JP5606308B2 - 光活性窒素塩基 - Google Patents

光活性窒素塩基 Download PDF

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Publication number
JP5606308B2
JP5606308B2 JP2010501474A JP2010501474A JP5606308B2 JP 5606308 B2 JP5606308 B2 JP 5606308B2 JP 2010501474 A JP2010501474 A JP 2010501474A JP 2010501474 A JP2010501474 A JP 2010501474A JP 5606308 B2 JP5606308 B2 JP 5606308B2
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JP
Japan
Prior art keywords
alkylene
alkyl
substituted
interrupted
unsubstituted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010501474A
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English (en)
Japanese (ja)
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JP2010523515A5 (https=
JP2010523515A (ja
Inventor
ディートリカー クルト
ミステリ カタリーナ
スチューダー カティア
ユング トゥンヤ
アレキサンダー エンゲルブレヒト ローター
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BASF SE
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BASF SE
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Publication date
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Publication of JP2010523515A5 publication Critical patent/JP2010523515A5/ja
Application granted granted Critical
Publication of JP5606308B2 publication Critical patent/JP5606308B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D487/00—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00
    • C07D487/02—Heterocyclic compounds containing nitrogen atoms as the only ring hetero atoms in the condensed system, not provided for by groups C07D451/00 - C07D477/00 in which the condensed system contains two hetero rings
    • C07D487/04—Ortho-condensed systems
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Ceramic Engineering (AREA)
  • Paints Or Removers (AREA)
  • Polymerisation Methods In General (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Nitrogen And Oxygen Or Sulfur-Condensed Heterocyclic Ring Systems (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Indole Compounds (AREA)
JP2010501474A 2007-04-03 2008-03-25 光活性窒素塩基 Expired - Fee Related JP5606308B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07105510.7 2007-04-03
EP07105510 2007-04-03
PCT/EP2008/053456 WO2008119688A1 (en) 2007-04-03 2008-03-25 Photoactivable nitrogen bases

Publications (3)

Publication Number Publication Date
JP2010523515A JP2010523515A (ja) 2010-07-15
JP2010523515A5 JP2010523515A5 (https=) 2011-11-10
JP5606308B2 true JP5606308B2 (ja) 2014-10-15

Family

ID=38016564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010501474A Expired - Fee Related JP5606308B2 (ja) 2007-04-03 2008-03-25 光活性窒素塩基

Country Status (9)

Country Link
US (3) US9921477B2 (https=)
EP (1) EP2145231B1 (https=)
JP (1) JP5606308B2 (https=)
KR (2) KR101944734B1 (https=)
CN (1) CN101641643B (https=)
AT (1) ATE524765T1 (https=)
CA (1) CA2681201C (https=)
MX (1) MX2009010309A (https=)
WO (1) WO2008119688A1 (https=)

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CN107438513B (zh) 2015-02-05 2020-12-29 卡本有限公司 通过间歇曝光的增材制造方法
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WO2017040883A1 (en) 2015-09-04 2017-03-09 Carbon, Inc. Cyanate ester dual cure resins for additive manufacturing
WO2017044381A1 (en) 2015-09-09 2017-03-16 Carbon3D, Inc. Epoxy dual cure resins for additive manufacturing
US10647873B2 (en) 2015-10-30 2020-05-12 Carbon, Inc. Dual cure article of manufacture with portions of differing solubility
WO2017079502A1 (en) 2015-11-05 2017-05-11 Carbon, Inc. Silicone dual cure resins for additive manufacturing
CN108475008B (zh) 2015-12-22 2020-11-06 卡本有限公司 一种形成三维物体的方法
US10343331B2 (en) 2015-12-22 2019-07-09 Carbon, Inc. Wash liquids for use in additive manufacturing with dual cure resins
WO2017112653A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Dual precursor resin systems for additive manufacturing with dual cure resins
WO2017112751A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Blocked silicone dual cure resins for additive manufacturing
US10501572B2 (en) 2015-12-22 2019-12-10 Carbon, Inc. Cyclic ester dual cure resins for additive manufacturing
WO2017112571A1 (en) 2015-12-22 2017-06-29 Carbon, Inc. Dual cure additive manufacturing of rigid intermediates that generate semi-rigid, flexible, or elastic final products
WO2017112483A2 (en) 2015-12-22 2017-06-29 Carbon, Inc. Accelerants for additive manufacturing with dual cure resins
US10500786B2 (en) 2016-06-22 2019-12-10 Carbon, Inc. Dual cure resins containing microwave absorbing materials and methods of using the same
KR102426999B1 (ko) 2016-10-14 2022-08-01 바스프 에스이 경질화가능한 중합체 조성물
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JP7109438B2 (ja) 2016-12-05 2022-07-29 アーケマ・インコーポレイテッド 重合開始剤ブレンド物、およびそのような重合開始剤ブレンド物を含む３ｄプリンティングに有用な光硬化性組成物
WO2018165090A1 (en) 2017-03-09 2018-09-13 Carbon, Inc. Tough, high temperature polymers produced by stereolithography
US10367228B2 (en) * 2017-04-07 2019-07-30 Seeo, Inc. Diester-based polymer electrolytes for high voltage lithium ion batteries
US10316213B1 (en) 2017-05-01 2019-06-11 Formlabs, Inc. Dual-cure resins and related methods
CN213006569U (zh) 2017-06-21 2021-04-20 卡本有限公司 用于增材制造的系统和对分配用于增材制造的树脂有用的分配系统
US10980821B2 (en) 2017-11-24 2021-04-20 Lunella Biotech, Inc. Triphenylphosphonium-derivative compounds for eradicating cancer stem cells
US11135649B2 (en) 2018-02-27 2021-10-05 Arizona Board Of Regents On Behalf Of Arizona State University Direct metal printing with stereolithography
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Also Published As

Publication number Publication date
KR101514093B1 (ko) 2015-04-21
CN101641643A (zh) 2010-02-03
KR20150005683A (ko) 2015-01-14
EP2145231A1 (en) 2010-01-20
ATE524765T1 (de) 2011-09-15
CA2681201C (en) 2016-06-14
WO2008119688A1 (en) 2008-10-09
MX2009010309A (es) 2009-10-16
KR20100016136A (ko) 2010-02-12
CN101641643B (zh) 2013-08-07
EP2145231B1 (en) 2011-09-14
KR101944734B1 (ko) 2019-02-07
CA2681201A1 (en) 2008-10-09
US20100105794A1 (en) 2010-04-29
US9921477B2 (en) 2018-03-20
US20180217498A1 (en) 2018-08-02
US10928728B2 (en) 2021-02-23
US20210033972A1 (en) 2021-02-04
JP2010523515A (ja) 2010-07-15

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