ATE53537T1 - PROCESS FOR MANUFACTURING COPPER-CLATED BASE MATERIAL FOR CIRCUIT BOARDS. - Google Patents
PROCESS FOR MANUFACTURING COPPER-CLATED BASE MATERIAL FOR CIRCUIT BOARDS.Info
- Publication number
- ATE53537T1 ATE53537T1 AT85101282T AT85101282T ATE53537T1 AT E53537 T1 ATE53537 T1 AT E53537T1 AT 85101282 T AT85101282 T AT 85101282T AT 85101282 T AT85101282 T AT 85101282T AT E53537 T1 ATE53537 T1 AT E53537T1
- Authority
- AT
- Austria
- Prior art keywords
- bands
- base material
- clated
- circuit boards
- printed circuit
- Prior art date
Links
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Procedure for the manufacture of metal coated base material for printed circuit plates. Understands the following operations: first, bands of impregnated layer material with a hot hardening are prepared; second, those prepared bands are mounted adequately and preheat to reduce the viscosity of the resin system; third, the mounted and preheated bands are jointed to pressure in a pressure device under pressure and at elevated temperature, with a metal sheet; and last, the formed band is cut to the desired lengths to obtain printed circuit plates. (Machine-translation by Google Translate, not legally binding)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19843413434 DE3413434A1 (en) | 1984-04-10 | 1984-04-10 | METHOD FOR CONTINUOUSLY PRODUCING COPPER-COATED BASE MATERIAL FOR CIRCUIT BOARDS |
| EP85101282A EP0158027B2 (en) | 1984-04-10 | 1985-02-07 | Method for making copper-clad base material for conductive plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE53537T1 true ATE53537T1 (en) | 1990-06-15 |
Family
ID=25820258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT85101282T ATE53537T1 (en) | 1984-04-10 | 1985-02-07 | PROCESS FOR MANUFACTURING COPPER-CLATED BASE MATERIAL FOR CIRCUIT BOARDS. |
Country Status (20)
| Country | Link |
|---|---|
| AR (1) | AR241096A1 (en) |
| AT (1) | ATE53537T1 (en) |
| AU (1) | AU579620B2 (en) |
| BR (1) | BR8501652A (en) |
| CS (1) | CS276234B6 (en) |
| DK (1) | DK164092C (en) |
| EG (1) | EG18033A (en) |
| ES (2) | ES8701049A1 (en) |
| FI (1) | FI851401L (en) |
| GR (1) | GR850874B (en) |
| HU (1) | HU192688B (en) |
| IL (1) | IL74564A (en) |
| MX (1) | MX158423A (en) |
| NO (1) | NO851405L (en) |
| NZ (1) | NZ211703A (en) |
| PL (1) | PL152229B1 (en) |
| PT (1) | PT80255B (en) |
| RO (1) | RO92976A (en) |
| TR (1) | TR22276A (en) |
| YU (2) | YU44997B (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0133280A3 (en) * | 1983-08-01 | 1986-03-19 | American Cyanamid Company | Thermoset interleafed resin matrix composites with improved compression properties |
| EP0133281A3 (en) * | 1983-08-01 | 1988-11-30 | American Cyanamid Company | Curable fibre reinforced epoxy resin composition |
| EP0159482A3 (en) * | 1984-03-28 | 1987-02-25 | American Cyanamid Company | Resin matrix composites with controlled flow and tack |
-
1985
- 1985-02-07 AT AT85101282T patent/ATE53537T1/en not_active IP Right Cessation
- 1985-03-11 IL IL74564A patent/IL74564A/en not_active IP Right Cessation
- 1985-03-15 YU YU41485A patent/YU44997B/en unknown
- 1985-04-04 NZ NZ21170385A patent/NZ211703A/en unknown
- 1985-04-08 MX MX20487885A patent/MX158423A/en unknown
- 1985-04-08 GR GR850874A patent/GR850874B/el unknown
- 1985-04-08 AR AR29999185A patent/AR241096A1/en active
- 1985-04-08 EG EG22785A patent/EG18033A/en active
- 1985-04-08 RO RO85118326A patent/RO92976A/en unknown
- 1985-04-08 TR TR2227685A patent/TR22276A/en unknown
- 1985-04-09 BR BR8501652A patent/BR8501652A/en not_active IP Right Cessation
- 1985-04-09 CS CS262185A patent/CS276234B6/en unknown
- 1985-04-09 DK DK159185A patent/DK164092C/en not_active IP Right Cessation
- 1985-04-09 FI FI851401A patent/FI851401L/en not_active Application Discontinuation
- 1985-04-09 PT PT8025585A patent/PT80255B/en not_active IP Right Cessation
- 1985-04-09 NO NO851405A patent/NO851405L/en unknown
- 1985-04-09 ES ES542063A patent/ES8701049A1/en not_active Expired
- 1985-04-09 AU AU40926/85A patent/AU579620B2/en not_active Ceased
- 1985-04-09 HU HU130585A patent/HU192688B/en not_active IP Right Cessation
- 1985-04-09 PL PL25284885A patent/PL152229B1/en unknown
-
1986
- 1986-07-01 ES ES556844A patent/ES8801773A1/en not_active Expired
-
1987
- 1987-09-18 YU YU173287A patent/YU45452B/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MX158423A (en) | 1989-01-30 |
| YU44997B (en) | 1991-06-30 |
| AU4092685A (en) | 1985-10-17 |
| CS276234B6 (en) | 1992-05-13 |
| DK159185D0 (en) | 1985-04-09 |
| NZ211703A (en) | 1987-07-31 |
| ES8801773A1 (en) | 1987-08-01 |
| DK164092C (en) | 1992-10-12 |
| ES8701049A1 (en) | 1986-11-16 |
| NO851405L (en) | 1985-10-11 |
| CS8502621A2 (en) | 1991-07-16 |
| PL252848A1 (en) | 1985-12-17 |
| YU173287A (en) | 1989-10-31 |
| PL152229B1 (en) | 1990-11-30 |
| PT80255A (en) | 1985-05-01 |
| ES556844A0 (en) | 1987-08-01 |
| ES542063A0 (en) | 1986-11-16 |
| BR8501652A (en) | 1985-12-03 |
| EG18033A (en) | 1991-12-30 |
| GR850874B (en) | 1985-11-25 |
| YU41485A (en) | 1988-06-30 |
| HU192688B (en) | 1987-06-29 |
| AR241096A1 (en) | 1991-10-31 |
| TR22276A (en) | 1986-12-10 |
| FI851401L (en) | 1985-10-11 |
| IL74564A (en) | 1989-10-31 |
| RO92976A (en) | 1987-11-30 |
| DK159185A (en) | 1985-10-11 |
| AR241096A2 (en) | 1991-10-31 |
| PT80255B (en) | 1987-08-19 |
| HUT37897A (en) | 1986-03-28 |
| AU579620B2 (en) | 1988-12-01 |
| FI851401A0 (en) | 1985-04-09 |
| YU45452B (en) | 1992-05-28 |
| DK164092B (en) | 1992-05-11 |
| IL74564A0 (en) | 1985-06-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1129184A (en) | Method of mounting electronic components | |
| DE3269632D1 (en) | Radiation-polymerisable composition and copying material made therefrom | |
| IL112393A (en) | Method for decorating a substrate and a radiation- curable polymer composition for use therein | |
| DE60314097D1 (en) | HOT FELT COATING COMPOSITION FOR FILM TRANSFER AND CASTING PROCESS | |
| ATE53537T1 (en) | PROCESS FOR MANUFACTURING COPPER-CLATED BASE MATERIAL FOR CIRCUIT BOARDS. | |
| KR970019793A (en) | Solder and Soldering | |
| ES452140A1 (en) | Procedure to protect, join between themselves and thermally to insulate elements of thermal exchange. (Machine-translation by Google Translate, not legally binding) | |
| ES466160A1 (en) | A procedure and its corresponding device for linking work pieces. (Machine-translation by Google Translate, not legally binding) | |
| EP0253892A4 (en) | Transfer material for printed circuit board and printed circuit board prepared using said transfer material and process for preparation thereof. | |
| EP0074065A3 (en) | Photoflash array quick-cure laminating process | |
| JPS56123819A (en) | Shaping method for cover pad for sheet | |
| JPS5337738A (en) | Method and apparatus for curing of adhesive applied to board | |
| DK162695C (en) | PROCEDURE FOR MAKING FILTER PAPER ARTICLES | |
| JPS56102193A (en) | Production of honey-comb diaphragm | |
| ES376142A1 (en) | A procedure to manufacture a copper plated copper panel for use on a printed circuit. (Machine-translation by Google Translate, not legally binding) | |
| ES453475A1 (en) | Transfers | |
| JPS57182482A (en) | Manufacture of building material | |
| JPS5557433A (en) | Concave and convex pattern and its manufacturing method | |
| KR860004200A (en) | Polyurethane reforming process | |
| JPS56123821A (en) | Patterning method by hot melt adhesive | |
| ES466228A1 (en) | A procedure and a device for coating work pieces. (Machine-translation by Google Translate, not legally binding) | |
| JPS555880A (en) | Method of manufacturing interior material | |
| ES458246A1 (en) | Perfect procedure for covering with adhesive surfaces of bands of sponous or similar material. (Machine-translation by Google Translate, not legally binding) | |
| ES8100598A1 (en) | Manufacturing procedure of printed circuit plates for electrical heating elements (Machine-translation by Google Translate, not legally binding) | |
| ES448107A1 (en) | Procedure for applying synthetic resin powder. (Machine-translation by Google Translate, not legally binding) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEIH | Change in the person of patent owner | ||
| EELA | Cancelled due to lapse of time |