machines Corporation Electroetching tool using localized application of channelized flow of electrolyte
GB2293390A (en) * 1994-09-20 1996-03-27 British Tech Group Simultaneous etchant regeneration and metal deposition by electrodialysis
DE19850530A1 (en) * 1998-11-03 2000-05-25 Eilenburger Elektrolyse & Umwelttechnik Gmbh Circulation process for pickling copper and copper alloys
US6656370B1 (en) * 2000-10-13 2003-12-02 Lenora Toscano Method for the manufacture of printed circuit boards
DE10059743A1 (en) * 2000-12-01 2002-06-20 Rolf Hempelmann Catalyst separation process
SE519898C2 (en) * 2001-09-10 2003-04-22 Obducat Ab Ways to etch copper on card and device and electrolyte for carrying out the method
DE10326767B4 (en) * 2003-06-13 2006-02-02 Atotech Deutschland Gmbh A method of regenerating ferrous etchant solutions for use in etching or pickling copper or copper alloys, and an apparatus for performing the same
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
CN103924243A (en) * 2013-01-11 2014-07-16 上海飞凯光电材料股份有限公司 Etching solution composition
EP2754732B1 (en) * 2013-01-15 2015-03-11 ATOTECH Deutschland GmbH Aqueous composition for etching of copper and copper alloys
WO2020004034A1 (en) 2018-06-28 2020-01-02 古河電気工業株式会社 Copper alloy sheet, copper alloy sheet manufacturing method, and connector using copper alloy sheet
CN108866572A (en) * 2018-08-27 2018-11-23 苏碧云 A kind of iron displacement copper electrolysis cells
CN111809184B (en) * 2020-07-15 2022-03-04 深圳市祺鑫环保科技有限公司 Method for recycling regenerated seed liquid

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3033793A (en) * 1958-08-13 1962-05-08 Photo Engravers Res Inc Powderless etching of copper photoengraving plates
US3622478A (en) * 1960-11-14 1971-11-23 Gen Electric Continuous regeneration of ferric sulfate pickling bath
SU438729A1 (en) * 1970-07-17 1975-01-23 Предприятие П/Я А-7125 The method of regeneration of sulphate and chloride pickling solutions of iron
US3974050A (en) * 1971-10-12 1976-08-10 Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung Method of and apparatus for processing the surface of bodies
US3788915A (en) * 1972-02-09 1974-01-29 Shipley Co Regeneration of spent etchant
US4153531A (en) * 1976-08-21 1979-05-08 Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung Apparatus for electrochemically processing metallic surfaces
DE2641905C2 (en) * 1976-09-17 1986-03-20 Geb. Bakulina Galina Aleksandrovna Batova Process for the regeneration of used etching solutions
DE2655137C2 (en) * 1976-12-04 1978-06-08 Kernforschungsanlage Juelich Gmbh, 5170 Juelich Process for the electrochemical processing of metallic surfaces

Also Published As

Publication number Publication date
JPS636632B2 (en) 1988-02-10
EP0011800A1 (en) 1980-06-11
BE893883Q (en) 1982-11-16
AU527609B2 (en) 1983-03-10
AU5309379A (en) 1980-05-29
CA1152939A (en) 1983-08-30
DE2850542C2 (en) 1982-07-01
US4265722A (en) 1981-05-05
JPS5573872A (en) 1980-06-03
EP0011800B1 (en) 1982-02-03
DE2850542A1 (en) 1980-06-04

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