ATE547716T1 - Stromsensor - Google Patents

Stromsensor

Info

Publication number
ATE547716T1
ATE547716T1 AT06013159T AT06013159T ATE547716T1 AT E547716 T1 ATE547716 T1 AT E547716T1 AT 06013159 T AT06013159 T AT 06013159T AT 06013159 T AT06013159 T AT 06013159T AT E547716 T1 ATE547716 T1 AT E547716T1
Authority
AT
Austria
Prior art keywords
magnetic field
current
detected
magnetoresistive elements
magnetization direction
Prior art date
Application number
AT06013159T
Other languages
English (en)
Inventor
Shigeru Shoji
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp filed Critical Tdk Corp
Application granted granted Critical
Publication of ATE547716T1 publication Critical patent/ATE547716T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/205—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using magneto-resistance devices, e.g. field plates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
AT06013159T 2005-06-27 2006-06-26 Stromsensor ATE547716T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005187384A JP4466487B2 (ja) 2005-06-27 2005-06-27 磁気センサおよび電流センサ

Publications (1)

Publication Number Publication Date
ATE547716T1 true ATE547716T1 (de) 2012-03-15

Family

ID=37074474

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06013159T ATE547716T1 (de) 2005-06-27 2006-06-26 Stromsensor

Country Status (4)

Country Link
US (1) US7723983B2 (de)
EP (1) EP1739444B1 (de)
JP (1) JP4466487B2 (de)
AT (1) ATE547716T1 (de)

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US7709754B2 (en) * 2003-08-26 2010-05-04 Allegro Microsystems, Inc. Current sensor
US7476816B2 (en) * 2003-08-26 2009-01-13 Allegro Microsystems, Inc. Current sensor
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KR100601956B1 (ko) * 2004-06-28 2006-07-14 삼성전자주식회사 자기장의 변화를 이용한 온도측정장치
JP4360998B2 (ja) * 2004-10-01 2009-11-11 Ｔｄｋ株式会社 電流センサ
US7777607B2 (en) * 2004-10-12 2010-08-17 Allegro Microsystems, Inc. Resistor having a predetermined temperature coefficient
US7835116B2 (en) * 2005-09-09 2010-11-16 Seagate Technology Llc Magnetoresistive stack with enhanced pinned layer
US7768083B2 (en) 2006-01-20 2010-08-03 Allegro Microsystems, Inc. Arrangements for an integrated sensor
US20070279053A1 (en) * 2006-05-12 2007-12-06 Taylor William P Integrated current sensor
CN101641609B (zh) * 2007-03-23 2013-06-05 旭化成微电子株式会社 磁传感器及其灵敏度测量方法
US7795862B2 (en) 2007-10-22 2010-09-14 Allegro Microsystems, Inc. Matching of GMR sensors in a bridge
US8269491B2 (en) 2008-02-27 2012-09-18 Allegro Microsystems, Inc. DC offset removal for a magnetic field sensor
EP2108966A1 (de) 2008-04-08 2009-10-14 Ecole Polytechnique Fédérale de Lausanne (EPFL) Stromsensor und Baugruppe zur Strommessung
US7816905B2 (en) 2008-06-02 2010-10-19 Allegro Microsystems, Inc. Arrangements for a current sensing circuit and integrated current sensor
US8093670B2 (en) 2008-07-24 2012-01-10 Allegro Microsystems, Inc. Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions
US8063634B2 (en) * 2008-07-31 2011-11-22 Allegro Microsystems, Inc. Electronic circuit and method for resetting a magnetoresistance element
US7973527B2 (en) 2008-07-31 2011-07-05 Allegro Microsystems, Inc. Electronic circuit configured to reset a magnetoresistance element
CN102419393B (zh) * 2011-12-30 2013-09-04 江苏多维科技有限公司 一种电流传感器
FR2985815B1 (fr) * 2012-01-12 2014-03-07 Commissariat Energie Atomique Capteur de champ magnetique
US8629539B2 (en) 2012-01-16 2014-01-14 Allegro Microsystems, Llc Methods and apparatus for magnetic sensor having non-conductive die paddle
CN102565727B (zh) 2012-02-20 2016-01-20 江苏多维科技有限公司 用于测量磁场的磁电阻传感器
CN102590768B (zh) * 2012-03-14 2014-04-16 江苏多维科技有限公司 一种磁电阻磁场梯度传感器
US9494660B2 (en) 2012-03-20 2016-11-15 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US9666788B2 (en) 2012-03-20 2017-05-30 Allegro Microsystems, Llc Integrated circuit package having a split lead frame
US10234513B2 (en) 2012-03-20 2019-03-19 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9812588B2 (en) 2012-03-20 2017-11-07 Allegro Microsystems, Llc Magnetic field sensor integrated circuit with integral ferromagnetic material
US9244134B2 (en) * 2013-01-15 2016-01-26 Infineon Technologies Ag XMR-sensor and method for manufacturing the XMR-sensor
JPWO2014111976A1 (ja) * 2013-01-18 2017-01-19 株式会社村田製作所 磁気センサ及びその製造方法
US10345343B2 (en) 2013-03-15 2019-07-09 Allegro Microsystems, Llc Current sensor isolation
US9190606B2 (en) 2013-03-15 2015-11-17 Allegro Micosystems, LLC Packaging for an electronic device
US9784715B2 (en) * 2013-04-19 2017-10-10 Zetec, Inc. Eddy current inspection probe based on magnetoresistive sensors
US9411025B2 (en) 2013-04-26 2016-08-09 Allegro Microsystems, Llc Integrated circuit package having a split lead frame and a magnet
WO2014181382A1 (ja) * 2013-05-10 2014-11-13 株式会社村田製作所 磁気電流センサおよび電流測定方法
JP6116061B2 (ja) * 2013-07-16 2017-04-19 横河電機株式会社 電流センサ
DE102013112628A1 (de) 2013-11-15 2015-05-21 Epcos Ag Vorrichtung, Anordnung und Verfahren zur Messung einer Stromstärke in einem stromdurchflossenen Primärleiter
US9354284B2 (en) 2014-05-07 2016-05-31 Allegro Microsystems, Llc Magnetic field sensor configured to measure a magnetic field in a closed loop manner
US9030781B1 (en) * 2014-11-01 2015-05-12 Seagate Technology Llc Detecting stray magnetic fields in a storage device
US9322887B1 (en) 2014-12-01 2016-04-26 Allegro Microsystems, Llc Magnetic field sensor with magnetoresistance elements and conductive-trace magnetic source
EP3729119B1 (de) * 2017-12-21 2023-02-08 Robert Bosch GmbH Magnetoresistive magnetfeldsensorbrücke mit kompensiertem querachseneffekt
US10935612B2 (en) 2018-08-20 2021-03-02 Allegro Microsystems, Llc Current sensor having multiple sensitivity ranges
US10991644B2 (en) 2019-08-22 2021-04-27 Allegro Microsystems, Llc Integrated circuit package having a low profile
US11372029B2 (en) * 2019-12-11 2022-06-28 Tdk Corporation Magnetic field detection apparatus and current detection apparatus
US11187764B2 (en) 2020-03-20 2021-11-30 Allegro Microsystems, Llc Layout of magnetoresistance element
US11800813B2 (en) 2020-05-29 2023-10-24 Allegro Microsystems, Llc High isolation current sensor
CN112014778B (zh) * 2020-08-24 2023-11-07 歌尔微电子有限公司 微机电系统磁阻传感器、传感器单体及电子设备
US11567108B2 (en) 2021-03-31 2023-01-31 Allegro Microsystems, Llc Multi-gain channels for multi-range sensor
US11768230B1 (en) 2022-03-30 2023-09-26 Allegro Microsystems, Llc Current sensor integrated circuit with a dual gauge lead frame

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FR2458817A1 (fr) * 1979-06-06 1981-01-02 Commissariat Energie Atomique Procede de surveillance de l'etat instantane d'un circuit electrique et notamment de detection d'une rupture de ce circuit
US4841235A (en) * 1987-06-11 1989-06-20 Eaton Corporation MRS current sensor
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SG46731A1 (en) * 1995-06-30 1998-02-20 Ibm Spin valve magnetoresistive sensor with antiparallel pinned layer and improved exchange bias layer and magnetic recording system using the senor
DE19755673A1 (de) * 1997-12-15 1999-07-01 Siemens Ag Magnetoresistive Sensoreinrichtung sowie Vorrichtung zum Messen eines Magnetfeldes
JP3521755B2 (ja) * 1998-08-11 2004-04-19 Ｔｄｋ株式会社 磁気抵抗効果素子の磁区制御バイアス磁界測定方法及び装置
JP3959881B2 (ja) * 1999-02-08 2007-08-15 Ｔｄｋ株式会社 磁気抵抗効果センサの製造方法
DE69932701T2 (de) * 1999-03-19 2007-09-13 Hitachi Global Storage Technologies Netherlands B.V. Pinning-Lage für magnetische Anordnungen
WO2002025642A1 (en) * 2000-09-19 2002-03-28 Seagate Technology Llc Giant magnetoresistive sensor having self-consistent demagnetization fields
US6984978B2 (en) * 2002-02-11 2006-01-10 Honeywell International Inc. Magnetic field sensor
JP4415784B2 (ja) 2004-08-02 2010-02-17 株式会社デンソー 電流センサ

Also Published As

Publication number Publication date
EP1739444A2 (de) 2007-01-03
JP2007003498A (ja) 2007-01-11
US20060291106A1 (en) 2006-12-28
US7723983B2 (en) 2010-05-25
JP4466487B2 (ja) 2010-05-26
EP1739444A3 (de) 2010-06-02
EP1739444B1 (de) 2012-02-29

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