ATE546830T1 - Mikro-elektronischer aufbau - Google Patents

Mikro-elektronischer aufbau

Info

Publication number
ATE546830T1
ATE546830T1 AT04005959T AT04005959T ATE546830T1 AT E546830 T1 ATE546830 T1 AT E546830T1 AT 04005959 T AT04005959 T AT 04005959T AT 04005959 T AT04005959 T AT 04005959T AT E546830 T1 ATE546830 T1 AT E546830T1
Authority
AT
Austria
Prior art keywords
micro
electronic construction
stable
substrate
accordance
Prior art date
Application number
AT04005959T
Other languages
English (en)
Inventor
Stephen M Dershem
Dennis B Patterson
Osuna, Jr
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Application granted granted Critical
Publication of ATE546830T1 publication Critical patent/ATE546830T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C07D207/452—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide with hydrocarbon radicals, substituted by hetero atoms, directly attached to the ring nitrogen atom
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
    • C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
    • C07D401/04—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings directly linked by a ring-member-to-ring-member bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT04005959T 1994-09-02 1995-08-30 Mikro-elektronischer aufbau ATE546830T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/300,721 US6034194A (en) 1994-09-02 1994-09-02 Bismaleimide-divinyl adhesive compositions and uses therefor
US08/460,495 US6034195A (en) 1994-09-02 1995-06-02 Thermosetting resin compositions containing maleimide and/or vinyl compounds

Publications (1)

Publication Number Publication Date
ATE546830T1 true ATE546830T1 (de) 2012-03-15

Family

ID=23160304

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04005959T ATE546830T1 (de) 1994-09-02 1995-08-30 Mikro-elektronischer aufbau

Country Status (4)

Country Link
US (2) US6034194A (de)
KR (1) KR100421595B1 (de)
CN (1) CN101209987A (de)
AT (1) ATE546830T1 (de)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307001B1 (en) 2000-05-18 2001-10-23 National Starch And Chemical Investment Holding Corporation Curable hybrid electron donor compounds containing vinyl ether
CA2347902A1 (en) * 2000-05-18 2001-11-18 National Starch And Chemical Investment Holding Corporation Curable electron donor compounds
US6300456B1 (en) 2000-05-18 2001-10-09 National Starch And Chemical Investment Holding Corporation Compounds with electron donor and electron acceptor functionality
ATE291048T1 (de) 2000-05-18 2005-04-15 Nat Starch Chem Invest Vinylether und karbamat oder harnstofffunktionalität enthaltende haftklebemittel für halbleiterplatten
US6441213B1 (en) 2000-05-18 2002-08-27 National Starch And Chemical Investment Holding Corporation Adhesion promoters containing silane, carbamate or urea, and donor or acceptor functionality
US6812064B2 (en) * 2001-11-07 2004-11-02 Micron Technology, Inc. Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrate
US6743852B2 (en) 2001-11-13 2004-06-01 Henkel Corporation Benzoxazines, thermosetting resins comprised thereof, and methods for use thereof
US6825315B2 (en) 2001-12-21 2004-11-30 Sandia Corporation Method of making thermally removable adhesives
US6806309B2 (en) * 2002-02-28 2004-10-19 Henkel Corporation Adhesive compositions containing organic spacers and methods for use thereof
KR101164671B1 (ko) * 2002-06-17 2012-07-11 헨켈 코포레이션 층간 절연 물질 및 미리 도포되는 다이 부착 접착제 물질
US7199249B2 (en) * 2002-07-03 2007-04-03 Henkel Corporation Free radically polymerizable coupling agents
US6818680B2 (en) * 2002-09-23 2004-11-16 Corning Incorporated Curable adhesive compositions
AU2003301550A1 (en) * 2002-10-22 2004-05-13 Henkel Corporation Co-curable compositions
US7176044B2 (en) * 2002-11-25 2007-02-13 Henkel Corporation B-stageable die attach adhesives
US20040158008A1 (en) * 2003-02-06 2004-08-12 Xiping He Room temperature printable adhesive paste
US8513375B2 (en) * 2003-05-05 2013-08-20 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US20040225045A1 (en) * 2003-05-05 2004-11-11 Henkel Loctite Corporation Highly conductive resin compositions
CN1784457B (zh) * 2003-05-05 2010-07-14 设计者分子公司 二酰亚胺连接的马来酰亚胺和聚马来酰亚胺化合物
US7884174B2 (en) 2003-05-05 2011-02-08 Designer Molecules, Inc. Imide-linked maleimide and polymaleimide compounds
US7157587B2 (en) * 2003-05-05 2007-01-02 Designer Molecules, Inc. Imide-extended liquid bismaleimide resin
US7271227B1 (en) 2004-04-20 2007-09-18 Henkel Corporation Adhesive compositions free of metallic catalyst
US7037447B1 (en) 2003-07-23 2006-05-02 Henkel Corporation Conductive ink compositions
CN1930263B (zh) * 2004-03-19 2012-02-29 住友电木株式会社 树脂组合物及采用该树脂组合物制作的半导体装置
SG157966A1 (en) * 2004-04-30 2010-01-29 Advanced Applied Adhesives Imide-linked maleimide and polymaleimide compounds
JP2008501826A (ja) * 2004-06-04 2008-01-24 デジグナー モレキュールズ インコーポレイテッド フリーラジカル硬化可能なポリエステル類およびその使用方法
US7875688B2 (en) * 2004-06-04 2011-01-25 Designer Molecules, Inc. Free-radical curable polyesters and methods for use thereof
JP4810875B2 (ja) * 2004-06-09 2011-11-09 三菱瓦斯化学株式会社 硬化性樹脂組成物
US7795362B2 (en) * 2004-07-16 2010-09-14 Designer Molecules, Inc. Olefin oligomers containing pendant maleimide groups
US8043534B2 (en) 2005-10-21 2011-10-25 Designer Molecules, Inc. Maleimide compositions and methods for use thereof
US8378017B2 (en) * 2005-12-29 2013-02-19 Designer Molecules, Inc. Thermosetting adhesive compositions
CN101415769A (zh) * 2006-03-29 2009-04-22 国家淀粉及化学投资控股公司 辐射固化橡胶粘合剂/密封剂
US8530573B2 (en) 2006-05-10 2013-09-10 Designer Molecules, Inc. Modified calcium carbonate-filled adhesive compositions and methods for use thereof
US7691475B2 (en) * 2006-07-21 2010-04-06 3M Innovative Properties Company Anisotropic conductive adhesives
US8287686B2 (en) * 2006-07-24 2012-10-16 Designer Molecules, Inc. Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof
WO2008077140A2 (en) * 2006-12-19 2008-06-26 Designer Molecules, Inc. Hydrolytically resistant thermoset monomers
WO2008077141A1 (en) * 2006-12-19 2008-06-26 Designer Molecules, Inc. Rubber epoxy curatives and methods for use thereof
WO2008092168A2 (en) * 2007-01-26 2008-07-31 Designer Molecules, Inc. Methods for the preparation of imides, maleimides and maleimide-terminated polyimide compounds
US8431655B2 (en) * 2007-04-09 2013-04-30 Designer Molecules, Inc. Curatives for epoxy compositions
US20100113643A1 (en) * 2007-04-09 2010-05-06 Designer Molecules, Inc. Curatives for epoxy adhesive compositions
US8039663B2 (en) 2007-04-09 2011-10-18 Designer Molecules, Inc. Monomers derived from pentacyclopentadecane dimethanol
US7868113B2 (en) 2007-04-11 2011-01-11 Designer Molecules, Inc. Low shrinkage polyester thermosetting resins
WO2008128209A1 (en) * 2007-04-12 2008-10-23 Designer Molecules, Inc. Polyfunctional epoxy oligomers
US8063161B2 (en) * 2007-04-16 2011-11-22 Designer Molecules, Inc. Low temperature curing acrylate and maleimide based formulations and methods for use thereof
US7928153B2 (en) 2007-08-14 2011-04-19 Designer Molecules, Inc. Thermosetting polyether oligomers, compositions and methods for use thereof
WO2009035958A2 (en) * 2007-09-13 2009-03-19 3M Innovative Properties Company Low temperature bonding electronic adhesives
WO2009045081A2 (en) 2007-10-02 2009-04-09 Lg Chem, Ltd. Curing composition and cured product prepared by using the same
US8398898B2 (en) * 2008-02-23 2013-03-19 Designer Molecules, Inc. Soluble metal salts for use as conductivity promoters
WO2009117345A2 (en) 2008-03-17 2009-09-24 Henkel Corporation Adhesive compositions for use in die attach applications
WO2009117729A2 (en) 2008-03-21 2009-09-24 Designer Molecules, Inc. Anti-bleed compounds, compositions and methods for use thereof
US8308892B2 (en) 2008-04-09 2012-11-13 Designer Molecules, Inc. Di-cinnamyl compounds and methods for use thereof
US7851930B1 (en) 2008-06-04 2010-12-14 Henkel Corporation Conductive adhesive compositions containing an alloy filler material for better dispense and thermal properties
WO2010016946A2 (en) * 2008-08-08 2010-02-11 Henkel Corporation Low temperature curing compositions
US8008419B2 (en) * 2008-08-13 2011-08-30 Designer Molecules, Inc. Siloxane monomers and methods for use thereof
US8158748B2 (en) 2008-08-13 2012-04-17 Designer Molecules, Inc. Hetero-functional compounds and methods for use thereof
US8013104B2 (en) * 2008-08-13 2011-09-06 Designer Molecules, Inc. Thermosetting hyperbranched compositions and methods for use thereof
US8637611B2 (en) 2008-08-13 2014-01-28 Designer Molecules, Inc. Amide-extended crosslinking compounds and methods for use thereof
US8217120B2 (en) * 2008-08-13 2012-07-10 Designer Molecules, Inc. Functionalized styrene oligomers and polymers
US8288591B2 (en) * 2008-11-20 2012-10-16 Designer Molecules, Inc. Curing agents for epoxy resins
EP2391690A2 (de) * 2009-02-02 2011-12-07 Lord Corporation Baukleber mit maleinimidterminierten polyimiden
US20090200013A1 (en) * 2009-04-23 2009-08-13 Bernadette Craster Well tubular, coating system and method for oilfield applications
US8415812B2 (en) * 2009-09-03 2013-04-09 Designer Molecules, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8710682B2 (en) * 2009-09-03 2014-04-29 Designer Molecules Inc, Inc. Materials and methods for stress reduction in semiconductor wafer passivation layers
US8698320B2 (en) * 2009-12-07 2014-04-15 Henkel IP & Holding GmbH Curable resin compositions useful as underfill sealants for use with low-k dielectric-containing semiconductor devices
US8936111B2 (en) 2010-03-06 2015-01-20 Halliburton Energy Services, Inc. Invert drilling fluids having enhanced rheology and methods of drilling boreholes
US8686162B2 (en) 2010-08-25 2014-04-01 Designer Molecules Inc, Inc. Maleimide-functional monomers in amorphous form
US8816021B2 (en) 2010-09-10 2014-08-26 Designer Molecules, Inc. Curable composition with rubber-like properties
JP6303407B2 (ja) * 2012-12-03 2018-04-04 Jnc株式会社 硬化性組成物およびその用途
EP3331959B1 (de) * 2015-08-08 2022-10-05 Designer Molecules, Inc. Anionische härtbare zusammensetzungen
US11416046B2 (en) 2015-11-05 2022-08-16 Henkel Ag & Co. Kgaa Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
CN105461927A (zh) * 2015-11-27 2016-04-06 国联汽车动力电池研究院有限责任公司 一种可长期保存的双马来酰亚胺聚合物及其制备方法
TWI804615B (zh) * 2018-05-18 2023-06-11 日商信越化學工業股份有限公司 半導體密封用熱固性馬來醯亞胺樹脂組合物及半導體裝置
JP7213050B2 (ja) * 2018-09-28 2023-01-26 京セラ株式会社 電極形成用樹脂組成物並びにチップ型電子部品及びその製造方法
DE102021110210A1 (de) 2021-04-22 2022-10-27 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Verfahren zum Herstellen eines optischen Moduls und optisches Modul

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4193829A (en) * 1977-03-16 1980-03-18 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process for the manufacture of low density bis-maleimide-carbon microballoon composites
US4581461A (en) * 1983-04-07 1986-04-08 National Starch And Chemical Corporation Maleated siloxane derivatives
US4621122A (en) * 1984-06-05 1986-11-04 Minnesota Mining And Manufacturing Company High-temperature resistant electrically insulating coating powder
US4578328A (en) * 1984-07-09 1986-03-25 General Electric Company Photopatternable polyimide compositions and method for making
DE3578571D1 (de) * 1985-01-19 1990-08-09 Sumitomo Chemical Co Kautschukmischung.
USH424H (en) * 1985-02-21 1988-02-02 The United States Of America As Represented By The Secretary Of The Navy Method of synthesizing the bismaleimide of dimer diamine via cyclodehydration
NL8501660A (nl) * 1985-06-08 1987-01-02 Dsm Resins Bv Bismaleimide samenstellingen.
US5364700A (en) * 1985-12-27 1994-11-15 Amoco Corporation Prepregable resin composition and composite
US4740830A (en) * 1986-06-04 1988-04-26 W. R. Grace & Co. Low temperature single step curing polyimide adhesive
CA1274048A (en) * 1986-07-15 1990-09-11 Linda A. Domeier Bismaleimide formulations containing olefinic ether modifiers
US4743642A (en) * 1986-09-08 1988-05-10 The Dow Chemical Company Color balanced rubber-reinforced plastic
US4904360A (en) * 1986-09-12 1990-02-27 Minnesota Mining And Manufacturing Company Water-compatible coating composition
US4806608A (en) * 1987-03-16 1989-02-21 Loctite Corporation Curable siloxane maleimide composition
DE4032004A1 (de) * 1990-10-09 1992-04-16 Basf Ag Ultraduenne thermoplastische bismaleinimidschichten sowie ein verfahren zu ihrer herstellung
NL9002758A (nl) * 1990-12-14 1992-07-01 Stamicarbon Eindloze voorwerpen uit thermohardbare monomeren.
US5153248A (en) * 1991-10-10 1992-10-06 The Goodyear Tire & Rubber Company Sulfur vulcanized rubber compounds containing silica and aromatic bismaleimide
WO1993020562A1 (en) * 1992-04-03 1993-10-14 Thermoset Plastics, Inc. Conductor-filled thermosetting resin
WO1993025386A1 (en) * 1992-06-16 1993-12-23 Ensign-Bickford Coatings Company Thermally resistant glass article
US5262488A (en) * 1992-08-26 1993-11-16 The Goodyear Tire & Rubber Company Rubber vulcanization composition with bis-(2,5-polythio-1,3,4 thiadiazole)
US5380768A (en) * 1993-05-20 1995-01-10 Martin Marietta Corporation Foam, Foam-resin composite and method of making a foam-resin composite
JP2531464B2 (ja) * 1993-12-10 1996-09-04 日本電気株式会社 半導体パッケ―ジ

Also Published As

Publication number Publication date
KR100421595B1 (ko) 2004-05-31
US6034195A (en) 2000-03-07
US6034194A (en) 2000-03-07
CN101209987A (zh) 2008-07-02

Similar Documents

Publication Publication Date Title
ATE546830T1 (de) Mikro-elektronischer aufbau
WO1996007691A3 (en) Thermosetting resin compositions containing maleimide and/or vinyl compounds
DE68910254D1 (de) Niedrigviskoser, druckempfindlicher, elastomerer Klebstoff auf der Basis von Siloxanen.
DE69811283D1 (de) Flüssige, härtbare Harzzusammensetzung
DE69011173D1 (de) Druckempfindliche Klebestoffe auf der Basis von additionshärtbaren Siloxanen.
FR2768150B1 (fr) Liant bitumineux, composition et utilisation
ATE454422T1 (de) Epoxy-polysiloxan-polymer-zusammensetzung
DE3679432D1 (de) Blockcopolymer enthaltende druckempfindliche klebemittelzusammensetzung.
DE69625938D1 (de) Klebstoffzusammensetzung auf der basis von niedrig-alkenyl substituierten polysiloxane
DE69801448D1 (de) Flüssige, härtbare harzzusammensetzung
EP0914027A4 (de) Klebefilm zum verbinden einer schaltung und einer leiterplatte
CA2313326A1 (en) Curable resin compositions
ES8704988A1 (es) Procedimiento para proporcionar una capa adhesiva sensible a la presion sobre un substrato
DE69701216D1 (de) Heiss-schmelz druckempfindlicher klebstoff mit kohäsivem abbruch
DE69410347D1 (de) Durch Feuchtigkeit vernetzbare, druckempfindliche Schmelzklebstoffe auf Basis von Polysiloxanen
DK263686A (da) Polymerkomposition, der kan tvaerbindes
EP0596622A3 (de) Gegen hohe Temperaturen beständige Epoxidharzstrukturklebstoffzusammensetzung.
DK0819749T3 (da) Klæbemiddelsammensætning
NO20000084D0 (no) Fenolisk harpiks for limblanding, fremstilling derav og limpreparat inneholdende harpiksen
DE69014372D1 (de) Organosiliconharzbeschichtungszusammensetzungen.
DE69007371D1 (de) Polymerzusammensetzung, Klebemittel und etikettiertes Glasmaterial.
DE68911208D1 (de) Selbstklebende, härtbare Organopolysiloxanzusammensetzung.
DE69400942D1 (de) Durch Feuchtigkeit vernetzbare, druckempfindliche Schmelzklebstoffe auf Basis von Oxim-funktionellen Polysiloxanen
IT1276702B1 (it) Adesivo termofusibile basato su copolimeri etilene/(met) acrilato
ATE251877T1 (de) Selbstklebende bandage