ATE53537T1 - Verfahren zum herstellen von kupferkaschiertem basismaterial fuer leiterplatten. - Google Patents
Verfahren zum herstellen von kupferkaschiertem basismaterial fuer leiterplatten.Info
- Publication number
- ATE53537T1 ATE53537T1 AT85101282T AT85101282T ATE53537T1 AT E53537 T1 ATE53537 T1 AT E53537T1 AT 85101282 T AT85101282 T AT 85101282T AT 85101282 T AT85101282 T AT 85101282T AT E53537 T1 ATE53537 T1 AT E53537T1
- Authority
- AT
- Austria
- Prior art keywords
- bands
- base material
- clated
- circuit boards
- printed circuit
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19843413434 DE3413434A1 (de) | 1984-04-10 | 1984-04-10 | Verfahren zum kontinuierlichen herstellen von kupferkaschiertem basismaterial fuer leiterplatten |
EP85101282A EP0158027B2 (de) | 1984-04-10 | 1985-02-07 | Verfahren zum Herstellen von kupferkaschiertem Basismaterial für Leiterplatten |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE53537T1 true ATE53537T1 (de) | 1990-06-15 |
Family
ID=25820258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT85101282T ATE53537T1 (de) | 1984-04-10 | 1985-02-07 | Verfahren zum herstellen von kupferkaschiertem basismaterial fuer leiterplatten. |
Country Status (20)
Country | Link |
---|---|
AR (1) | AR241096A1 (pt) |
AT (1) | ATE53537T1 (pt) |
AU (1) | AU579620B2 (pt) |
BR (1) | BR8501652A (pt) |
CS (1) | CS276234B6 (pt) |
DK (1) | DK164092C (pt) |
EG (1) | EG18033A (pt) |
ES (2) | ES8701049A1 (pt) |
FI (1) | FI851401L (pt) |
GR (1) | GR850874B (pt) |
HU (1) | HU192688B (pt) |
IL (1) | IL74564A (pt) |
MX (1) | MX158423A (pt) |
NO (1) | NO851405L (pt) |
NZ (1) | NZ211703A (pt) |
PL (1) | PL152229B1 (pt) |
PT (1) | PT80255B (pt) |
RO (1) | RO92976A (pt) |
TR (1) | TR22276A (pt) |
YU (2) | YU44997B (pt) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0133280A3 (en) * | 1983-08-01 | 1986-03-19 | American Cyanamid Company | Thermoset interleafed resin matrix composites with improved compression properties |
EP0133281A3 (en) * | 1983-08-01 | 1988-11-30 | American Cyanamid Company | Curable fibre reinforced epoxy resin composition |
EP0159482A3 (en) * | 1984-03-28 | 1987-02-25 | American Cyanamid Company | Resin matrix composites with controlled flow and tack |
-
1985
- 1985-02-07 AT AT85101282T patent/ATE53537T1/de not_active IP Right Cessation
- 1985-03-11 IL IL74564A patent/IL74564A/xx not_active IP Right Cessation
- 1985-03-15 YU YU41485A patent/YU44997B/xx unknown
- 1985-04-04 NZ NZ21170385A patent/NZ211703A/en unknown
- 1985-04-08 RO RO85118326A patent/RO92976A/ro unknown
- 1985-04-08 MX MX20487885A patent/MX158423A/es unknown
- 1985-04-08 EG EG22785A patent/EG18033A/xx active
- 1985-04-08 TR TR2227685A patent/TR22276A/xx unknown
- 1985-04-08 AR AR29999185A patent/AR241096A1/es active
- 1985-04-08 GR GR850874A patent/GR850874B/el unknown
- 1985-04-09 NO NO851405A patent/NO851405L/no unknown
- 1985-04-09 AU AU40926/85A patent/AU579620B2/en not_active Ceased
- 1985-04-09 FI FI851401A patent/FI851401L/fi not_active Application Discontinuation
- 1985-04-09 HU HU130585A patent/HU192688B/hu not_active IP Right Cessation
- 1985-04-09 BR BR8501652A patent/BR8501652A/pt not_active IP Right Cessation
- 1985-04-09 PL PL25284885A patent/PL152229B1/pl unknown
- 1985-04-09 ES ES542063A patent/ES8701049A1/es not_active Expired
- 1985-04-09 DK DK159185A patent/DK164092C/da not_active IP Right Cessation
- 1985-04-09 CS CS262185A patent/CS276234B6/cs unknown
- 1985-04-09 PT PT8025585A patent/PT80255B/pt not_active IP Right Cessation
-
1986
- 1986-07-01 ES ES556844A patent/ES8801773A1/es not_active Expired
-
1987
- 1987-09-18 YU YU173287A patent/YU45452B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
TR22276A (tr) | 1986-12-10 |
AR241096A1 (es) | 1991-10-31 |
YU41485A (en) | 1988-06-30 |
DK159185A (da) | 1985-10-11 |
AU579620B2 (en) | 1988-12-01 |
DK164092B (da) | 1992-05-11 |
ES556844A0 (es) | 1987-08-01 |
NZ211703A (en) | 1987-07-31 |
ES8701049A1 (es) | 1986-11-16 |
DK159185D0 (da) | 1985-04-09 |
PT80255A (de) | 1985-05-01 |
MX158423A (es) | 1989-01-30 |
CS8502621A2 (en) | 1991-07-16 |
BR8501652A (pt) | 1985-12-03 |
AU4092685A (en) | 1985-10-17 |
AR241096A2 (es) | 1991-10-31 |
PL152229B1 (en) | 1990-11-30 |
PT80255B (pt) | 1987-08-19 |
FI851401L (fi) | 1985-10-11 |
IL74564A (en) | 1989-10-31 |
YU173287A (en) | 1989-10-31 |
GR850874B (pt) | 1985-11-25 |
RO92976A (ro) | 1987-11-30 |
YU44997B (en) | 1991-06-30 |
EG18033A (en) | 1991-12-30 |
NO851405L (no) | 1985-10-11 |
PL252848A1 (en) | 1985-12-17 |
HU192688B (en) | 1987-06-29 |
FI851401A0 (fi) | 1985-04-09 |
ES542063A0 (es) | 1986-11-16 |
ES8801773A1 (es) | 1987-08-01 |
CS276234B6 (en) | 1992-05-13 |
HUT37897A (en) | 1986-03-28 |
IL74564A0 (en) | 1985-06-30 |
YU45452B (en) | 1992-05-28 |
DK164092C (da) | 1992-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1129184A (en) | Method of mounting electronic components | |
DE3269632D1 (en) | Radiation-polymerisable composition and copying material made therefrom | |
IL112393A (en) | Method for decorating a substrate and a radiation- curable polymer composition for use therein | |
DE60314097D1 (de) | Heissschmelzbeschichtungszusammensetzung für folienübertragung und giessprozess | |
CN111674172A (zh) | 一种在基材表面形成金属质感纹理的印刷工艺 | |
ATE53537T1 (de) | Verfahren zum herstellen von kupferkaschiertem basismaterial fuer leiterplatten. | |
DE2962634D1 (en) | Curable composition useful for screen-printing, a cured coating comprising said composition and process for soldering printed circuit boards using said composition | |
KR970019793A (ko) | 땜납 및 납땜법 | |
ES452140A1 (es) | Procedimiento para proteger, unir entre si y aislar termica-mente elementos de intercambio termico. | |
ES466160A1 (es) | Un procedimiento y su correspondiente dispositivo para fo- rrar piezas de trabajo. | |
EP0253892A4 (en) | TRANSFER MATERIAL FOR PRINTED CIRCUIT BOARD, AND PREPARED PRINTED CIRCUIT BOARD FOR USE OF THIS TRANSFER MATERIAL AND METHOD FOR THE PRODUCTION THEREOF. | |
JPS56123819A (en) | Shaping method for cover pad for sheet | |
JPS5337738A (en) | Method and apparatus for curing of adhesive applied to board | |
ES494200A0 (es) | Un metodo para producir union de adhesivo de un substrato metalico a substratos de metal, material polimerico, madera,papel, vidrio y ceramica | |
JPS56102193A (en) | Production of honey-comb diaphragm | |
ES376142A1 (es) | Un procedimiento para fabricar un panel de plastico reves- tido de cobre para uso en circuito impreso. | |
JPS57182482A (en) | Manufacture of building material | |
JPS5557433A (en) | Concave and convex pattern and its manufacturing method | |
JPS55123138A (en) | Manufacture of packaged unit | |
KR860004200A (ko) | 폴리우레탄(Polyurethan)상혁 (床革)의 제조방법 | |
ES428431A1 (es) | Perfeccionamientos introducidos en la fabricacion de placasde circuito electrico impreso. | |
ES421921A1 (es) | Procedimiento de obtencion de circuitos impresos. | |
JPS56123821A (en) | Patterning method by hot melt adhesive | |
ES466228A1 (es) | Un procedimiento y un dispositivo para revestir piezas de trabajo. | |
ES458246A1 (es) | Procedimiento perfeccionado para la cubricion con adhesivo de superficies de bandas de material esponjoso o similar. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEIH | Change in the person of patent owner | ||
EELA | Cancelled due to lapse of time |