ATE524765T1 - Fotoaktivierbare stickstoffbasen - Google Patents

Fotoaktivierbare stickstoffbasen

Info

Publication number
ATE524765T1
ATE524765T1 AT08718153T AT08718153T ATE524765T1 AT E524765 T1 ATE524765 T1 AT E524765T1 AT 08718153 T AT08718153 T AT 08718153T AT 08718153 T AT08718153 T AT 08718153T AT E524765 T1 ATE524765 T1 AT E524765T1
Authority
AT
Austria
Prior art keywords
alkyl
hydrogen
nitrogen bases
unsubstituted
substituted
Prior art date
Application number
AT08718153T
Other languages
German (de)
English (en)
Inventor
Kurt Dietliker
Katharina Misteli
Katia Studer
Tunja Jung
Lothar Alexander Engelbrecht
Original Assignee
Basf Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se filed Critical Basf Se
Application granted granted Critical
Publication of ATE524765T1 publication Critical patent/ATE524765T1/de

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D487/00Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D487/00Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • C07D487/02Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
    • C07D487/04Ortho-condensed systems
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202Masking pattern being obtained by thermal means, e.g. laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Paints Or Removers (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Indole Compounds (AREA)
AT08718153T 2007-04-03 2008-03-25 Fotoaktivierbare stickstoffbasen ATE524765T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07105510 2007-04-03
PCT/EP2008/053456 WO2008119688A1 (en) 2007-04-03 2008-03-25 Photoactivable nitrogen bases

Publications (1)

Publication Number Publication Date
ATE524765T1 true ATE524765T1 (de) 2011-09-15

Family

ID=38016564

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08718153T ATE524765T1 (de) 2007-04-03 2008-03-25 Fotoaktivierbare stickstoffbasen

Country Status (9)

Country Link
US (3) US9921477B2 (https=)
EP (1) EP2145231B1 (https=)
JP (1) JP5606308B2 (https=)
KR (2) KR101944734B1 (https=)
CN (1) CN101641643B (https=)
AT (1) ATE524765T1 (https=)
CA (1) CA2681201C (https=)
MX (1) MX2009010309A (https=)
WO (1) WO2008119688A1 (https=)

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CN107438513B (zh) 2015-02-05 2020-12-29 卡本有限公司 通过间歇曝光的增材制造方法
US10391711B2 (en) 2015-03-05 2019-08-27 Carbon, Inc. Fabrication of three dimensional objects with multiple operating modes
US10526440B2 (en) 2015-04-29 2020-01-07 3M Innovative Properties Company Method of making a polymer network from a polythiol and a polyepoxide
WO2017040883A1 (en) 2015-09-04 2017-03-09 Carbon, Inc. Cyanate ester dual cure resins for additive manufacturing
WO2017044381A1 (en) 2015-09-09 2017-03-16 Carbon3D, Inc. Epoxy dual cure resins for additive manufacturing
US10647873B2 (en) 2015-10-30 2020-05-12 Carbon, Inc. Dual cure article of manufacture with portions of differing solubility
WO2017079502A1 (en) 2015-11-05 2017-05-11 Carbon, Inc. Silicone dual cure resins for additive manufacturing
CN108475008B (zh) 2015-12-22 2020-11-06 卡本有限公司 一种形成三维物体的方法
US10343331B2 (en) 2015-12-22 2019-07-09 Carbon, Inc. Wash liquids for use in additive manufacturing with dual cure resins
WO2017112653A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Dual precursor resin systems for additive manufacturing with dual cure resins
WO2017112751A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Blocked silicone dual cure resins for additive manufacturing
US10501572B2 (en) 2015-12-22 2019-12-10 Carbon, Inc. Cyclic ester dual cure resins for additive manufacturing
WO2017112571A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products
WO2017112483A2 (en) 2015-12-22 2017-06-29 Carbon, Inc. Accelerants for additive manufacturing with dual cure resins
US10500786B2 (en) 2016-06-22 2019-12-10 Carbon, Inc. Dual cure resins containing microwave absorbing materials and methods of using the same
KR102426999B1 (ko) 2016-10-14 2022-08-01 바스프 에스이 경질화가능한 중합체 조성물
WO2018094131A1 (en) * 2016-11-21 2018-05-24 Carbon, Inc. Method of making three-dimensional object by delivering reactive component for subsequent cure
JP7109438B2 (ja) 2016-12-05 2022-07-29 アーケマ・インコーポレイテッド 重合開始剤ブレンド物、およびそのような重合開始剤ブレンド物を含む3dプリンティングに有用な光硬化性組成物
WO2018165090A1 (en) 2017-03-09 2018-09-13 Carbon, Inc. Tough, high temperature polymers produced by stereolithography
US10367228B2 (en) * 2017-04-07 2019-07-30 Seeo, Inc. Diester-based polymer electrolytes for high voltage lithium ion batteries
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
CN213006569U (zh) 2017-06-21 2021-04-20 卡本有限公司 用于增材制造的系统和对分配用于增材制造的树脂有用的分配系统
US10980821B2 (en) 2017-11-24 2021-04-20 Lunella Biotech, Inc. Triphenylphosphonium-derivative compounds for eradicating cancer stem cells
US11135649B2 (en) 2018-02-27 2021-10-05 Arizona Board Of Regents On Behalf Of Arizona State University Direct metal printing with stereolithography
US11504903B2 (en) 2018-08-28 2022-11-22 Carbon, Inc. 1K alcohol dual cure resins for additive manufacturing
EP3848179A1 (de) 2020-01-10 2021-07-14 Carl Zeiss Vision International GmbH Inkjet-verfahren zur herstellung eines brillenglases
US20220011670A1 (en) * 2020-07-08 2022-01-13 International Business Machines Corporation Resist underlayer surface modification
DE102022110540A1 (de) 2022-04-29 2023-11-02 tooz technologies GmbH Verfahren zur anpassung des brechungsindex
CN117466862B (zh) * 2022-07-20 2025-10-21 天津久日新材料股份有限公司 一种含硫光引发剂及其制备方法和应用

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Also Published As

Publication number Publication date
KR101514093B1 (ko) 2015-04-21
CN101641643A (zh) 2010-02-03
KR20150005683A (ko) 2015-01-14
EP2145231A1 (en) 2010-01-20
CA2681201C (en) 2016-06-14
WO2008119688A1 (en) 2008-10-09
MX2009010309A (es) 2009-10-16
KR20100016136A (ko) 2010-02-12
JP5606308B2 (ja) 2014-10-15
CN101641643B (zh) 2013-08-07
EP2145231B1 (en) 2011-09-14
KR101944734B1 (ko) 2019-02-07
CA2681201A1 (en) 2008-10-09
US20100105794A1 (en) 2010-04-29
US9921477B2 (en) 2018-03-20
US20180217498A1 (en) 2018-08-02
US10928728B2 (en) 2021-02-23
US20210033972A1 (en) 2021-02-04
JP2010523515A (ja) 2010-07-15

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