ATE535014T1 - Verfahren zum drahtbonden eines mikroelektronischen halbleiterchips - Google Patents

Verfahren zum drahtbonden eines mikroelektronischen halbleiterchips

Info

Publication number
ATE535014T1
ATE535014T1 AT02803290T AT02803290T ATE535014T1 AT E535014 T1 ATE535014 T1 AT E535014T1 AT 02803290 T AT02803290 T AT 02803290T AT 02803290 T AT02803290 T AT 02803290T AT E535014 T1 ATE535014 T1 AT E535014T1
Authority
AT
Austria
Prior art keywords
semiconductor chip
wire bonding
microelectronic semiconductor
conductive layer
copper pad
Prior art date
Application number
AT02803290T
Other languages
English (en)
Inventor
Donald Danielson
Patrick Paluda
Robert Gleixner
Rajan Naik
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE535014T1 publication Critical patent/ATE535014T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/922—Bond pads being integral with underlying chip-level interconnections
    • H10W72/9226—Bond pads being integral with underlying chip-level interconnections with via interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/2419—Fold at edge
    • Y10T428/24215—Acute or reverse fold of exterior component
    • Y10T428/24231—At opposed marginal edges
    • Y10T428/2424—Annular cover
    • Y10T428/24248—One piece

Landscapes

  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
AT02803290T 2001-10-18 2002-10-17 Verfahren zum drahtbonden eines mikroelektronischen halbleiterchips ATE535014T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/032,623 US6683383B2 (en) 2001-10-18 2001-10-18 Wirebond structure and method to connect to a microelectronic die
PCT/US2002/033568 WO2003056625A2 (en) 2001-10-18 2002-10-17 Wirebond structure and method of wire bonding a microelectronic die

Publications (1)

Publication Number Publication Date
ATE535014T1 true ATE535014T1 (de) 2011-12-15

Family

ID=21865920

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02803290T ATE535014T1 (de) 2001-10-18 2002-10-17 Verfahren zum drahtbonden eines mikroelektronischen halbleiterchips

Country Status (6)

Country Link
US (4) US6683383B2 (de)
EP (1) EP1440470B1 (de)
CN (1) CN100380647C (de)
AT (1) ATE535014T1 (de)
AU (1) AU2002365137A1 (de)
WO (1) WO2003056625A2 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6683383B2 (en) * 2001-10-18 2004-01-27 Intel Corporation Wirebond structure and method to connect to a microelectronic die
US6715663B2 (en) * 2002-01-16 2004-04-06 Intel Corporation Wire-bond process flow for copper metal-six, structures achieved thereby, and testing method
US6982493B2 (en) * 2003-04-03 2006-01-03 International Business Machines Corporation Wedgebond pads having a nonplanar surface structure
US7451905B2 (en) * 2004-06-22 2008-11-18 Edwards Enterprises Wire bonding wedge
US7253518B2 (en) 2005-06-15 2007-08-07 Endicott Interconnect Technologies, Inc. Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
US7504728B2 (en) * 2005-12-09 2009-03-17 Agere Systems Inc. Integrated circuit having bond pad with improved thermal and mechanical properties
US7960825B2 (en) * 2006-09-06 2011-06-14 Megica Corporation Chip package and method for fabricating the same
WO2008078268A1 (en) * 2006-12-27 2008-07-03 Nxp B.V. Semiconductor component with inertly encapsulated metal surface layers
US9000579B2 (en) * 2007-03-30 2015-04-07 Stats Chippac Ltd. Integrated circuit package system with bonding in via
US7829450B2 (en) * 2007-11-07 2010-11-09 Infineon Technologies Ag Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
US8432043B2 (en) * 2008-06-30 2013-04-30 Sandisk Technologies Inc. Stacked wire bonded semiconductor package with low profile bond line
US8241953B2 (en) * 2008-06-30 2012-08-14 Sandisk Technologies Inc. Method of fabricating stacked wire bonded semiconductor package with low profile bond line
US8802555B2 (en) 2011-03-23 2014-08-12 Stats Chippac Ltd. Integrated circuit packaging system with interconnects and method of manufacture thereof
US9960130B2 (en) * 2015-02-06 2018-05-01 UTAC Headquarters Pte. Ltd. Reliable interconnect
JP6239214B1 (ja) * 2016-05-18 2017-11-29 三菱電機株式会社 電力用半導体装置およびその製造方法
JP6931869B2 (ja) * 2016-10-21 2021-09-08 国立研究開発法人産業技術総合研究所 半導体装置
JP6968557B2 (ja) * 2017-03-21 2021-11-17 キヤノン株式会社 液体吐出ヘッド用基板、半導体基板、およびそれらの製造方法
JP2018182195A (ja) * 2017-04-19 2018-11-15 トヨタ自動車株式会社 半導体装置
US20200373200A1 (en) 2019-05-24 2020-11-26 Applied Materials, Inc. Metal based hydrogen barrier
CN116406098A (zh) * 2023-03-31 2023-07-07 常州亚玛顿股份有限公司 一种玻璃基导电线路采用导电胶焊接方法

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US3623649A (en) * 1969-06-09 1971-11-30 Gen Motors Corp Wedge bonding tool for the attachment of semiconductor leads
JP2563652B2 (ja) 1990-07-17 1996-12-11 株式会社東芝 半導体装置及びその製造方法
US5175609A (en) * 1991-04-10 1992-12-29 International Business Machines Corporation Structure and method for corrosion and stress-resistant interconnecting metallurgy
JPH05102063A (ja) * 1991-10-08 1993-04-23 Nec Yamagata Ltd 半導体装置の製造方法
US5567981A (en) * 1993-03-31 1996-10-22 Intel Corporation Bonding pad structure having an interposed rigid layer
US5661081A (en) * 1994-09-30 1997-08-26 United Microelectronics Corporation Method of bonding an aluminum wire to an intergrated circuit bond pad
US6144100A (en) 1997-06-05 2000-11-07 Texas Instruments Incorporated Integrated circuit with bonding layer over active circuitry
US6218732B1 (en) 1998-09-15 2001-04-17 Texas Instruments Incorporated Copper bond pad process
US6187680B1 (en) * 1998-10-07 2001-02-13 International Business Machines Corporation Method/structure for creating aluminum wirebound pad on copper BEOL
TW426980B (en) * 1999-01-23 2001-03-21 Lucent Technologies Inc Wire bonding to copper
US6544880B1 (en) * 1999-06-14 2003-04-08 Micron Technology, Inc. Method of improving copper interconnects of semiconductor devices for bonding
US6329722B1 (en) * 1999-07-01 2001-12-11 Texas Instruments Incorporated Bonding pads for integrated circuits having copper interconnect metallization
JP3859403B2 (ja) * 1999-09-22 2006-12-20 株式会社東芝 半導体装置及びその製造方法
US6511901B1 (en) * 1999-11-05 2003-01-28 Atmel Corporation Metal redistribution layer having solderable pads and wire bondable pads
JP3602024B2 (ja) * 2000-01-21 2004-12-15 シャープ株式会社 半導体装置及びその製造方法
US6335104B1 (en) * 2000-02-22 2002-01-01 International Business Machines Corporation Method for preparing a conductive pad for electrical connection and conductive pad formed
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Also Published As

Publication number Publication date
WO2003056625A3 (en) 2003-11-06
AU2002365137A8 (en) 2003-07-15
US7855103B2 (en) 2010-12-21
WO2003056625A2 (en) 2003-07-10
EP1440470B1 (de) 2011-11-23
US7393772B2 (en) 2008-07-01
AU2002365137A1 (en) 2003-07-15
US20080227285A1 (en) 2008-09-18
US6683383B2 (en) 2004-01-27
US20050079651A1 (en) 2005-04-14
CN1582495A (zh) 2005-02-16
US20030075804A1 (en) 2003-04-24
US20030205827A1 (en) 2003-11-06
CN100380647C (zh) 2008-04-09
US6924554B2 (en) 2005-08-02
EP1440470A2 (de) 2004-07-28

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