ATE521988T1 - Verfahren zur elektrischen verbindung eines bauteils mit einsätzen mit ausgleichsblöcken - Google Patents

Verfahren zur elektrischen verbindung eines bauteils mit einsätzen mit ausgleichsblöcken

Info

Publication number
ATE521988T1
ATE521988T1 AT09726241T AT09726241T ATE521988T1 AT E521988 T1 ATE521988 T1 AT E521988T1 AT 09726241 T AT09726241 T AT 09726241T AT 09726241 T AT09726241 T AT 09726241T AT E521988 T1 ATE521988 T1 AT E521988T1
Authority
AT
Austria
Prior art keywords
component
inserts
electrically connecting
compensation blocks
conductive
Prior art date
Application number
AT09726241T
Other languages
English (en)
Inventor
Damien Saint-Patrice
Francois Marion
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE521988T1 publication Critical patent/ATE521988T1/de

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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Joining Of Building Structures In Genera (AREA)
  • Buildings Adapted To Withstand Abnormal External Influences (AREA)
  • Prostheses (AREA)
AT09726241T 2008-02-22 2009-02-19 Verfahren zur elektrischen verbindung eines bauteils mit einsätzen mit ausgleichsblöcken ATE521988T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0851141A FR2928032B1 (fr) 2008-02-22 2008-02-22 Composant de connexion muni d'inserts avec cales compensatrices.
PCT/FR2009/000185 WO2009118468A2 (fr) 2008-02-22 2009-02-19 Composant de connexion muni d'inserts avec cales compensatrices

Publications (1)

Publication Number Publication Date
ATE521988T1 true ATE521988T1 (de) 2011-09-15

Family

ID=39789569

Family Applications (1)

Application Number Title Priority Date Filing Date
AT09726241T ATE521988T1 (de) 2008-02-22 2009-02-19 Verfahren zur elektrischen verbindung eines bauteils mit einsätzen mit ausgleichsblöcken

Country Status (6)

Country Link
US (1) US20110041332A1 (de)
EP (1) EP2250670B1 (de)
JP (1) JP2011515019A (de)
AT (1) ATE521988T1 (de)
FR (1) FR2928032B1 (de)
WO (1) WO2009118468A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2994331B1 (fr) 2012-07-31 2014-09-12 Commissariat Energie Atomique Procede d'assemblage de deux composants electroniques entre eux, de type flip-chip
FR2996053A1 (fr) * 2012-09-27 2014-03-28 Commissariat Energie Atomique Procede d'assemblage de deux composants electroniques, de type flip-chip, assemblage obtenu selon le procede.

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5768109A (en) * 1991-06-26 1998-06-16 Hughes Electronics Multi-layer circuit board and semiconductor flip chip connection
JPH0521523A (ja) * 1991-07-17 1993-01-29 Matsushita Electric Works Ltd 半導体装置実装用基板
JPH07153796A (ja) * 1993-11-30 1995-06-16 Toshiba Corp 半導体実装装置およびその製造方法
JP3160175B2 (ja) * 1995-02-13 2001-04-23 三菱電機株式会社 電子部品の実装方法
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JP2011515019A (ja) 2011-05-12
EP2250670B1 (de) 2011-08-24
EP2250670A2 (de) 2010-11-17
US20110041332A1 (en) 2011-02-24
WO2009118468A3 (fr) 2009-12-23
FR2928032A1 (fr) 2009-08-28
FR2928032B1 (fr) 2011-06-17
WO2009118468A2 (fr) 2009-10-01

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