ATE652T1 - Verfahren zum aetzen von oberflaechen aus kupfer oder kupferlegierungen. - Google Patents

Verfahren zum aetzen von oberflaechen aus kupfer oder kupferlegierungen.

Info

Publication number
ATE652T1
ATE652T1 AT79104575T AT79104575T ATE652T1 AT E652 T1 ATE652 T1 AT E652T1 AT 79104575 T AT79104575 T AT 79104575T AT 79104575 T AT79104575 T AT 79104575T AT E652 T1 ATE652 T1 AT E652T1
Authority
AT
Austria
Prior art keywords
copper
etching solution
etching
oxidizing agent
cathode
Prior art date
Application number
AT79104575T
Other languages
English (en)
Inventor
Wolfgang Faul
Leander Fuerst
Bertel Prof. Dr. Kastening
Original Assignee
Wolfgang Faul
Leander Fuerst
Bertel Prof. Dr. Kastening
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfgang Faul, Leander Fuerst, Bertel Prof. Dr. Kastening filed Critical Wolfgang Faul
Application granted granted Critical
Publication of ATE652T1 publication Critical patent/ATE652T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crushing And Grinding (AREA)
  • Manufacture And Refinement Of Metals (AREA)
AT79104575T 1978-11-22 1979-11-19 Verfahren zum aetzen von oberflaechen aus kupfer oder kupferlegierungen. ATE652T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2850542A DE2850542C2 (de) 1978-11-22 1978-11-22 Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen
EP79104575A EP0011800B1 (de) 1978-11-22 1979-11-19 Verfahren zum Ätzen von Oberflächen aus Kupfer oder Kupferlegierungen

Publications (1)

Publication Number Publication Date
ATE652T1 true ATE652T1 (de) 1982-02-15

Family

ID=6055278

Family Applications (1)

Application Number Title Priority Date Filing Date
AT79104575T ATE652T1 (de) 1978-11-22 1979-11-19 Verfahren zum aetzen von oberflaechen aus kupfer oder kupferlegierungen.

Country Status (8)

Country Link
US (1) US4265722A (de)
EP (1) EP0011800B1 (de)
JP (1) JPS5573872A (de)
AT (1) ATE652T1 (de)
AU (1) AU527609B2 (de)
BE (1) BE893883Q (de)
CA (1) CA1152939A (de)
DE (1) DE2850542C2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4416725A (en) * 1982-12-30 1983-11-22 International Business Machines Corporation Copper texturing process
DE3539886A1 (de) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H Verfahren und vorrichtung zum aetzen eines zumindest teilweise aus metall, vorzugsweise kupfer, bestehenden aetzguts
US4879045A (en) * 1986-01-13 1989-11-07 Eggerichs Terry L Method and apparatus for electromagnetically treating a fluid
US5531874A (en) * 1994-06-17 1996-07-02 International Business Machines Corporation Electroetching tool using localized application of channelized flow of electrolyte
GB2293390A (en) * 1994-09-20 1996-03-27 British Tech Group Simultaneous etchant regeneration and metal deposition by electrodialysis
DE19850530A1 (de) * 1998-11-03 2000-05-25 Eilenburger Elektrolyse & Umwelttechnik Gmbh Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen
US6656370B1 (en) * 2000-10-13 2003-12-02 Lenora Toscano Method for the manufacture of printed circuit boards
DE10059743A1 (de) * 2000-12-01 2002-06-20 Rolf Hempelmann Verfahren zur Katalysatorabscheidung
SE519898C2 (sv) * 2001-09-10 2003-04-22 Obducat Ab Sätt att etsa koppar på kort samt anordning och elektrolyt för utförande av sättet
DE10326767B4 (de) * 2003-06-13 2006-02-02 Atotech Deutschland Gmbh Verfahren zur Regenerierung von eisenhaltigen Ätzlösungen zur Verwendung beim Ätzen oder Beizen von Kupfer oder Kupferlegierungen sowie eine Vorrichtung zur Durchführung desselben
US20050067378A1 (en) * 2003-09-30 2005-03-31 Harry Fuerhaupter Method for micro-roughening treatment of copper and mixed-metal circuitry
CN103924243A (zh) * 2013-01-11 2014-07-16 上海飞凯光电材料股份有限公司 一种蚀刻液组合物
EP2754732B1 (de) * 2013-01-15 2015-03-11 ATOTECH Deutschland GmbH Wässrige Zusammensetzung zur Ätzung von Kupfer und Kupferlegierungen
JP6684395B1 (ja) 2018-06-28 2020-04-22 古河電気工業株式会社 銅合金板材及び銅合金板材の製造方法並びに銅合金板材を用いたコネクタ
CN108866572A (zh) * 2018-08-27 2018-11-23 苏碧云 一种铁置换铜电解槽
CN111809184B (zh) * 2020-07-15 2022-03-04 深圳市祺鑫环保科技有限公司 再生子液回用方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3033793A (en) * 1958-08-13 1962-05-08 Photo Engravers Res Inc Powderless etching of copper photoengraving plates
US3622478A (en) * 1960-11-14 1971-11-23 Gen Electric Continuous regeneration of ferric sulfate pickling bath
SU438729A1 (ru) * 1970-07-17 1975-01-23 Предприятие П/Я А-7125 Способ регенерации сернокислых и хлористых травильных растворов железа
US3974050A (en) * 1971-10-12 1976-08-10 Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung Method of and apparatus for processing the surface of bodies
US3788915A (en) * 1972-02-09 1974-01-29 Shipley Co Regeneration of spent etchant
US4153531A (en) * 1976-08-21 1979-05-08 Kernforschungsanlage Julich Gesellschaft Mit Beschrankter Haftung Apparatus for electrochemically processing metallic surfaces
DE2641905C2 (de) * 1976-09-17 1986-03-20 Geb. Bakulina Galina Aleksandrovna Batova Verfahren zur Regenerierung verbrauchter Ätzlösungen
DE2655137C2 (de) * 1976-12-04 1978-06-08 Kernforschungsanlage Juelich Gmbh, 5170 Juelich Verfahren zur elektrochemischen Bearbeitung metallischer Oberflächen

Also Published As

Publication number Publication date
DE2850542C2 (de) 1982-07-01
DE2850542A1 (de) 1980-06-04
JPS636632B2 (de) 1988-02-10
JPS5573872A (en) 1980-06-03
US4265722A (en) 1981-05-05
AU527609B2 (en) 1983-03-10
BE893883Q (fr) 1982-11-16
EP0011800A1 (de) 1980-06-11
CA1152939A (en) 1983-08-30
EP0011800B1 (de) 1982-02-03
AU5309379A (en) 1980-05-29

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Legal Events

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REN Ceased due to non-payment of the annual fee