MX2010004829A - Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor. - Google Patents

Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor.

Info

Publication number
MX2010004829A
MX2010004829A MX2010004829A MX2010004829A MX2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A
Authority
MX
Mexico
Prior art keywords
dielectric losses
reduction
organoclay
semiconductor
insulator compositions
Prior art date
Application number
MX2010004829A
Other languages
English (en)
Inventor
Timothy J Person
Robert F Eaton
Original Assignee
Union Carbide Chem Plastic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40429787&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2010004829(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Union Carbide Chem Plastic filed Critical Union Carbide Chem Plastic
Publication of MX2010004829A publication Critical patent/MX2010004829A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
  • Laminated Bodies (AREA)

Abstract

Organoarcillas son adicionadas a composiciones semiconductoras para proporcionar una reducción en las pérdidas dieléctricas de compuestos en capas, en las cuales la capa semiconductora contiene especies que podrían migrar hacia el aislamiento y resultar en pérdidas dieléctricas indeseablemente altas. Las composiciones semiconductoras de la invención proporcionan el desempeño mejorado en aplicaciones de cable de energía.
MX2010004829A 2007-11-02 2008-10-15 Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor. MX2010004829A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US98481307P 2007-11-02 2007-11-02
PCT/US2008/079915 WO2009058560A1 (en) 2007-11-02 2008-10-15 Reduction of dielectric losses through use organoclay in semiconductor or insulator compositions

Publications (1)

Publication Number Publication Date
MX2010004829A true MX2010004829A (es) 2010-07-28

Family

ID=40429787

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010004829A MX2010004829A (es) 2007-11-02 2008-10-15 Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor.

Country Status (11)

Country Link
US (2) US9959951B2 (es)
EP (1) EP2215158B1 (es)
JP (1) JP5473926B2 (es)
KR (1) KR101461700B1 (es)
CN (1) CN101918486B (es)
AT (1) ATE541890T1 (es)
BR (1) BRPI0817164A2 (es)
CA (1) CA2703974C (es)
MX (1) MX2010004829A (es)
TW (1) TW200936665A (es)
WO (1) WO2009058560A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX357976B (es) * 2011-12-13 2018-08-01 Dow Global Technologies Llc Composicion de interpolimero de etileno-propileno-dieno.
CN106660296A (zh) 2014-08-19 2017-05-10 博里利斯股份公司 新的交联聚合物组合物、结构化层及电缆
US20160104555A1 (en) * 2014-10-10 2016-04-14 General Electric Company Method for improving the electric field distribution in a high voltage direct current cable
EP3985060A1 (en) 2015-06-17 2022-04-20 Dow Global Technologies Llc Process for making crosslinked cable insulation using high melt strength ethylene-based polymer made in a tubular reactor and optionally modified with a branching agent
WO2023057519A1 (en) 2021-10-05 2023-04-13 Borealis Ag Cable

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627194B2 (ja) * 1989-07-31 1997-07-02 株式会社豊田中央研究所 ポリエステル複合材料及びその製造方法
JPH0652728A (ja) * 1992-07-31 1994-02-25 Showa Electric Wire & Cable Co Ltd 電力ケーブル
JP3349747B2 (ja) * 1993-02-26 2002-11-25 株式会社フジクラ 絶縁組成物および電力ケーブル
US5780376A (en) * 1996-02-23 1998-07-14 Southern Clay Products, Inc. Organoclay compositions
PL328862A1 (en) * 1996-12-31 1999-03-01 Dow Chemical Co Polymer/organocaly composites and their production
FR2793592B1 (fr) * 1999-03-04 2001-06-08 Cit Alcatel Cable d'energie ayant des caracteristiques mecaniques, thermiques, electriques, et de tenue au feu sensiblement ameliorees
US6524702B1 (en) * 1999-08-12 2003-02-25 Dow Global Technologies Inc. Electrical devices having polymeric members
US6737464B1 (en) 2000-05-30 2004-05-18 University Of South Carolina Research Foundation Polymer nanocomposite comprising a matrix polymer and a layered clay material having a low quartz content
US6740396B2 (en) * 2001-02-26 2004-05-25 Pirelli Cavi E Sistemi S.P.A. Cable with coating of a composite material
JP2003022710A (ja) 2001-07-06 2003-01-24 Toshiba Corp 低誘電型絶縁材料とその製造方法
US6825253B2 (en) * 2002-07-22 2004-11-30 General Cable Technologies Corporation Insulation compositions containing metallocene polymers
ATE380385T1 (de) * 2002-09-10 2007-12-15 Union Carbide Chem Plastic Kabelummantelungs-zusammensetzungen aus polypropylen mit verbesserter schmelzstärke und physikalischen eigenschaften
US7226422B2 (en) * 2002-10-09 2007-06-05 Cardiac Pacemakers, Inc. Detection of congestion from monitoring patient response to a recumbent position
US7144934B2 (en) * 2002-10-24 2006-12-05 Dow Global Technologies Inc. Charge dissipation modifiers for olefinic interpolymer compositions
WO2005017014A1 (en) 2003-06-09 2005-02-24 Union Carbide Chemicals & Plastics Technology Corporation Strippable semi-conductive insulation shield
WO2005031761A1 (en) * 2003-09-25 2005-04-07 Dow Global Technologies Inc. Strippable semiconductive shield and compositions therefor
JP2006028208A (ja) * 2004-07-12 2006-02-02 Fujikura Ltd 低誘電性・耐熱性樹脂組成物、これを用いた成形品及びプリント回路基板

Also Published As

Publication number Publication date
WO2009058560A1 (en) 2009-05-07
CA2703974C (en) 2017-03-07
JP5473926B2 (ja) 2014-04-16
KR20100099688A (ko) 2010-09-13
US10354775B2 (en) 2019-07-16
US20110100675A1 (en) 2011-05-05
US9959951B2 (en) 2018-05-01
US20180211742A1 (en) 2018-07-26
CN101918486B (zh) 2016-05-11
JP2011503784A (ja) 2011-01-27
CA2703974A1 (en) 2009-05-07
EP2215158A1 (en) 2010-08-11
TW200936665A (en) 2009-09-01
CN101918486A (zh) 2010-12-15
EP2215158B1 (en) 2012-01-18
BRPI0817164A2 (pt) 2016-08-09
KR101461700B1 (ko) 2014-11-17
ATE541890T1 (de) 2012-02-15

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