ATE541890T1 - Verminderung von dielektrischen verlusten durch die verwendung von organoton in halbleiter- oder isolatorzusammensetzungen - Google Patents

Verminderung von dielektrischen verlusten durch die verwendung von organoton in halbleiter- oder isolatorzusammensetzungen

Info

Publication number
ATE541890T1
ATE541890T1 AT08843776T AT08843776T ATE541890T1 AT E541890 T1 ATE541890 T1 AT E541890T1 AT 08843776 T AT08843776 T AT 08843776T AT 08843776 T AT08843776 T AT 08843776T AT E541890 T1 ATE541890 T1 AT E541890T1
Authority
AT
Austria
Prior art keywords
dielectric losses
organoclay
semiconductor
reducing dielectric
insulator compositions
Prior art date
Application number
AT08843776T
Other languages
German (de)
English (en)
Inventor
Timothy Person
Robert Eaton
Original Assignee
Union Carbide Chem Plastic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40429787&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE541890(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Union Carbide Chem Plastic filed Critical Union Carbide Chem Plastic
Application granted granted Critical
Publication of ATE541890T1 publication Critical patent/ATE541890T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
AT08843776T 2007-11-02 2008-10-15 Verminderung von dielektrischen verlusten durch die verwendung von organoton in halbleiter- oder isolatorzusammensetzungen ATE541890T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US98481307P 2007-11-02 2007-11-02
PCT/US2008/079915 WO2009058560A1 (en) 2007-11-02 2008-10-15 Reduction of dielectric losses through use organoclay in semiconductor or insulator compositions

Publications (1)

Publication Number Publication Date
ATE541890T1 true ATE541890T1 (de) 2012-02-15

Family

ID=40429787

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08843776T ATE541890T1 (de) 2007-11-02 2008-10-15 Verminderung von dielektrischen verlusten durch die verwendung von organoton in halbleiter- oder isolatorzusammensetzungen

Country Status (11)

Country Link
US (2) US9959951B2 (cg-RX-API-DMAC7.html)
EP (1) EP2215158B1 (cg-RX-API-DMAC7.html)
JP (1) JP5473926B2 (cg-RX-API-DMAC7.html)
KR (1) KR101461700B1 (cg-RX-API-DMAC7.html)
CN (1) CN101918486B (cg-RX-API-DMAC7.html)
AT (1) ATE541890T1 (cg-RX-API-DMAC7.html)
BR (1) BRPI0817164A2 (cg-RX-API-DMAC7.html)
CA (1) CA2703974C (cg-RX-API-DMAC7.html)
MX (1) MX2010004829A (cg-RX-API-DMAC7.html)
TW (1) TW200936665A (cg-RX-API-DMAC7.html)
WO (1) WO2009058560A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101938440B1 (ko) * 2011-12-13 2019-01-14 다우 글로벌 테크놀로지스 엘엘씨 에틸렌-프로필렌-디엔 혼성중합체 조성물
EA034758B1 (ru) 2014-08-19 2020-03-17 Бореалис Аг Новая сшитая полимерная композиция, структурный слой и кабель
US20160104555A1 (en) * 2014-10-10 2016-04-14 General Electric Company Method for improving the electric field distribution in a high voltage direct current cable
BR112017026153B1 (pt) * 2015-06-17 2022-05-10 Dow Global Technologies Llc Composição, processo de fabricação de um fio ou cabo isolado e fio ou cabo de baixa, média, alta ou extra alta tensão
BR112023003076A2 (pt) 2020-08-21 2023-03-21 Dow Global Technologies Llc Não tecido fundido e soprado formado a partir de uma composição, e, filtro de ar
US20240425687A1 (en) 2021-10-05 2024-12-26 Borealis Ag Cable

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627194B2 (ja) * 1989-07-31 1997-07-02 株式会社豊田中央研究所 ポリエステル複合材料及びその製造方法
JPH0652728A (ja) * 1992-07-31 1994-02-25 Showa Electric Wire & Cable Co Ltd 電力ケーブル
JP3349747B2 (ja) * 1993-02-26 2002-11-25 株式会社フジクラ 絶縁組成物および電力ケーブル
US5780376A (en) * 1996-02-23 1998-07-14 Southern Clay Products, Inc. Organoclay compositions
JP2000508021A (ja) * 1996-12-31 2000-06-27 ザ ダウ ケミカル カンパニー ポリマー―オルガノクレー複合材料およびそれらの調製
FR2793592B1 (fr) * 1999-03-04 2001-06-08 Cit Alcatel Cable d'energie ayant des caracteristiques mecaniques, thermiques, electriques, et de tenue au feu sensiblement ameliorees
US6524702B1 (en) * 1999-08-12 2003-02-25 Dow Global Technologies Inc. Electrical devices having polymeric members
US6737464B1 (en) 2000-05-30 2004-05-18 University Of South Carolina Research Foundation Polymer nanocomposite comprising a matrix polymer and a layered clay material having a low quartz content
US6740396B2 (en) * 2001-02-26 2004-05-25 Pirelli Cavi E Sistemi S.P.A. Cable with coating of a composite material
JP2003022710A (ja) 2001-07-06 2003-01-24 Toshiba Corp 低誘電型絶縁材料とその製造方法
US6825253B2 (en) * 2002-07-22 2004-11-30 General Cable Technologies Corporation Insulation compositions containing metallocene polymers
JP5091389B2 (ja) 2002-09-10 2012-12-05 ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー 溶融強度および物理特性が強化されたポリプロピレンケーブル被覆組成物
US7226422B2 (en) * 2002-10-09 2007-06-05 Cardiac Pacemakers, Inc. Detection of congestion from monitoring patient response to a recumbent position
US7144934B2 (en) * 2002-10-24 2006-12-05 Dow Global Technologies Inc. Charge dissipation modifiers for olefinic interpolymer compositions
CN1823123B (zh) * 2003-06-09 2011-07-27 联合碳化化学及塑料技术有限责任公司 可剥离半导体绝缘屏蔽
US20070012468A1 (en) * 2003-09-25 2007-01-18 Han Suh J Strippable semiconductive shield and compositions therefor
JP2006028208A (ja) * 2004-07-12 2006-02-02 Fujikura Ltd 低誘電性・耐熱性樹脂組成物、これを用いた成形品及びプリント回路基板

Also Published As

Publication number Publication date
US20110100675A1 (en) 2011-05-05
CN101918486B (zh) 2016-05-11
TW200936665A (en) 2009-09-01
CA2703974A1 (en) 2009-05-07
KR101461700B1 (ko) 2014-11-17
CN101918486A (zh) 2010-12-15
US10354775B2 (en) 2019-07-16
MX2010004829A (es) 2010-07-28
CA2703974C (en) 2017-03-07
JP5473926B2 (ja) 2014-04-16
WO2009058560A1 (en) 2009-05-07
BRPI0817164A2 (pt) 2016-08-09
US9959951B2 (en) 2018-05-01
EP2215158B1 (en) 2012-01-18
EP2215158A1 (en) 2010-08-11
US20180211742A1 (en) 2018-07-26
JP2011503784A (ja) 2011-01-27
KR20100099688A (ko) 2010-09-13

Similar Documents

Publication Publication Date Title
ATE541890T1 (de) Verminderung von dielektrischen verlusten durch die verwendung von organoton in halbleiter- oder isolatorzusammensetzungen
MX359177B (es) Proceso para la reduccion de la migracion de peroxido en composiciones de polimero a base de etileno reticulable.
WO2012060662A3 (ko) 절연 조성물 및 이를 포함하는 전기 케이블
EP2545562A4 (en) INSULATOR COMPRISING MICRO-OXIDE PARTICLES AND CABLE USING THE SAME
EA200802022A1 (ru) Слой для кабелей, обладающий улучшенным сопротивлением побелению при нагрузке
BR112012011265A2 (pt) cabo e processo de produção do mesmo
BRPI1007604A2 (pt) "estrutura de semicondutor com ajuste de tensão de limiar através de modificação em empilhamento de portas dielétricas e método de formação de tal estrutura"
WO2011097302A3 (en) Semiconductor electronic components and circuits
BR112013011084A2 (pt) "composição polimérica e um cabo elétrico compreendendo a composição polimérica"
JP2015179838A5 (cg-RX-API-DMAC7.html)
JP2011129888A5 (ja) 記憶装置
SG171552A1 (en) Reserve power supply with electrode plates clipping with auxiliary conductors
FR3008223B1 (fr) Materiau composite electriquement isolant, procede de fabrication d'un tel materiau et son utilisation en tant qu'isolant electrique
EP2586111A4 (en) cable gland
MX2010000557A (es) Fundas de cable de energia de perdida dielectrica baja que comprenden poliolefinas de alta presion libres de funcionalidad de silano.
WO2010078340A3 (en) Semiconductor devices including dual gate structures and methods of forming such semiconductor devices
JP2011124560A5 (cg-RX-API-DMAC7.html)
FR2937041B1 (fr) Composition semi-conductrice pour cables electriques
PL379622A1 (pl) Niskonapięciowy przewód elektryczny z warstwą izolacyjną zawierającą poliolefinę z grupami polarnymi
MX381945B (es) Composiciones reticulables con peroxido y procesos para su manufactura.
WO2013102631A3 (fr) Structure semiconductrice, dispositif comportant une telle structure et procede de fabrication d'une structure semiconductrice
DE502007006189D1 (de) Piezoaktor mit mehrschicht-verkapselung und verfahren zu seiner herstellung
GB2479150B (en) Transistor and its method of manufacture
DE602008001969D1 (de) Designs für elektrische medizinische führungselemente mit energieableitendem shunt
CN203150269U (zh) 一种超高压电力电缆