ATE546489T1 - Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand - Google Patents

Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand

Info

Publication number
ATE546489T1
ATE546489T1 AT05768174T AT05768174T ATE546489T1 AT E546489 T1 ATE546489 T1 AT E546489T1 AT 05768174 T AT05768174 T AT 05768174T AT 05768174 T AT05768174 T AT 05768174T AT E546489 T1 ATE546489 T1 AT E546489T1
Authority
AT
Austria
Prior art keywords
composition
aromatic polyamide
composition containing
containing aromatic
total weight
Prior art date
Application number
AT05768174T
Other languages
English (en)
Inventor
Christie Crowe
Masahiko Saito
Original Assignee
Solvay Specialty Polymers Usa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34973062&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE546489(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Solvay Specialty Polymers Usa filed Critical Solvay Specialty Polymers Usa
Application granted granted Critical
Publication of ATE546489T1 publication Critical patent/ATE546489T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
AT05768174T 2004-07-01 2005-06-29 Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand ATE546489T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58413404P 2004-07-01 2004-07-01
PCT/US2005/023645 WO2006007580A1 (en) 2004-07-01 2005-06-29 Aromatic polyamide composition and article manufactured therefrom

Publications (1)

Publication Number Publication Date
ATE546489T1 true ATE546489T1 (de) 2012-03-15

Family

ID=34973062

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05768174T ATE546489T1 (de) 2004-07-01 2005-06-29 Aromatisches polyamid enthaltende zusammensetzung und daraus hergestellter gegenstand

Country Status (9)

Country Link
US (3) US20080167404A1 (de)
EP (1) EP1791910B1 (de)
JP (2) JP5128942B2 (de)
KR (1) KR20070046797A (de)
CN (1) CN101006136B (de)
AT (1) ATE546489T1 (de)
MY (1) MY150093A (de)
TW (1) TWI428391B (de)
WO (1) WO2006007580A1 (de)

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CN101977976B (zh) * 2008-03-20 2014-08-27 帝斯曼知识产权资产管理有限公司 导热塑料材料的热沉
KR101231020B1 (ko) * 2009-12-28 2013-02-07 제일모직주식회사 반사성, 내충격성, 내열성 및 내습성이 우수한 폴리아마이드 수지 조성물 및 그 제조방법
KR20110075703A (ko) * 2009-12-28 2011-07-06 제일모직주식회사 반사성, 내충격성, 내열성 및 내습성이 우수한 폴리아마이드 수지 조성물 및 그 제조방법
WO2012026413A1 (ja) * 2010-08-27 2012-03-01 東洋紡績株式会社 表面実装型ｌｅｄ用反射板に使用するポリアミド樹脂組成物
CA2812453A1 (en) 2010-09-23 2012-03-29 Invista Technologies S.A.R.L. Flame retardant fibers, yarns, and fabrics made therefrom
US9321918B2 (en) * 2010-10-13 2016-04-26 Solvay Specialty Polymers Usa, Llc Stain-resistant articles
CN102372921B (zh) 2011-10-10 2013-05-08 金发科技股份有限公司 一种耐热聚酰胺组合物及其应用
DE102012104308A1 (de) * 2012-05-18 2013-11-21 Ensinger Gmbh Polymerwerkstoff, insbesondere für tribologische Anwendungen
TWI541278B (zh) * 2012-12-18 2016-07-11 夸茲沃克公司 導熱性塑膠材料
CN103509339B (zh) * 2013-09-24 2017-01-04 惠州市集和光电科技有限公司 一种高性能高遮光ppa聚合物及其制备方法和应用
ES2662019T3 (es) * 2013-10-15 2018-04-05 Lanxess Deutschland Gmbh Masas de moldeo termoplásticas
CN103804792A (zh) * 2014-01-17 2014-05-21 东莞市基一光电科技有限公司 一种导热反光型热塑性模塑材料及其应用
EP2924062B1 (de) * 2014-03-27 2019-02-13 LANXESS Deutschland GmbH Flammwidrige Polyamidzusammensetzungen
EP3472233A1 (de) * 2016-06-21 2019-04-24 SABIC Global Technologies B.V. Polymerzusammensetzungen mit reflexionsvermögen und wärmeleitfähigkeit
JP2020152762A (ja) * 2019-03-18 2020-09-24 三井化学株式会社 半芳香族ポリアミド樹脂組成物およびその成形体
CA3171137A1 (en) 2019-03-28 2020-10-01 Southern Mills, Inc. Flame resistant fabrics
CA3226759A1 (en) 2021-08-10 2023-02-16 Robert Self Flame resistant fabrics

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Also Published As

Publication number Publication date
CN101006136A (zh) 2007-07-25
JP5128942B2 (ja) 2013-01-23
US20160046808A1 (en) 2016-02-18
US20080167404A1 (en) 2008-07-10
JP5650694B2 (ja) 2015-01-07
EP1791910A1 (de) 2007-06-06
JP2012229439A (ja) 2012-11-22
MY150093A (en) 2013-11-29
TWI428391B (zh) 2014-03-01
WO2006007580A1 (en) 2006-01-19
EP1791910B1 (de) 2012-02-22
US20150197635A1 (en) 2015-07-16
JP2008505223A (ja) 2008-02-21
TW200613448A (en) 2006-05-01
CN101006136B (zh) 2011-08-31
KR20070046797A (ko) 2007-05-03

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