SG10201403133SA - Processing facility - Google Patents
Processing facilityInfo
- Publication number
- SG10201403133SA SG10201403133SA SG10201403133SA SG10201403133SA SG10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA SG 10201403133S A SG10201403133S A SG 10201403133SA
- Authority
- SG
- Singapore
- Prior art keywords
- contact surface
- processing facility
- side contact
- container
- hole
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Mechanical Engineering (AREA)
Abstract
22 TITLE OF THE INVENTION: PROCESSING FACILITY Abstract A processing facility is disclosed in which a container side contact surface and a support side contact surface are in contact with each other and a 5 supply hole or a discharge hole, and a communicating hole are allowed to communicate with each other when a container is supported by a container support, and in which the container side contact surface is formed to be flat at least in a periphery of the communicating hole, and the support side contact surface is formed to have a shape that is gradually lower as a distance 10 increases from the supply hole or the discharge hole. Fig. 7
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013134264A JP5888287B2 (en) | 2013-06-26 | 2013-06-26 | Processing equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201403133SA true SG10201403133SA (en) | 2015-01-29 |
Family
ID=52114442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201403133SA SG10201403133SA (en) | 2013-06-26 | 2014-06-11 | Processing facility |
Country Status (6)
Country | Link |
---|---|
US (1) | US9520311B2 (en) |
JP (1) | JP5888287B2 (en) |
KR (1) | KR102236231B1 (en) |
CN (1) | CN104253069B (en) |
SG (1) | SG10201403133SA (en) |
TW (1) | TWI630677B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7328727B2 (en) * | 2004-04-18 | 2008-02-12 | Entegris, Inc. | Substrate container with fluid-sealing flow passageway |
KR101418812B1 (en) * | 2012-10-31 | 2014-07-16 | 크린팩토메이션 주식회사 | Apparatus for stocking and purging wafer at ceiling |
US9257320B2 (en) * | 2013-06-05 | 2016-02-09 | GlobalFoundries, Inc. | Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication |
JP6160520B2 (en) * | 2014-03-11 | 2017-07-12 | 株式会社ダイフク | Maintenance equipment for ladders and storage shelves equipped with them |
US9550219B2 (en) * | 2014-12-29 | 2017-01-24 | Daifuku Co., Ltd. | Apparatus of inhalation type for stocking wafer at ceiling and inhaling type wafer stocking system having the same |
JP6414525B2 (en) * | 2015-09-02 | 2018-10-31 | 株式会社ダイフク | Storage facilities |
JP6455404B2 (en) * | 2015-11-17 | 2019-01-23 | 株式会社ダイフク | Container transfer equipment |
JP6460015B2 (en) * | 2016-03-07 | 2019-01-30 | 株式会社ダイフク | Container transfer equipment |
JP6623988B2 (en) * | 2016-09-09 | 2019-12-25 | 株式会社ダイフク | Container storage equipment |
WO2018150698A1 (en) * | 2017-02-20 | 2018-08-23 | 村田機械株式会社 | Purge stocker |
KR20200022682A (en) * | 2018-08-23 | 2020-03-04 | 세메스 주식회사 | Buffer unit, Apparatus and Method for treating substrate with the unit |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5810062A (en) * | 1996-07-12 | 1998-09-22 | Asyst Technologies, Inc. | Two stage valve for charging and/or vacuum relief of pods |
US5879458A (en) * | 1996-09-13 | 1999-03-09 | Semifab Incorporated | Molecular contamination control system |
JP3167970B2 (en) * | 1997-10-13 | 2001-05-21 | ティーディーケイ株式会社 | Clean box, clean transfer method and device |
US5988233A (en) * | 1998-03-27 | 1999-11-23 | Asyst Technologies, Inc. | Evacuation-driven SMIF pod purge system |
US6164664A (en) * | 1998-03-27 | 2000-12-26 | Asyst Technologies, Inc. | Kinematic coupling compatible passive interface seal |
US6364152B1 (en) * | 2000-04-12 | 2002-04-02 | Dart Industries Inc. | Food storage container |
US6742532B2 (en) * | 2002-01-09 | 2004-06-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Cleaning container and method for cleaning LP furnace thermocouple sleeves |
US7823730B2 (en) * | 2002-09-11 | 2010-11-02 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
US20040237244A1 (en) * | 2003-05-26 | 2004-12-02 | Tdk Corporation | Purge system for product container and interface seal used in the system |
JP2004345715A (en) | 2003-05-26 | 2004-12-09 | Tdk Corp | Purge system for product storing container |
JP4558594B2 (en) * | 2005-06-24 | 2010-10-06 | 近藤工業株式会社 | Breath filter device with shutter, shutter push-up rod used in the device, and nozzle with shutter push-up rod |
KR101442451B1 (en) * | 2005-09-27 | 2014-09-22 | 엔테그리스, 아이엔씨. | Reticle Pod |
US7422107B2 (en) * | 2006-01-25 | 2008-09-09 | Entegris, Inc. | Kinematic coupling with textured contact surfaces |
WO2007116527A1 (en) * | 2006-04-11 | 2007-10-18 | Hirata Corporation | Foup door positioning device for foup opener |
KR101494024B1 (en) * | 2007-02-28 | 2015-02-16 | 엔테그리스, 아이엔씨. | Purge system for a substrate container |
US7631912B2 (en) * | 2007-07-31 | 2009-12-15 | Evergreen Packaging Inc. | Lifting device for a vacuum transfer system |
TWM341303U (en) * | 2008-04-25 | 2008-09-21 | Santa Phoenix Technology Inc | Gas filling device for wafer storage box |
JP2010041015A (en) | 2008-08-05 | 2010-02-18 | Kondo Kogyo Kk | Storage shelf for semiconductor wafer housing container |
JP5155848B2 (en) | 2008-12-18 | 2013-03-06 | 日本ケンブリッジフィルター株式会社 | N2 purge device for FOUP |
US20100178137A1 (en) * | 2009-01-11 | 2010-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for moving substrates |
JP5236518B2 (en) * | 2009-02-03 | 2013-07-17 | 株式会社ダン・タクマ | Storage system and storage method |
CN102348549B (en) * | 2009-03-10 | 2016-02-03 | 株式会社普利司通 | Encapsulant |
JP2011187539A (en) * | 2010-03-05 | 2011-09-22 | Sinfonia Technology Co Ltd | Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method |
JP5440871B2 (en) * | 2010-08-20 | 2014-03-12 | 株式会社ダイフク | Container storage equipment |
JP5887719B2 (en) * | 2011-05-31 | 2016-03-16 | シンフォニアテクノロジー株式会社 | Purge device, load port, bottom purge nozzle body, bottom purge unit |
JP6131534B2 (en) * | 2012-06-11 | 2017-05-24 | シンフォニアテクノロジー株式会社 | Purge nozzle unit, load port, mounting table, stocker |
US20140041755A1 (en) * | 2012-08-09 | 2014-02-13 | Santa Phoenix Technology Inc. | Wafer pod gas charging apparatus |
-
2013
- 2013-06-26 JP JP2013134264A patent/JP5888287B2/en active Active
-
2014
- 2014-06-05 TW TW103119573A patent/TWI630677B/en active
- 2014-06-11 SG SG10201403133SA patent/SG10201403133SA/en unknown
- 2014-06-13 KR KR1020140072082A patent/KR102236231B1/en active IP Right Grant
- 2014-06-18 US US14/308,047 patent/US9520311B2/en active Active
- 2014-06-25 CN CN201410287742.7A patent/CN104253069B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104253069A (en) | 2014-12-31 |
JP2015012039A (en) | 2015-01-19 |
CN104253069B (en) | 2018-09-04 |
US20150000789A1 (en) | 2015-01-01 |
US9520311B2 (en) | 2016-12-13 |
KR102236231B1 (en) | 2021-04-02 |
TWI630677B (en) | 2018-07-21 |
KR20150001625A (en) | 2015-01-06 |
TW201511167A (en) | 2015-03-16 |
JP5888287B2 (en) | 2016-03-16 |
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