ATE525177T1 - Zielpositionserkennungsvorrichtung für einen roboter - Google Patents
Zielpositionserkennungsvorrichtung für einen roboterInfo
- Publication number
- ATE525177T1 ATE525177T1 AT08165581T AT08165581T ATE525177T1 AT E525177 T1 ATE525177 T1 AT E525177T1 AT 08165581 T AT08165581 T AT 08165581T AT 08165581 T AT08165581 T AT 08165581T AT E525177 T1 ATE525177 T1 AT E525177T1
- Authority
- AT
- Austria
- Prior art keywords
- target
- end effector
- robot
- arm
- teaching point
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1679—Programme controls characterised by the tasks executed
- B25J9/1692—Calibration of manipulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37411—Measure contact from force and velocity detection
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39013—Locate movable manipulator relative to object, compare to stored gridpoints
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39041—Calibrate only for end position
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/39—Robotics, robotics to robotics hand
- G05B2219/39413—Robot self diagnostics
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007262720A JP5235376B2 (ja) | 2007-10-05 | 2007-10-05 | ロボットのターゲット位置検出装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE525177T1 true ATE525177T1 (de) | 2011-10-15 |
Family
ID=40303623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08165581T ATE525177T1 (de) | 2007-10-05 | 2008-10-01 | Zielpositionserkennungsvorrichtung für einen roboter |
Country Status (5)
Country | Link |
---|---|
US (1) | US8121732B2 (de) |
EP (1) | EP2045049B1 (de) |
JP (1) | JP5235376B2 (de) |
KR (1) | KR101025017B1 (de) |
AT (1) | ATE525177T1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8290624B2 (en) * | 2007-04-26 | 2012-10-16 | Adept Technology, Inc. | Uniform lighting and gripper positioning system for robotic picking operations |
US8400177B2 (en) * | 2008-09-01 | 2013-03-19 | Chimei Innolux Corporation | Device and method for testing display panel |
US20100188034A1 (en) * | 2009-01-23 | 2010-07-29 | Derek Young | Trainable Robot and Method of Training |
DE102009058607A1 (de) * | 2009-12-17 | 2011-06-22 | KUKA Laboratories GmbH, 86165 | Verfahren und Vorrichtung zum Steuern eines Manipulators |
DE102010010718A1 (de) * | 2010-03-09 | 2011-09-15 | Kuka Laboratories Gmbh | Verfahren zur Montage von Bauteilen mittels eines Industrieroboters |
EP2547490B1 (de) * | 2010-03-18 | 2014-01-08 | ABB Research Ltd. | Kalibrierung eines basiskoordinatensystems für einen industrieroboter |
JP5621796B2 (ja) * | 2012-01-31 | 2014-11-12 | 株式会社安川電機 | 搬送システム |
TWI456685B (zh) * | 2012-05-02 | 2014-10-11 | Advanced Wireless Semiconductor Company | 應用於聚光型太陽能電池之蝕刻設備之晶圓傳輸裝置 |
JP6208419B2 (ja) * | 2012-09-19 | 2017-10-04 | 株式会社ダイヘン | 算出装置、搬送ロボットシステム、及び算出方法 |
JP6438189B2 (ja) * | 2013-10-01 | 2018-12-12 | 川崎重工業株式会社 | ロボット及びロボットの制御方法 |
US9718187B2 (en) * | 2014-06-11 | 2017-08-01 | Canon Kabushiki Kaisha | Robot controlling method, robot apparatus, program, recording medium, and method for manufacturing assembly component |
CN104022195B (zh) * | 2014-06-19 | 2017-05-17 | 付霞 | 一种led支架卸取装置 |
TWI710440B (zh) | 2014-11-10 | 2020-11-21 | 美商布魯克斯自動機械公司 | 工具自動教導方法及設備 |
WO2016103292A1 (ja) * | 2014-12-22 | 2016-06-30 | 川崎重工業株式会社 | ロボットシステム及びエンドエフェクタの変形検出方法 |
US9796086B2 (en) * | 2015-05-01 | 2017-10-24 | Kawasaki Jukogyo Kabushiki Kaisha | Method of teaching robot and robot |
US9815198B2 (en) | 2015-07-23 | 2017-11-14 | X Development Llc | System and method for determining a work offset |
US10016892B2 (en) | 2015-07-23 | 2018-07-10 | X Development Llc | System and method for determining tool offsets |
KR20190121822A (ko) * | 2017-03-26 | 2019-10-28 | 제네시스 로보틱스 앤드 모션 테크놀로지스 캐나다, 유엘씨 | 로봇 아암 |
JP6710321B2 (ja) * | 2017-03-29 | 2020-06-17 | 株式会社Kokusai Electric | 基板移載ユニット及び基板処理装置及び半導体装置の製造方法 |
JP7207094B2 (ja) * | 2019-03-29 | 2023-01-18 | セイコーエプソン株式会社 | 水平多関節ロボット |
JP2020163548A (ja) * | 2019-03-29 | 2020-10-08 | セイコーエプソン株式会社 | 水平多関節ロボットおよびロボットシステム |
CN112296997B (zh) * | 2019-07-31 | 2022-01-14 | 上海微电子装备(集团)股份有限公司 | 一种机械手交接工位标定方法、装置、设备及存储介质 |
JP7409800B2 (ja) | 2019-08-09 | 2024-01-09 | 川崎重工業株式会社 | ロボット制御装置、ロボット、及びロボット制御方法 |
CN112140098B (zh) * | 2020-09-15 | 2022-06-21 | 天津大学 | 基于近端策略优化的水下蛇形机器人高速步态生成方法 |
JP2022059951A (ja) * | 2020-10-02 | 2022-04-14 | 日本電産サンキョー株式会社 | 産業用ロボット |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01255015A (ja) * | 1988-04-05 | 1989-10-11 | Mitsubishi Electric Corp | ロボットの制御装置 |
JPH02185385A (ja) * | 1989-01-09 | 1990-07-19 | Sanyo Electric Co Ltd | ロボットのハンドの位置決め方法 |
SE501263C2 (sv) | 1991-12-10 | 1994-12-19 | Asea Brown Boveri | Förfarande för kalibrering av rörelseaxlar hos en industrirobot |
SE505981C2 (sv) * | 1996-02-14 | 1997-10-27 | Asea Brown Boveri | Förfarande för styrning av en industrirobot med hänsyn till moment och belastning |
JP3300625B2 (ja) | 1997-01-27 | 2002-07-08 | ファナック株式会社 | ロボットの制御方式 |
JP2003527737A (ja) * | 1998-07-11 | 2003-09-16 | セミトゥール・インコーポレイテッド | マイクロ電子ワークピース取扱い用ロボット |
US6323616B1 (en) | 1999-03-15 | 2001-11-27 | Berkeley Process Control, Inc. | Self teaching robotic wafer handling system |
US6242879B1 (en) * | 2000-03-13 | 2001-06-05 | Berkeley Process Control, Inc. | Touch calibration system for wafer transfer robot |
US6356807B1 (en) | 1999-08-13 | 2002-03-12 | Fanuc Robotics North America, Inc. | Method of determining contact positions, calibration parameters, and reference frames for robot assemblies |
US6577923B1 (en) * | 1999-12-23 | 2003-06-10 | Applied Materials, Inc. | Apparatus and method for robotic alignment of substrates |
US6865499B2 (en) * | 2001-04-26 | 2005-03-08 | Siemens Energy & Automation, Inc. | Method and apparatus for tuning compensation parameters in a motion control system associated with a mechanical member |
US6941192B2 (en) * | 2002-01-31 | 2005-09-06 | Abb Research Ltd. | Robot machining tool position and orientation calibration |
US6996456B2 (en) * | 2002-10-21 | 2006-02-07 | Fsi International, Inc. | Robot with tactile sensor device |
JP4085798B2 (ja) * | 2002-12-11 | 2008-05-14 | 株式会社安川電機 | ウェハ位置教示方法および教示用治具ならびにロボット |
JP4167940B2 (ja) * | 2003-05-29 | 2008-10-22 | ファナック株式会社 | ロボットシステム |
DE10351670A1 (de) * | 2003-11-05 | 2005-06-30 | Kuka Roboter Gmbh | Verfahren und Vorrichtung zum Steuern von Robotern |
JP4047826B2 (ja) * | 2004-03-25 | 2008-02-13 | 東京エレクトロン株式会社 | 縦型熱処理装置及び移載機構の自動教示方法 |
DE102004026185A1 (de) * | 2004-05-28 | 2005-12-22 | Kuka Roboter Gmbh | Verfahren und Vorrichtung zum Betreiben einer Maschine, wie eines Mehrachs- Industrieroboters |
JP2006041423A (ja) | 2004-07-30 | 2006-02-09 | Hitachi Naka Electronics Co Ltd | 精密薄板材の搬送装置 |
JP4653002B2 (ja) | 2006-03-28 | 2011-03-16 | 古河電気工業株式会社 | 多目的雨水貯留槽および多目的雨水貯留装置 |
US7974737B2 (en) * | 2006-10-31 | 2011-07-05 | GM Global Technology Operations LLC | Apparatus and method of automated manufacturing |
WO2009089010A2 (en) * | 2008-01-10 | 2009-07-16 | Parata Systems, Llc | System and method for calibrating an automated materials handling system |
ATE532610T1 (de) * | 2008-04-30 | 2011-11-15 | Abb Technology Ab | Verfahren und system zur bestimmung der beziehung zwischen einem roboterkoordinatensystem und einem lokalen koordinatensystem, das im arbeitsbereich des roboters positioniert ist |
EP2324968B1 (de) * | 2008-07-10 | 2018-11-21 | Kawasaki Jukogyo Kabushiki Kaisha | Roboter und sein lehrverfahren |
JP5114804B2 (ja) * | 2008-07-10 | 2013-01-09 | 川崎重工業株式会社 | ロボット及びその教示方法 |
-
2007
- 2007-10-05 JP JP2007262720A patent/JP5235376B2/ja active Active
-
2008
- 2008-09-17 US US12/232,441 patent/US8121732B2/en active Active
- 2008-10-01 EP EP08165581A patent/EP2045049B1/de active Active
- 2008-10-01 AT AT08165581T patent/ATE525177T1/de not_active IP Right Cessation
- 2008-10-02 KR KR1020080097080A patent/KR101025017B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP2045049B1 (de) | 2011-09-21 |
KR101025017B1 (ko) | 2011-03-25 |
KR20090035446A (ko) | 2009-04-09 |
US8121732B2 (en) | 2012-02-21 |
EP2045049A3 (de) | 2009-05-06 |
EP2045049A2 (de) | 2009-04-08 |
JP5235376B2 (ja) | 2013-07-10 |
US20090093908A1 (en) | 2009-04-09 |
JP2009090406A (ja) | 2009-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |