MX2010004829A - Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor. - Google Patents

Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor.

Info

Publication number
MX2010004829A
MX2010004829A MX2010004829A MX2010004829A MX2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A MX 2010004829 A MX2010004829 A MX 2010004829A
Authority
MX
Mexico
Prior art keywords
dielectric losses
reduction
organoclay
semiconductor
insulator compositions
Prior art date
Application number
MX2010004829A
Other languages
English (en)
Spanish (es)
Inventor
Timothy J Person
Robert F Eaton
Original Assignee
Union Carbide Chem Plastic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40429787&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MX2010004829(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Union Carbide Chem Plastic filed Critical Union Carbide Chem Plastic
Publication of MX2010004829A publication Critical patent/MX2010004829A/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Laminated Bodies (AREA)
  • Inorganic Insulating Materials (AREA)
  • Insulated Conductors (AREA)
  • Communication Cables (AREA)
MX2010004829A 2007-11-02 2008-10-15 Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor. MX2010004829A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US98481307P 2007-11-02 2007-11-02
PCT/US2008/079915 WO2009058560A1 (en) 2007-11-02 2008-10-15 Reduction of dielectric losses through use organoclay in semiconductor or insulator compositions

Publications (1)

Publication Number Publication Date
MX2010004829A true MX2010004829A (es) 2010-07-28

Family

ID=40429787

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2010004829A MX2010004829A (es) 2007-11-02 2008-10-15 Reduccion de perdidas dielectricas a traves del uso de organoarcilla en composiciones de aislante o semiconductor.

Country Status (11)

Country Link
US (2) US9959951B2 (cg-RX-API-DMAC7.html)
EP (1) EP2215158B1 (cg-RX-API-DMAC7.html)
JP (1) JP5473926B2 (cg-RX-API-DMAC7.html)
KR (1) KR101461700B1 (cg-RX-API-DMAC7.html)
CN (1) CN101918486B (cg-RX-API-DMAC7.html)
AT (1) ATE541890T1 (cg-RX-API-DMAC7.html)
BR (1) BRPI0817164A2 (cg-RX-API-DMAC7.html)
CA (1) CA2703974C (cg-RX-API-DMAC7.html)
MX (1) MX2010004829A (cg-RX-API-DMAC7.html)
TW (1) TW200936665A (cg-RX-API-DMAC7.html)
WO (1) WO2009058560A1 (cg-RX-API-DMAC7.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101938440B1 (ko) * 2011-12-13 2019-01-14 다우 글로벌 테크놀로지스 엘엘씨 에틸렌-프로필렌-디엔 혼성중합체 조성물
EA034758B1 (ru) 2014-08-19 2020-03-17 Бореалис Аг Новая сшитая полимерная композиция, структурный слой и кабель
US20160104555A1 (en) * 2014-10-10 2016-04-14 General Electric Company Method for improving the electric field distribution in a high voltage direct current cable
BR112017026153B1 (pt) * 2015-06-17 2022-05-10 Dow Global Technologies Llc Composição, processo de fabricação de um fio ou cabo isolado e fio ou cabo de baixa, média, alta ou extra alta tensão
BR112023003076A2 (pt) 2020-08-21 2023-03-21 Dow Global Technologies Llc Não tecido fundido e soprado formado a partir de uma composição, e, filtro de ar
US20240425687A1 (en) 2021-10-05 2024-12-26 Borealis Ag Cable

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2627194B2 (ja) * 1989-07-31 1997-07-02 株式会社豊田中央研究所 ポリエステル複合材料及びその製造方法
JPH0652728A (ja) * 1992-07-31 1994-02-25 Showa Electric Wire & Cable Co Ltd 電力ケーブル
JP3349747B2 (ja) * 1993-02-26 2002-11-25 株式会社フジクラ 絶縁組成物および電力ケーブル
US5780376A (en) * 1996-02-23 1998-07-14 Southern Clay Products, Inc. Organoclay compositions
JP2000508021A (ja) * 1996-12-31 2000-06-27 ザ ダウ ケミカル カンパニー ポリマー―オルガノクレー複合材料およびそれらの調製
FR2793592B1 (fr) * 1999-03-04 2001-06-08 Cit Alcatel Cable d'energie ayant des caracteristiques mecaniques, thermiques, electriques, et de tenue au feu sensiblement ameliorees
US6524702B1 (en) * 1999-08-12 2003-02-25 Dow Global Technologies Inc. Electrical devices having polymeric members
US6737464B1 (en) 2000-05-30 2004-05-18 University Of South Carolina Research Foundation Polymer nanocomposite comprising a matrix polymer and a layered clay material having a low quartz content
US6740396B2 (en) * 2001-02-26 2004-05-25 Pirelli Cavi E Sistemi S.P.A. Cable with coating of a composite material
JP2003022710A (ja) 2001-07-06 2003-01-24 Toshiba Corp 低誘電型絶縁材料とその製造方法
US6825253B2 (en) * 2002-07-22 2004-11-30 General Cable Technologies Corporation Insulation compositions containing metallocene polymers
JP5091389B2 (ja) 2002-09-10 2012-12-05 ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー 溶融強度および物理特性が強化されたポリプロピレンケーブル被覆組成物
US7226422B2 (en) * 2002-10-09 2007-06-05 Cardiac Pacemakers, Inc. Detection of congestion from monitoring patient response to a recumbent position
US7144934B2 (en) * 2002-10-24 2006-12-05 Dow Global Technologies Inc. Charge dissipation modifiers for olefinic interpolymer compositions
CN1823123B (zh) * 2003-06-09 2011-07-27 联合碳化化学及塑料技术有限责任公司 可剥离半导体绝缘屏蔽
US20070012468A1 (en) * 2003-09-25 2007-01-18 Han Suh J Strippable semiconductive shield and compositions therefor
JP2006028208A (ja) * 2004-07-12 2006-02-02 Fujikura Ltd 低誘電性・耐熱性樹脂組成物、これを用いた成形品及びプリント回路基板

Also Published As

Publication number Publication date
US20110100675A1 (en) 2011-05-05
CN101918486B (zh) 2016-05-11
TW200936665A (en) 2009-09-01
CA2703974A1 (en) 2009-05-07
KR101461700B1 (ko) 2014-11-17
CN101918486A (zh) 2010-12-15
US10354775B2 (en) 2019-07-16
CA2703974C (en) 2017-03-07
JP5473926B2 (ja) 2014-04-16
WO2009058560A1 (en) 2009-05-07
ATE541890T1 (de) 2012-02-15
BRPI0817164A2 (pt) 2016-08-09
US9959951B2 (en) 2018-05-01
EP2215158B1 (en) 2012-01-18
EP2215158A1 (en) 2010-08-11
US20180211742A1 (en) 2018-07-26
JP2011503784A (ja) 2011-01-27
KR20100099688A (ko) 2010-09-13

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