ATE525177T1 - Zielpositionserkennungsvorrichtung für einen roboter - Google Patents

Zielpositionserkennungsvorrichtung für einen roboter

Info

Publication number
ATE525177T1
ATE525177T1 AT08165581T AT08165581T ATE525177T1 AT E525177 T1 ATE525177 T1 AT E525177T1 AT 08165581 T AT08165581 T AT 08165581T AT 08165581 T AT08165581 T AT 08165581T AT E525177 T1 ATE525177 T1 AT E525177T1
Authority
AT
Austria
Prior art keywords
target
end effector
robot
arm
teaching point
Prior art date
Application number
AT08165581T
Other languages
English (en)
Inventor
Yasuhiko Hashimoto
Nobuyasu Shimomura
Takao Yamaguchi
Tetsuya Yoshida
Original Assignee
Kawasaki Heavy Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Heavy Ind Ltd filed Critical Kawasaki Heavy Ind Ltd
Application granted granted Critical
Publication of ATE525177T1 publication Critical patent/ATE525177T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Program-controlled manipulators
    • B25J9/16—Program controls
    • B25J9/1679—Program controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37411—Measure contact from force and velocity detection
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39013—Locate movable manipulator relative to object, compare to stored gridpoints
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39041—Calibrate only for end position
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/39—Robotics, robotics to robotics hand
    • G05B2219/39413—Robot self diagnostics

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Control Of Position Or Direction (AREA)
AT08165581T 2007-10-05 2008-10-01 Zielpositionserkennungsvorrichtung für einen roboter ATE525177T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007262720A JP5235376B2 (ja) 2007-10-05 2007-10-05 ロボットのターゲット位置検出装置

Publications (1)

Publication Number Publication Date
ATE525177T1 true ATE525177T1 (de) 2011-10-15

Family

ID=40303623

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08165581T ATE525177T1 (de) 2007-10-05 2008-10-01 Zielpositionserkennungsvorrichtung für einen roboter

Country Status (5)

Country Link
US (1) US8121732B2 (de)
EP (1) EP2045049B1 (de)
JP (1) JP5235376B2 (de)
KR (1) KR101025017B1 (de)
AT (1) ATE525177T1 (de)

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ES2383718T3 (es) 2007-04-26 2012-06-25 Adept Technology Inc. Aparato de agarre por vacío
US8400177B2 (en) * 2008-09-01 2013-03-19 Chimei Innolux Corporation Device and method for testing display panel
US20100188034A1 (en) * 2009-01-23 2010-07-29 Derek Young Trainable Robot and Method of Training
DE102009058607A1 (de) * 2009-12-17 2011-06-22 KUKA Laboratories GmbH, 86165 Verfahren und Vorrichtung zum Steuern eines Manipulators
DE102010010718A1 (de) * 2010-03-09 2011-09-15 Kuka Laboratories Gmbh Verfahren zur Montage von Bauteilen mittels eines Industrieroboters
EP2547490B1 (de) * 2010-03-18 2014-01-08 ABB Research Ltd. Kalibrierung eines basiskoordinatensystems für einen industrieroboter
JP5621796B2 (ja) * 2012-01-31 2014-11-12 株式会社安川電機 搬送システム
TWI456685B (zh) * 2012-05-02 2014-10-11 Advanced Wireless Semiconductor Company 應用於聚光型太陽能電池之蝕刻設備之晶圓傳輸裝置
JP6208419B2 (ja) * 2012-09-19 2017-10-04 株式会社ダイヘン 算出装置、搬送ロボットシステム、及び算出方法
JP6438189B2 (ja) * 2013-10-01 2018-12-12 川崎重工業株式会社 ロボット及びロボットの制御方法
US9718187B2 (en) * 2014-06-11 2017-08-01 Canon Kabushiki Kaisha Robot controlling method, robot apparatus, program, recording medium, and method for manufacturing assembly component
CN104022195B (zh) * 2014-06-19 2017-05-17 付霞 一种led支架卸取装置
TWI710440B (zh) 2014-11-10 2020-11-21 美商布魯克斯自動機械公司 工具自動教導方法及設備
WO2016103292A1 (ja) * 2014-12-22 2016-06-30 川崎重工業株式会社 ロボットシステム及びエンドエフェクタの変形検出方法
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US9815198B2 (en) * 2015-07-23 2017-11-14 X Development Llc System and method for determining a work offset
EP3600787A4 (de) * 2017-03-26 2021-01-13 Genesis Robotics and Motion Technologies Canada, ULC Roboterarm
WO2018180099A1 (ja) * 2017-03-29 2018-10-04 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板移載ユニット及び基板処理装置及び半導体装置の製造方法
JP7207094B2 (ja) * 2019-03-29 2023-01-18 セイコーエプソン株式会社 水平多関節ロボット
JP2020163548A (ja) * 2019-03-29 2020-10-08 セイコーエプソン株式会社 水平多関節ロボットおよびロボットシステム
CN112091960B (zh) * 2019-06-17 2024-08-02 库卡机器人(广东)有限公司 机器人、用于机器人的接触检测方法和相关装置
JP7356269B2 (ja) * 2019-07-01 2023-10-04 川崎重工業株式会社 ロボット制御装置、並びにそれを備えるロボット及びロボットシステム
CN112296997B (zh) * 2019-07-31 2022-01-14 上海微电子装备（集团）股份有限公司 一种机械手交接工位标定方法、装置、设备及存储介质
JP7409800B2 (ja) * 2019-08-09 2024-01-09 川崎重工業株式会社 ロボット制御装置、ロボット、及びロボット制御方法
JP7330876B2 (ja) * 2019-12-13 2023-08-22 川崎重工業株式会社 位置検出方法、制御装置及びロボットシステム
EP3944932B1 (de) * 2020-07-27 2024-09-11 ABB Schweiz AG Verfahren und montageeinheit zur durchführung von montageoperationen
CN112140098B (zh) * 2020-09-15 2022-06-21 天津大学 基于近端策略优化的水下蛇形机器人高速步态生成方法
JP7671574B2 (ja) * 2020-10-02 2025-05-02 ニデックインスツルメンツ株式会社 産業用ロボット
JP7426333B2 (ja) * 2020-11-30 2024-02-01 株式会社ダイヘン ロボット制御装置

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Also Published As

Publication number Publication date
US8121732B2 (en) 2012-02-21
EP2045049B1 (de) 2011-09-21
KR20090035446A (ko) 2009-04-09
JP2009090406A (ja) 2009-04-30
EP2045049A3 (de) 2009-05-06
JP5235376B2 (ja) 2013-07-10
KR101025017B1 (ko) 2011-03-25
US20090093908A1 (en) 2009-04-09
EP2045049A2 (de) 2009-04-08

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties