SG108923A1 - Method for manufacturing semiconductor device and heat-resistant pressure-sensitive adhesive tape for use therein - Google Patents

Method for manufacturing semiconductor device and heat-resistant pressure-sensitive adhesive tape for use therein

Info

Publication number
SG108923A1
SG108923A1 SG200303252A SG200303252A SG108923A1 SG 108923 A1 SG108923 A1 SG 108923A1 SG 200303252 A SG200303252 A SG 200303252A SG 200303252 A SG200303252 A SG 200303252A SG 108923 A1 SG108923 A1 SG 108923A1
Authority
SG
Singapore
Prior art keywords
heat
adhesive tape
semiconductor device
resistant adhesive
manufacturing semiconductor
Prior art date
Application number
SG200303252A
Inventor
Takano Hitoshi
Hosokawa Kazuhito
Murata Akihisa
Oshima Toshiyuki
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of SG108923A1 publication Critical patent/SG108923A1/en

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Classifications

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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device and a heat-resistant adhesive tape used in the same method in which leak of resin in the sealing process can be adequately prevented with a heat-resistant adhesive tape, even for a large size matrix pattern particularly to simultaneously sealing many packages, and the adhered tape does not easily result in any trouble in a series of processes. <P>SOLUTION: In this method of manufacturing semiconductor device, a semiconductor chip 15 is bonded to a metallic lead frame 10 adhered with a heat-resistant adhesive tape 20, thereafter the front end of a terminal portion 11b is connected to an electrode pad 15a with a bonding wire 16, and a sealed structure 21 is cut into individual semiconductor devices 21a after the single side of semiconductor chip is sealed with a sealing resin 17. The heat-resistant adhesive tape 20 comprises a basic material layer consisting of polyimide material and an adhesive agent layer in the thickness of 1 to 20 &mu;m consisting of an acrylic material having a storage elasticity at 200&deg;C of 1.0 &times; 10<SP>5</SP>Pa or more. <P>COPYRIGHT: (C)2004,JPO
SG200303252A 2002-06-10 2003-06-03 Method for manufacturing semiconductor device and heat-resistant pressure-sensitive adhesive tape for use therein SG108923A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002168689A JP3849978B2 (en) 2002-06-10 2002-06-10 Semiconductor device manufacturing method and heat-resistant adhesive tape used therefor

Publications (1)

Publication Number Publication Date
SG108923A1 true SG108923A1 (en) 2005-02-28

Family

ID=29996443

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200303252A SG108923A1 (en) 2002-06-10 2003-06-03 Method for manufacturing semiconductor device and heat-resistant pressure-sensitive adhesive tape for use therein

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Country Link
JP (1) JP3849978B2 (en)
CN (1) CN1320619C (en)
HK (1) HK1059501A1 (en)
MY (1) MY137488A (en)
SG (1) SG108923A1 (en)
TW (1) TWI281220B (en)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
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JP4610168B2 (en) * 2003-08-06 2011-01-12 スリーエム イノベイティブ プロパティズ カンパニー Heat resistant masking tape
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