MY137488A - Method for manufacturing semiconductor device and heat-resistant pressure-sensitive adhesive tape for use therein - Google Patents

Method for manufacturing semiconductor device and heat-resistant pressure-sensitive adhesive tape for use therein

Info

Publication number
MY137488A
MY137488A MYPI20032144A MYPI20032144A MY137488A MY 137488 A MY137488 A MY 137488A MY PI20032144 A MYPI20032144 A MY PI20032144A MY PI20032144 A MYPI20032144 A MY PI20032144A MY 137488 A MY137488 A MY 137488A
Authority
MY
Malaysia
Prior art keywords
sensitive adhesive
heat
adhesive tape
resistant pressure
semiconductor device
Prior art date
Application number
MYPI20032144A
Inventor
Hitoshi Takano
Kazuhito Hosokawa
Akihisa Murata
Toshiyuki Oshima
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of MY137488A publication Critical patent/MY137488A/en

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Classifications

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    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Adhesive Tapes (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)

Abstract

A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE (21A) OF THE PRESENT INVENTION, COMPRISES THE STEPS OF MOUNTING AND BONDING SEMICONDUCTOR CHIPS (15) ONTO DIE PADS (11C) OF A METAL LEAD FRAME (10) HAVING AN OUTER PAD SIDE TO WHICH A HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE (20) IS ATTACHED; WIRING A BONDING WIRE (16) BETWEEN EACH TERMINATION OF THE LEAD FRAME (10) AND EACH ELECTRODE PAD (15A) ON THE SEMICONDUCTOR CHIPS (15) SEALING SEMICONDUCTOR CHIPS (15) IN A SEALING RESIN (17) FROM ONE SIDE; AND CUTTING THE SEALED BODY INTO INDIVIDUAL SEMICONDUCTOR DEVICES (21 A). IN THIS INVENTION, THE HEAT-RESISTANT PRESSURE-SENSITIVE ADHESIVE TAPE (20) COMPRISES A BASE LAYER MADE OF A POLYIMIDE RESIN AND A PRESSURE-SENSITIVE ADHESIVE LAYER WITH A THICKNESS OF 1 TO 20 µM THAT IS MADE OF AN ACRYLIC RESIN AND HAS A STORAGE ELASTIC MODULUS OF AT LEAST 1.0 X 105 PA AT 200°C.FIG. 1
MYPI20032144A 2002-06-10 2003-06-09 Method for manufacturing semiconductor device and heat-resistant pressure-sensitive adhesive tape for use therein MY137488A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002168689A JP3849978B2 (en) 2002-06-10 2002-06-10 Semiconductor device manufacturing method and heat-resistant adhesive tape used therefor

Publications (1)

Publication Number Publication Date
MY137488A true MY137488A (en) 2009-02-27

Family

ID=29996443

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