GB201005356D0 - Transistor and its method of manufacture - Google Patents

Transistor and its method of manufacture

Info

Publication number
GB201005356D0
GB201005356D0 GBGB1005356.9A GB201005356A GB201005356D0 GB 201005356 D0 GB201005356 D0 GB 201005356D0 GB 201005356 A GB201005356 A GB 201005356A GB 201005356 D0 GB201005356 D0 GB 201005356D0
Authority
GB
United Kingdom
Prior art keywords
layer
terminal
substrate
source
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB1005356.9A
Other versions
GB2479150A (en
GB2479150B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pragmatic Semiconductor Ltd
Original Assignee
Nano ePrint Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nano ePrint Ltd filed Critical Nano ePrint Ltd
Priority to GB1005356.9A priority Critical patent/GB2479150B/en
Publication of GB201005356D0 publication Critical patent/GB201005356D0/en
Priority to PCT/GB2011/050644 priority patent/WO2011121347A1/en
Priority to EP11711991.7A priority patent/EP2553718B1/en
Priority to US13/638,061 priority patent/US9263553B2/en
Priority to EP18208722.1A priority patent/EP3483920B1/en
Publication of GB2479150A publication Critical patent/GB2479150A/en
Application granted granted Critical
Publication of GB2479150B publication Critical patent/GB2479150B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742—Thin film unipolar transistors
    • H01L29/6675—Amorphous silicon or polysilicon transistors
    • H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1292—Multistep manufacturing methods using liquid deposition, e.g. printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Thin Film Transistor (AREA)

Abstract

A transistor includes a substrate, a source terminal and a drain terminal, each terminal being supported by the substrate, and the source and drain terminal being separated by a portion of the substrate, a layer of semiconductive material deposited so as to cover the portion of the substrate and to connect the source terminal to the drain terminal, a layer of dielectric material deposited so as to cover at least a portion of the layer of semiconductive material, and a layer of electrically conductive material deposited so as to cover at least a portion of the layer of dielectric material. The layer of electrically conductive material providing a gate terminal to which a potential may be applied to control a conductivity of the layer of semiconductive material connecting the source and drain terminals.
GB1005356.9A 2010-03-30 2010-03-30 Transistor and its method of manufacture Active GB2479150B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB1005356.9A GB2479150B (en) 2010-03-30 2010-03-30 Transistor and its method of manufacture
PCT/GB2011/050644 WO2011121347A1 (en) 2010-03-30 2011-03-29 Transistor and its method of manufacture
EP11711991.7A EP2553718B1 (en) 2010-03-30 2011-03-29 Transistor and its method of manufacture
US13/638,061 US9263553B2 (en) 2010-03-30 2011-03-29 Transistor and its method of manufacture
EP18208722.1A EP3483920B1 (en) 2010-03-30 2011-03-29 Transistor and its method of manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1005356.9A GB2479150B (en) 2010-03-30 2010-03-30 Transistor and its method of manufacture

Publications (3)

Publication Number Publication Date
GB201005356D0 true GB201005356D0 (en) 2010-05-12
GB2479150A GB2479150A (en) 2011-10-05
GB2479150B GB2479150B (en) 2013-05-15

Family

ID=42228617

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1005356.9A Active GB2479150B (en) 2010-03-30 2010-03-30 Transistor and its method of manufacture

Country Status (4)

Country Link
US (1) US9263553B2 (en)
EP (2) EP3483920B1 (en)
GB (1) GB2479150B (en)
WO (1) WO2011121347A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2489682B (en) 2011-03-30 2015-11-04 Pragmatic Printing Ltd Electronic device and its method of manufacture
GB2492442B (en) 2011-06-27 2015-11-04 Pragmatic Printing Ltd Transistor and its method of manufacture
GB2492532B (en) * 2011-06-27 2015-06-03 Pragmatic Printing Ltd Transistor and its method of manufacture
US9996173B2 (en) 2013-02-12 2018-06-12 Illinois Tool Works, Inc. Front panel overlay incorporating a logic circuit
EP2960280A1 (en) * 2014-06-26 2015-12-30 E.T.C. S.r.l. Photocrosslinkable compositions, patterned high k thin film dielectrics and related devices
KR20180054633A (en) * 2015-09-18 2018-05-24 고쿠리츠다이가쿠호진 호쿠리쿠 센단 가가쿠 기쥬츠 다이가쿠인 다이가쿠 Composite member and method for producing the composite member and aliphatic polycarbonate-containing layer
CN106847826B (en) * 2017-02-09 2021-01-15 京东方科技集团股份有限公司 Array substrate, display device and preparation method of array substrate

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB915250A (en) 1960-11-03 1963-01-09 Salter & Co Ltd G Improvements relating to weighing machines
GB920563A (en) 1961-08-09 1963-03-06 Lilly Co Eli Novel nitrogenous organic base and acid addition salts thereof and process for preparing same
JPH0580530A (en) * 1991-09-24 1993-04-02 Hitachi Ltd Production of thin film pattern
US5554488A (en) * 1994-07-28 1996-09-10 Northern Telecom Limited Semiconductor device structure and method of formation thereof
GB9623185D0 (en) 1996-11-09 1997-01-08 Epigem Limited Improved micro relief element and preparation thereof
GB9824023D0 (en) 1998-11-03 1998-12-30 Isis Innovation Surface functionalisation
TWI366218B (en) * 2004-06-01 2012-06-11 Semiconductor Energy Lab Method for manufacturing semiconductor device
GB2425401A (en) * 2005-04-21 2006-10-25 Stuart Philip Speakman Manufacture of microstructures using peelable mask
US7608892B2 (en) * 2006-04-28 2009-10-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method of the same
JP5111802B2 (en) * 2006-07-20 2013-01-09 三菱電機株式会社 Thin film transistor substrate and manufacturing method thereof
JP2008153416A (en) * 2006-12-18 2008-07-03 Hitachi Displays Ltd Display device and manufacturing method
US7858454B2 (en) * 2007-07-31 2010-12-28 Rf Nano Corporation Self-aligned T-gate carbon nanotube field effect transistor devices and method for forming the same
JP5213422B2 (en) 2007-12-04 2013-06-19 キヤノン株式会社 Oxide semiconductor element having insulating layer and display device using the same
US7968383B2 (en) 2007-12-20 2011-06-28 Konica Minolta Holdings, Inc. Electronic device and method of manufacturing the same
KR20090112417A (en) * 2008-04-24 2009-10-28 삼성전자주식회사 Method for forming wireline and method for manufacturing thin film transistor substrate

Also Published As

Publication number Publication date
EP3483920A1 (en) 2019-05-15
EP3483920B1 (en) 2024-03-06
GB2479150A (en) 2011-10-05
EP3483920C0 (en) 2024-03-06
EP2553718B1 (en) 2018-11-28
EP2553718A1 (en) 2013-02-06
GB2479150B (en) 2013-05-15
US9263553B2 (en) 2016-02-16
US20130020643A1 (en) 2013-01-24
WO2011121347A1 (en) 2011-10-06

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Legal Events

Date Code Title Description
COOA Change in applicant's name or ownership of the application

Owner name: PRAGMATIC PRINTING LIMITED

Free format text: FORMER OWNER: NANO EPRINT LIMITED