M341303 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種晶圓盒氣體填充裝置，尤指一種可 提高共用性以節省成本之晶圓盒氣體填充裝置者。 【先前技術】 * 於一般半導體製程中，因為製程需要而會把晶圓片容 ^ ' 置於晶圓盒内，並且於晶圓盒内填充氣體，例如氮氣，藉 Φ 以防止晶圓盒内之晶圓片發生腐蝕或受到污染等問題。 傳統上，晶圓盒皆會設計有填充氣嘴，而氮氣則是經 由填充氣嘴填充至晶圓盒内。然而，習知之晶圓盒之種類 至少有二種，而其填充氣嘴之數量也因此不同，例如其中 一種類之晶圓盒其填充氣嘴之數量為二個，另一種類則有 四個，甚者，晶圓盒之填充氣嘴之位置也不相同。因此， 當欲進行晶圓盒氣體之填充作業時，即必須使用二種以上 0 之機台以配合不同種類之晶圓盒。 因此，如上所述，必須配合晶圓盒之種類而必須使用 • 不同種類之機台，以對晶圓盒進行氣體填充作業，故於使 • 用上無法達成共用之目的，相對造成成本增加，實非十分 、理想。 因此，如何創作出一種晶圓盒氣體填充裝置，以使晶 圓盒氣體填充裝置可提高共用性以節省成本，將是本創作 所欲積極揭露之處。 M341303 【新型内容】 有鑑於上述習知晶圓盒氣體填充裝置之缺憾，創作人 有感其未臻於完善，遂竭其心智悉心研究克服，憑其從事 該項產業多年之累積經驗，進而研發出一種晶圓盒氣體填 充裝置，以期達到提高晶圓盒氣體填充裝置之共用性以節 省成本的目的。 本創作之主要目的在提供一種晶圓盒氣體填充裝置， 其藉著機台所設置之喷嘴之結構設計改變，使同一機台即 可適用於不同種類之晶圓盒之氣體填充作業，並因此達到 提高共用性以節省成本之目的。 為達上述目的，本創作之晶圓盒氣體填充裝置係搭配 一晶圓盒使用，此晶圓盒包含一底面，且此底面包含一特 定位置、至少二填充氣嘴以及至少三定位孔。 此外，本創作之晶圓盒氣體填充裝置包含一機台、一 感測件、至少二第一喷嘴、至少二第二喷嘴、至少三定位 模組、一氣體填充器以及一控制器。 上述之機台包含一作業板，其係承置晶圓盒並對應鄰 接於晶圓盒之底面，且感測件、第一喷嘴、第二喷嘴以及 定位模組係皆組設於機台之作業板。其中，感測件係對應 於晶圓盒之特定位置；每一第二喷嘴分別包含一第二喷嘴 内管、一第二喷嘴外環以及一第二喷嘴彈性件，其中之第 二喷嘴彈性件係組設於第二喷嘴外環，第二喷嘴内管係容 置於第二喷嘴外環並頂抵於第二喷嘴彈性件，並以第二喷 嘴彈性件之彈力相對於第二喷嘴外環滑移；每一定位模組 M341303 分別包含一定位銷，其係分別對應插入於上述晶圓盒之每 一定位孔。 此外，氣體填充器係組設於上述之機台並容置有一氣 ^ 體，此氣體填充器並連通第一喷嘴與第二喷嘴，且此氣體 填充器包含一控制單元。 另外，控制器係組設於上述之機台並電連接於氣體填 ' 充器之控制單元與感測件。而第一喷嘴或第二喷嘴係分別 ' 對應連接於晶圓盒之填充氣嘴。 I 因此，於使用時，感測件係對應於晶圓盒之特定位置 並藉以感測得知晶圓盒之種類，而控制器並控制氣體填充 器以氣體經由填充氣嘴、及連接於填充氣嘴之第一喷嘴或 第二喷嘴而對晶圓盒進行氣體填充作業，同時，不同種類 之晶圓盒其填充氣嘴之深度也會不同，故第二喷嘴設計成 具有彈性滑移之結構，以配合其所搭配之晶圓盒之填充氣 嘴。 _ 藉此，本創作可藉由機台所設置之喷嘴之結構設計改 變，使同一機台即可適用於不同種類之晶圓盒以進行氣體 • 之填充作業，並因此達到提高共用性以節省成本之目的。 【實施方式】 為充分瞭解本創作之目的、特徵及功效，茲藉由下述 具體之實施例，並配合所附之圖式，對本創作做一詳細說 明，說明如後： 請參閱第一圖，其係為本創作較佳具體實施例之晶圓 M341303 盒之立體圖 圓盒9。 圖式中顯示有一般半導體製程中所使用之晶 請同時參閱第一圖、第二圖及第三圖，其中，第二圖 ，為本創作較佳.具體實施例之第-種類晶圓盒之仰視圖: 第三圖係為本創作較佳具體實施例之第二種類晶圓盒之仰 視圖’傳統上，第一圖之晶圓盒9可分為如第二圖；示之 第一種類晶圓盒901及第三圖所示之第二種類晶圓盒9 0 2° 其中，第二圖所示之第一種類晶圓盒9 〇丄包含一底 =9 0 ’且此底面9 〇包含—特定位置9 i、四個填充氣 為9 2以及二個定位孔9 3。前述之特定位置9 1於第一 ，類晶圓盒9 〇 1係為-假想區域’其係相對於第二種類 日日圓夏9 〇 2而§，詳細如下所述。又，四個填充氣嘴9 2可分為進氣用與排氣用，於實際使用上可分為兩個為一 組0 此外，第三圖所示之第二種類晶圓盒9 〇 2同樣包含 底面9 5，且此底面9 5同樣包含一特定位置9 6、二 個填，氣嘴9 7以及三個定位孔9 8。前述之歡位置I 6於第二種類晶圓盒9 0 2係凹設有一凹槽g 6 1，故其 相對於第-種類晶圓盒9 〇 1而言，差別在於有無凹槽9 6 1之結構。X ’ 一個填充氣嘴9 7可分為進氣用與排氣 用，且於本實施例中，其深度係相較於第一種類晶圓盒9 0 1之四個填充氣嘴9 2之深度為深。 明參閱第四圖，其係為本創作較佳具體實施例之機台 M341303 之組裝示意圖，其中顯示有一機台2、一感測件8、四個 第一喷嘴3、二個第二喷嘴4、三個定位模組5、一氣體 填充器6以及一控制器7。 其中，機台2包含一作業板2 1，且感測件8、四個 第一喷嘴3、二個第二喷嘴4以及三個定位模組5係皆組 設於作業板2 1，而氣體填充器6以及控制器7則係皆組 ' 設於機台2。 . 上述之感測件8於本實施例中包含一光感應器81以 '· 及一按鍵式光學感測器8 2，且三個定位模組5之每一定 位模組5分別包含一定位銷51以及一按鍵式光學感測器 5 2，其二者係位於鄰近位置而組設。 於此欲說明的是，所謂之按鍵式光學感測器係利用其 凸出點受外力施壓而造成上下位移，並以上下位移遮斷其 内部之光線感應，藉以造成電路開閉（〇N/〇F F)之 效果，並藉以達到感測之目的。關於前述之按鍵式光學感 _ 測器之結構原理，係為熟悉該項技藝者所易於得知之事 項，故於此不再加以詳細贅述。 • 請同時參閱第四圖及第五圖，其中之第五圖係為本創 • 作較佳具體實施例之機台之立體圖，關於上述各個元件係 . 皆以螺絲進行組裝，而組裝後之機台2即如第五圖所示。 請同時參閱第四圖、第六圖、第七圖以及第八圖，其 中，第六圖係為本創作較佳具體實施例之第一喷嘴之分解 圖，第七圖係為本創作較佳具體實施例之第一喷嘴之立體 圖，第八圖係為本創作較佳具體實施例之第一喷嘴之剖視 9 M341303 圖’於圖式中顯示組設於機台2作業板2 1之每-第-噴 嘴3分別具有-第-噴嘴出氣孔31以及一第一喷嘴進氣 孔3 2 ’且每-第一噴嘴3之第一噴嘴出氣 設有一橡膠環311。 參閱第四圖、第九圖、第十圖及第十—圖，其 中’第九圖係為本創作較佳具體實施例之第二噴嘴之分解 圖，f十圖係為本創作較佳具體實施例之第二喷嘴之立體 圖’第十-圖係為本創作較佳具體實施例之第二喷嘴之剖 視圖，於圖式中顯示組設於機台2作業板2工之每一第: 喷嘴4分別包含一第二喷嘴内管4 3、-第二嘴嘴外環4 4以及一第二喷嘴彈性件4 5，於本實施例中，第二喷嘴 舞性W 5係為-彈簧，且其係組設於第二嘴嘴外環4 f ’而第二喷嘴时4 3係容置於第二喷嘴外環4 4並頂 抵於第二喷嘴彈性件45，並以第二喷嘴彈性件4 5之彈 力相對於第二喷嘴外環4 4滑移，同時，第二喷嘴内管4 3並射-第二嘴嘴錢孔41以及—第二喷嘴進氣孔4 二Sr喷嘴4ί第二嘴嘴出氣孔41處分別設有 44 1 1 ’並^母—第二喷嘴4之第二嘴嘴内管4 3分別螺鎖有一螺帽4 6。 ,nr圖及第五圖’上述之第一嘴嘴3與第二 貧==後，因第二種類晶圓盒9〇2之填充氣嘴9 參閱弟三圓）其深度係相較於第—種類晶圓盒9 〇 =請參閱第二圖)之深度為深，故組設 弟一貧鳥4 _相較於第一噴嘴3高出一段距離。 M341303 此外，組設於機台2之氣體填充器6容置有一氣體6 2 ’於本實施例中’此氣體62係—氮氣，且氣體造充哭 Θ並連通四個第-喷嘴3與二個第二喷嘴4 L氣^ 填充器6包含-控制單元6丄，且此控制單元6丄包含一 氣體壓力感測器6 1 1。 另外，組設於機台2之控制器7係分別電連接於氣體 填充器6之控制單元6 1、感測件8之光感應器8丄‘ 鍵式光學感測器82以及每-定位模組5之按學 測器5 2。 、兀子a 請同時參閱第二圖、第四圖、第五圖、第七圖以及第 八圖’㈣第—種類晶圓盒9 〇 i進行氣體填充作業時， 可先將第-種類晶圓盒9 0工置放於機台2之作業板 ^ ’亦即作業板21係承置第—種類晶圓盒9 〇 i並對應 郇接於其底面9 0，此時，感測件8係對應於第—種類晶 圓盒9〇1底面90之特定位置91，且每一定且 係分別對應插入於第—種類晶圓盒9〇、M =90之母—定位孔93’同時H位模組5之按鍵 式光學感測器52係對應頂抵於第一種類晶圓盒9〇ι之 底面9 0。 上德於=晶圓盒9 ”置放於機台2之作業板2 1 圓各q 位置9 1亚無凹槽之結構，故第-種類晶 :盈〇1之底面9◦會對應施力並下M感測件8之按鍵 器82，因此，藉由此感測功能（例如因為下 i而產生位移’並因此遮斷其内部光線感應），即可得知目 M341303 f置放聰2之作業板Η上係為第-種類晶圓盒90 1並Γ 種類晶圓盒901底面9〇之特定位置9 ,/、、，、凹才曰之結構’故第一種類晶圓盒9〇ι之底面 光感應器81，亦即光感應器η 、列，一亦之距，而藉由光線行進距離長短之感 ^亦可传知目前置放於機台2之作業板 =圓盒9〇1。前述同時利用光感應器81=: 感測® 8 2進行感測，可達到雙重檢查（d 〇 U b i e C h e C k)之效果。 叔9 當第一種類晶圓盒90 1置放於機台2之作業 上後，其填充氣嘴9 2會對應連接於第—噴嘴3 ’、 , 日日圓盈9 〇1之底面θ 〇會頂抵於第二喷 干），故二喷嘴4具有彈性之設計（如第十—圖所 4 一段距離，：二盒=广9 〇會下壓第二噴嘴 喷叙作動示意圖^為本創作較佳具體實施例之第二 板2 Γ二:當第一種類晶圓盒9〇 1置放於機台2之作業 由第ST7可控制氣體填充器6以_ 出廣、弟喷嘴進氣孔32入氣而由第一喷嘴 οϊ進及填充氣嘴92而對第一種類晶圓盒9 每-第另，進行氣體填充作業時，藉由 1 1，可緊密栽人二第^^孔31處所設之橡膝環3 甘入σ於弟一種類晶圓盒9 〇 1之填充氣嘴9 12 M341303 2 ’亚藉以防止氣體產生Ά漏之問題。 =同日终閱第三圖、第四圖、第五圖、第九圖、第十 圖、第十一圖以及第十二圖，當欲對第二種類晶圓盒9 〇 填充作業時’同樣的’可先將第二種類晶圓盒 f放於機台2之作業板2 1上，亦即作業板2工係 .承置第二種類晶圓盒9 0 2並對應鄰接於其底面9 5，此 %二感測件8係對應於第二種類晶圓盒9 0 2底面9 5之 .特定位置^6，且每一定位模組5之定位鎖5 1係分別對 應插入^第^種類晶圓盒㈣2底©9 5之mu 9. =同Ί疋位模組5之按鍵式光學感測器5 2係對 應頂抵於第二種類晶圓盒9 Q 2之底面9 5。 於第二種類晶圓盒9 0 2置放於機台2之作筆板2 上後，因其特定位置96具有凹槽961之結構:故^ 種類晶圓盒9 0 2之底面9 5並不會施壓於感測件8之: !=感測器82 ’因此，藉由此感測功能(例如因為 會產生位移，並因此不會遮斷其内部光線感 種1曰π二7别置放於機台2之作業板2 1上係為第二 ^^曰因盒9〇2。又，因第二種類晶圓盒902底面9 2特疋位置9 6具有凹槽9 61之結構，故第二種類晶 圓盒902之底面9 5於no掸q ,老〆土 8之光❹W η、61處綠為遠離感測件 即凹槽96 1具有凹陷之深度），亦即 雜具…〖二長’而藉由光線行進距 離長短之感測，亦可得知目前置放於機台2之作業板2工 上係為弟二種類晶圓盒9〇2。同樣的，前述同時利用光 13 M341303 ::與按鍵式光學感測器8 2進行感測’可達到雙 〇uble check)之效果。 μ 當第二種類晶圓盒9 ◦2置放於機台2之作業 ±後，其填充氣嘴9 7會對應連接於第二噴嘴4， ^故：為第二喷嘴4會相較於第一喷嘴3高出-段距 ^ 料3並不會與第二種類晶圓盒9Q2 何干涉0 因此當第二種類晶圓盒9 0 2置放於機台2之作業 ^ t後’控制$ 7可控制氣體填充11 6以氣體6 2經 ^弟j嘴4 (由第二嘴嘴内管43之第二噴嘴進氣孔4 f由第二喷嘴内管43之第二喷嘴出氣孔41出 乳及填充氣嘴9 7而對第二種類晶圓盒9 〇 2進行氣體 真充作業另於進行氣體填充作業時，藉由每—第二喷嘴 4之第二喷嘴岐孔4 1處所設之橡膠環4 i 1，可緊穷 嵌合於第二種類晶圓盒9 〇 2之填充氣嘴9 7，並藉以： 止氣體產生洩漏之問題。 清紅合參閱第一圖至第十二圖，综合上述，於同一機 台2即可進行不同種類之第—種類晶圓盒9 〇 α第二種 類晶圓盒9 Q 2之氣體填充作業，亦即可利用第二喷嘴4 所具有之彈性滑移設計，使第―噴嘴3與第二噴嘴4分別 搭配連接於第-種類晶圓盒9 Q i之填充氣嘴9 2與第二 種類晶圓盒9 Q 2之填充氣嘴9 7。因此，藉由前述機台 2所設置之第-噴嘴3與第二喷嘴4之結構設計改變，使 同-機台2即可適用於不同種類之晶圓盒9(第一種類晶 圓盒9〇1、第二種類晶圓盒9〇2)以進行氣體之殖充 作業，並因此達到提高共用性以節省成本之目的。M341303 VIII. New Description: [New Technology Field] This paper is about a wafer cassette gas filling device, especially a wafer cassette gas filling device that can improve the sharing cost. [Prior Art] * In the general semiconductor process, the wafer is placed in the wafer cassette because of the process requirements, and the wafer is filled with gas, such as nitrogen, by Φ to prevent the inside of the wafer cassette. The wafer is corroded or contaminated. Traditionally, wafer cassettes have been designed with filling nozzles, while nitrogen is filled into the wafer cassette via filling nozzles. However, there are at least two types of conventional wafer cassettes, and the number of filling nozzles is different. For example, one type of wafer cassette has two filling nozzles and the other has four types. In other words, the position of the filling nozzle of the wafer cassette is also different. Therefore, when filling a wafer box gas, it is necessary to use two or more types of machines to match different types of wafer cassettes. Therefore, as described above, it is necessary to use the type of the wafer cassette, and it is necessary to use a different type of machine to perform gas filling operation on the wafer cassette, so that the purpose of sharing cannot be achieved, and the cost is increased. It is not very, ideal. Therefore, how to create a wafer cassette gas filling device to increase the commonality of the wafer box gas filling device to save costs will be actively exposed by the present invention. M341303 [New Content] In view of the shortcomings of the above-mentioned conventional wafer cassette gas filling device, the creator feels that he has not perfected it, exhausted his mental research and overcome it, and developed a kind of experience based on his accumulated experience in the industry for many years. The wafer cassette gas filling device is intended to achieve the purpose of improving the commonality of the wafer cassette gas filling device to save costs. The main purpose of the present invention is to provide a wafer cassette gas filling device which is designed to be adapted to the gas filling operation of different types of wafer cassettes by the structural design change of the nozzles provided on the machine table, and thus achieves Improve sharing to save costs. To achieve the above object, the present invention relates to a wafer cassette gas filling device for use with a wafer cassette. The wafer cassette includes a bottom surface, and the bottom surface includes a specific position, at least two filling nozzles, and at least three positioning holes. In addition, the present invention relates to a wafer cassette gas filling device comprising a machine table, a sensing member, at least two first nozzles, at least two second nozzles, at least three positioning modules, a gas filling device and a controller. The machine platform comprises a working board, which is disposed adjacent to the bottom surface of the wafer cassette, and the sensing component, the first nozzle, the second nozzle and the positioning module are all set on the machine platform. Work board. Wherein, the sensing component corresponds to a specific position of the wafer cassette; each second nozzle comprises a second nozzle inner tube, a second nozzle outer ring and a second nozzle elastic member, wherein the second nozzle elastic member The second nozzle inner tube is placed on the outer ring of the second nozzle and abuts against the second nozzle elastic member, and the elastic force of the second nozzle elastic member is opposite to the second nozzle outer ring. Sliding; each positioning module M341303 comprises a positioning pin respectively corresponding to each positioning hole of the wafer cassette. In addition, the gas filling device is assembled on the above machine and houses a gas body, and the gas filling device is connected to the first nozzle and the second nozzle, and the gas filling device comprises a control unit. In addition, the controller is assembled on the above-mentioned machine and electrically connected to the control unit and the sensing member of the gas filling device. The first nozzle or the second nozzle is respectively corresponding to the filling nozzle connected to the wafer cassette. Therefore, in use, the sensing member corresponds to a specific position of the wafer cassette and is used to sense the type of the wafer cassette, and the controller controls the gas filling device to fill the gas through the filling nozzle and the filling The first nozzle or the second nozzle of the gas nozzle performs gas filling operation on the wafer cassette, and at the same time, the depth of the filling nozzle of different kinds of wafer cassettes is different, so the second nozzle is designed to have a structure of elastic sliding In order to match the filling nozzle of the wafer cassette with which it is matched. _ In this way, the design of the nozzle can be changed by the structure of the nozzle set by the machine, so that the same machine can be applied to different types of wafer cassettes for gas filling, and thus the sharing is improved to save costs. The purpose. [Embodiment] In order to fully understand the purpose, features and effects of this creation, the following specific examples and the accompanying drawings are used to explain the creation in detail, as follows: Please refer to the first figure. This is a three-dimensional circular box 9 of a wafer M341303 box which is a preferred embodiment. The drawings show the crystals used in the general semiconductor process. Please refer to the first, second and third figures. The second figure is the preferred one. The bottom view is the bottom view of the second type of wafer cassette of the preferred embodiment of the present invention. Traditionally, the wafer cassette 9 of the first figure can be divided into the second figure; The type of wafer cassette 901 and the second type of wafer cassette shown in the third figure are 90°. The first type of wafer cassette 9 第二 shown in the second figure includes a bottom=90' and the bottom surface 9 The crucible includes a specific position 9 i, four filling gases of 9 2 and two positioning holes 9 3 . The specific position 9 1 described above is first, and the wafer cassette 9 〇 1 is a imaginary area ′ which is § § 2 with respect to the second type of Japanese yen, as detailed below. Moreover, the four filling nozzles 9 2 can be divided into air intake and exhaust, and can be divided into two groups in actual use. In addition, the second type of wafer cassette 9 〇 2 shown in the third figure. The bottom surface 9 5 is also included, and the bottom surface 9 5 also includes a specific position 96, two fillings, a gas nozzle 9 7 and three positioning holes 98. The foregoing position I 6 is recessed with a groove g 6 1 in the second type of wafer cassette 902. Therefore, the difference is in the presence or absence of the groove 9 6 1 with respect to the first type of wafer cassette 9 〇1. The structure. X ' A filling nozzle 9 7 can be divided into an air intake and an exhaust, and in this embodiment, the depth is compared with the four filling nozzles 9 of the first type of wafer cassette 901. The depth is deep. 4 is a schematic view showing the assembly of the machine M341303 according to a preferred embodiment of the present invention, wherein a machine table 2, a sensing member 8, four first nozzles 3, and two second nozzles 4 are shown. Three positioning modules 5, a gas filling device 6, and a controller 7. The machine 2 includes a working board 2 1 , and the sensing unit 8 , the four first nozzles 3 , the two second nozzles 4 , and the three positioning modules 5 are all assembled on the working board 2 1 . The filler 6 and the controller 7 are both set to the machine 2. In the embodiment, the sensing component 8 includes a light sensor 81 and a button type optical sensor 82, and each positioning module 5 of the three positioning modules 5 respectively includes a positioning. The pin 51 and a push-button optical sensor 52 are both located adjacent to each other. It is to be noted that the so-called push-button optical sensor uses its convex point to be pressed by an external force to cause up and down displacement, and the above displacement shifts off the light sensing inside thereof, thereby causing the circuit to open and close (〇N/ 〇 FF) effect, and to achieve the purpose of sensing. The structural principle of the aforementioned touch-type optical sensor is familiar to those skilled in the art and will not be described in detail herein. • Please also refer to the fourth and fifth figures, the fifth of which is a perspective view of the machine of the preferred embodiment. The above components are assembled by screws and assembled. The machine 2 is as shown in the fifth figure. Please refer to the fourth, sixth, seventh and eighth figures, wherein the sixth figure is an exploded view of the first nozzle of the preferred embodiment of the present invention, and the seventh figure is preferably the creation of the first nozzle. A perspective view of a first nozzle of a specific embodiment, and an eighth section is a cross-sectional view of the first nozzle of the preferred embodiment of the present invention. FIG. 9 is a diagram showing the arrangement of the first working panel 2 of the machine 2 in the drawing. The first nozzle 3 has a first nozzle air outlet 31 and a first nozzle air inlet 3 2 ', and a first rubber nozzle 311 is provided for each of the first nozzles 3 . Referring to the fourth, ninth, tenth, and tenth drawings, wherein the ninth drawing is an exploded view of the second nozzle of the preferred embodiment of the present invention, the f ten figure is a preferred embodiment of the present invention. A perspective view of a second nozzle of the embodiment is a cross-sectional view of a second nozzle of the preferred embodiment of the present invention, and is shown in the drawings: each of the working units of the machine 2 is: 4 includes a second nozzle inner tube 43, a second nozzle outer ring 44, and a second nozzle elastic member 45. In this embodiment, the second nozzle dance W5 is a spring, and The second nozzle is disposed on the second nozzle outer ring 4 f ′ and the second nozzle is disposed on the second nozzle outer ring 44 and abuts against the second nozzle elastic member 45 , and the second nozzle elastic member The elastic force of 4 5 is slipped relative to the second nozzle outer ring 44, and at the same time, the second nozzle inner tube 4 3 is fired - the second nozzle money hole 41 and the second nozzle air inlet hole 4 are two Sr nozzles 4ί second The mouth nozzle vent 41 is respectively provided with a 44 1 1 'and a mother-second nozzle 4, and the second nozzle inner tube 4 3 is screwed with a nut 46 respectively. , nr diagram and fifth diagram 'after the first mouth 3 and the second lean ==, because the filling nozzle 9 of the second type of wafer cassette 9 〇 2 sees the third circle), the depth is compared with the first - The type of wafer cassette 9 〇 = please refer to the second figure) The depth is deep, so the group of the poor bird 4 _ is higher than the first nozzle 3 by a distance. M341303 In addition, the gas filling device 6 disposed on the machine table 2 houses a gas 6 2 ' in the present embodiment 'this gas 62 system-nitrogen gas, and the gas is filled and cried and connected to the four first nozzles 3 and 2 The second nozzle 4 L gas filling device 6 includes a control unit 6 丄, and the control unit 6 丄 includes a gas pressure sensor 61 1 . In addition, the controller 7 disposed on the machine 2 is electrically connected to the control unit 61 of the gas filler 6, the light sensor 8' of the sensing member 8, the key optical sensor 82, and each positioning mode. Group 5 by the tester 5 2. , 兀子 a Please refer to the second, fourth, fifth, seventh and eighth diagrams ((4) of the first type of wafer cassette 9 〇i for gas filling operation, you can first the first type of crystal The working box 21 is placed on the working plate of the machine 2, that is, the working plate 21 is mounted on the first type of wafer cassette 9 〇i and correspondingly connected to the bottom surface 90 thereof. At this time, the sensing member 8 Corresponding to the specific position 91 of the bottom surface 90 of the first type of wafer cassette 9〇1, and correspondingly inserted into the mother-type wafer cassette 9〇, M=90, the positioning hole 93' and the H position. The button type optical sensor 52 of the module 5 corresponds to the bottom surface 90 of the first type of wafer cassette 9〇. Shangdeyu = wafer cassette 9" is placed on the working plate 2 of the machine table 2 1 round q position 9 1 sub-no groove structure, so the first type crystal: the bottom surface of the surplus 1 9 will correspond to the force And the button 82 of the M sensing member 8 is pressed, so that the sensing function (for example, the displacement due to the lower i) and thus the internal light sensing is interrupted, the M341303 f can be placed. The work plate is a first type of wafer cassette 90 1 and a specific position 9 of the bottom surface 9 of the type of wafer cassette 901, and the structure of the concave type is the first type of wafer cassette 9〇 The underside light sensor 81, that is, the light sensor η, column, and the distance of the light, and the feeling of the distance traveled by the light can also convey the working plate currently placed on the machine 2 = round box 9 〇1. The above-mentioned simultaneous use of the light sensor 81=: Sensing® 8 2 for sensing can achieve the effect of double inspection (d 〇U bie C he C k). Uncle 9 When the first type of wafer cassette 90 1 is placed After being placed on the operation of the machine 2, the filling nozzle 9 2 is correspondingly connected to the first nozzle 3 ', and the bottom surface θ 〇 of the sun circle 9 〇 1 will be pressed against the second spray drying), so the two nozzles 4 has The design of the elasticity (such as the distance between the tenth and the fourth section of the figure): the second box = the width of the 9th 〇 will press the second nozzle to spray the action diagram ^ is the second board of the preferred embodiment of the creation 2 当 2: When the first The operation of placing a type of wafer cassette 9〇1 on the machine table 2 is carried out by the ST7 controllable gas filling device 6 by the first nozzle ο and the filling nozzle 92. For each of the first type of wafer cassettes 9, when the gas filling operation is performed, the rubbery knee ring 3 provided at the end of the second hole 31 can be densely planted into the σ Round box 9 〇1 filling nozzle 9 12 M341303 2 'Asia to prevent the problem of gas leakage. = Third day, fourth, fifth, ninth, tenth, tenth In a figure and a twelfth figure, when the second type of wafer cassette 9 is to be filled, the same type of wafer cassette f can be placed on the work board 2 of the machine 2, that is, The work board 2 work system. The second type of wafer cassette 902 is placed adjacent to the bottom surface 905 of the second type, and the % two sensing elements 8 correspond to the bottom surface 9.5 of the second type of wafer cassette 902. specific Position ^6, and each positioning module 5 positioning lock 5 1 is correspondingly inserted into the ^ type of wafer cassette (four) 2 bottom © 9 5 mu 9. = button-type optical sensing of the same clamping module 5 The device 5 2 corresponds to the bottom surface 9 5 of the second type of wafer cassette 9 Q 2 . After the second type of wafer cassette 9 0 2 is placed on the pen table 2 of the machine 2, due to its specific position 96 has the structure of the groove 961: Therefore, the bottom surface 9 5 of the type of wafer cassette 902 does not apply pressure to the sensing member 8: !=sensor 82 ' Therefore, by means of the sensing function (for example Because the displacement will occur, and therefore the internal light sensation will not be interrupted. 1 曰 π 2 7 is placed on the work board 2 of the machine 2 2 is the second ^ ^ 曰 box 9 〇 2. Moreover, since the bottom surface 92 of the second type of wafer cassette 902 has the structure of the recess 9 61, the bottom surface of the second type of wafer cassette 902 is in the no掸q, the light of the old clay 8 η, 61 at the green is far away from the sensing member, that is, the groove 96 1 has a depth of the recess), that is, the miscellaneous ... 〖 two long' and the sensing of the length of the light travel, it is also known that the current placement in the machine The work board 2 of the stage 2 is a second type of wafer cassette 9〇2. Similarly, the above-mentioned simultaneous use of light 13 M341303 :: sensing with the touch-type optical sensor 8 2 can achieve the effect of double 〇uble check). μ When the second type of wafer cassette 9 ◦ 2 is placed in the operation of the machine 2, the filling nozzle 9 7 is correspondingly connected to the second nozzle 4, so: the second nozzle 4 is compared with the first A nozzle 3 is higher than the segment 3 and does not interfere with the second type of cassette 9Q2. Therefore, when the second type of cassette 9 0 2 is placed on the machine 2, the operation is controlled. 7 controllable gas filling 11 6 with gas 6 2 passing through the mouth 4 (from the second nozzle inlet 4 f of the second nozzle inner tube 43 by the second nozzle outlet 41 of the second nozzle inner tube 43 The milk and the filling nozzle 9 7 and the gas charging operation of the second type of wafer cassette 9 〇 2 are performed by the second nozzle boring 4 1 of each of the second nozzles 4 when the gas filling operation is performed. The rubber ring 4 i 1 can be tightly fitted to the filling nozzle 9 7 of the second type of wafer cassette 9 〇 2, and the problem of leakage of the gas is stopped. See the first to twelfth figures In combination with the above, the gas filling operation of the second type of wafer cassette 9 Q 2 of different types of the first type of wafer cassette 9 〇α can be performed on the same machine 2, that is, the second nozzle 4 can be used. The elastic slip design is such that the first nozzle 3 and the second nozzle 4 are respectively coupled to the filling nozzle 9 2 of the first type wafer cassette 9 Q i and the filling nozzle 9 7 of the second type wafer cassette 9 Q 2 . Therefore, the structural design of the first nozzle 3 and the second nozzle 4 provided by the machine 2 can be changed, so that the same machine 2 can be applied to different types of wafer cassettes 9 (the first type of wafer cassette) 9〇1, the second type of wafer cassette 9〇2) for the gas charging operation, and thus achieve the purpose of improving the sharing to save costs.
、此=，因氣體填充器6之控鮮元6 1包含—氣縣 力感測器6 1 1，故於進行氣體填充作業時，可 壓力是否正常，若感測錢顏力低於或超出—預設範圍 時，於安全上之考量，可立即切斷氣體之填充。 M341303 另欲補充說明的是，上述結構係具有三較位模組 5，且每-定位模組5具有·—按鍵式光學感測器5 2，當 晶圓盒9 (第-種類晶圓盒9 〇 1、第二種類晶圓盒心 2)置放於機台2之作業板2 1上朗應軌於按鍵式光 學感測器5 2時，可利用其感測功能（原理如上所述），可 感測晶圓盒9(第一種類晶圓盒9〇1、第二種類晶圓盒 902)是否放置良好（三點形成一平面之原理）。· 如上所述，本創作完全符合專利三要件：新顆性、進 步性和產業上的可利祕。以難性和進步性而言，可藉 由機口所汉置之喷嘴之結構設計改變，使同_機台即可適 用於不同種類之晶圓盒以進行氣體之填充作業，並因此達 到提高共祕以料成本之目的；就產業上的可利用性而 言’利用賴賴魅的產品，#可充分滿足目前市場的 需求。 本創作在上文巾已以較佳實施例㈣，然熟習本項技 術者應理解的是，該實_伽於輯本創作，而不應解 讀為限制本創作之！請。應注意的是，舉凡與該實施例等 效之交化與置換，均應設為涵蓋於本創作之範•内。因此， 15 M341303 本創作之保護範圍當 準。 以下文之申請專利範圍所界定者為 圖式簡單說明】 · 仰視圖 第三圖為本創作較佳具體實施例之第 仰視圖。 f一圖為本創作較佳具體實施例之晶圓盒之立體圖。 弟-圖為本創作較佳具體實施例之第一種類晶圓盒之 二種類晶圓盒之 第四圖為本創作較佳具體實施例之機台之組震示章 圖。 ^ 第五圖為本創作較佳具體實施例之機台之立體圖。 第六圖為本創作較佳具體實施例之第一噴嘴之分解 圖。 第七圖為本創作較佳具體實施例之第一噴嘴之立體 圖。 、且 第八圖為本創作較佳具體實施例之第一噴嘴之剖視 圖。This =, because the control unit 6 1 of the gas filling device 6 contains the gas sensor 6.11, so when the gas filling operation is performed, the pressure can be normal, if the sensory weight is lower or exceeded - When the range is preset, the filling of the gas can be cut off immediately in consideration of safety. M341303 It is to be additionally noted that the above structure has three positioning modules 5, and each positioning module 5 has a button type optical sensor 52, when the wafer cassette 9 (the type-type wafer cassette) 9 〇1, the second type of wafer cassette core 2) When the working board 2 1 placed on the machine 2 is placed on the push-button optical sensor 52, the sensing function can be utilized (the principle is as described above) It is possible to sense whether the wafer cassette 9 (the first type of wafer cassette 9〇1, the second type of wafer cassette 902) is placed well (the principle of three points forming a plane). · As mentioned above, this creation is fully in line with the three requirements of the patent: newness, advancement and industrial privilege. In terms of difficulty and progress, the structural design of the nozzles that are placed in the machine can be changed, so that the same machine can be applied to different types of wafer cassettes for gas filling operations, and thus improved. The purpose of the common cost is to use the cost; in terms of industrial availability, 'using the product of Lai Lai, # can fully meet the needs of the current market. The present invention has been described in the preferred embodiment (4). However, those skilled in the art should understand that the actual gamma is not limited to the creation of the original creation! please. It should be noted that the interaction and replacement that are equivalent to the embodiment should be included in the scope of this creation. Therefore, 15 M341303 is protected by this creation. The following is a brief description of the drawings, and the following is a simplified view of the preferred embodiment of the present invention. Figure 1 is a perspective view of a wafer cassette in accordance with a preferred embodiment of the invention. The fourth figure of the second type of wafer cassette of the first type of wafer cassette of the preferred embodiment of the present invention is a group diagram of the machine table of the preferred embodiment. The fifth figure is a perspective view of the machine of the preferred embodiment of the present invention. Figure 6 is an exploded view of the first nozzle of the preferred embodiment of the present invention. Figure 7 is a perspective view of the first nozzle of the preferred embodiment of the present invention. And Figure 8 is a cross-sectional view of the first nozzle of the preferred embodiment of the present invention.
第九圖為本創作較佳具體實施例之第二喷嘴之分解 第十圖為本創作較佳具體實施例之第二噴嘴之立體 第十一圖為本創作較佳具體實施例之第二噴嘴之剖視 16 M341303 第十二圖為本創作較佳具體實施例之第二喷嘴之作動 示意圖。9 is an exploded view of a second nozzle of a preferred embodiment of the present invention. FIG. 11 is a perspective view of a second nozzle of the preferred embodiment of the present invention. FIG. 11 is a second nozzle of the preferred embodiment of the present invention. Fig. 16 is a schematic view showing the operation of the second nozzle of the preferred embodiment of the present invention.
【主要元件符號說明】 2 機台 2 1 作業板 3 第一喷嘴 3 1 第一喷嘴出氣孔 3 11 橡膠環 3 2 第一喷嘴進氣孔 4 第二喷嘴 4 1 第二喷嘴出氣孔 4 11 橡膠環 4 2 第二喷嘴進氣孔 4 3 第二喷嘴内管 4 4 第二喷嘴外環 4 5 第二喷嘴彈性件 4 6 螺帽 5 定位模組 5 1 定位銷 5 2 按鍵式光學感測器 6 氣體填充器 6 1 控制單元 6 11 氣體壓力感測器 17 M341303 6 2 氣體 7 控制器 8 感測件 8 1 光感應li 8 2 按鍵式光學感測器 9 晶圓盒 9 0 底面 901 第一種類晶圓盒[Main component symbol description] 2 Machine 2 1 Working plate 3 First nozzle 3 1 First nozzle air outlet 3 11 Rubber ring 3 2 First nozzle air inlet 4 Second nozzle 4 1 Second nozzle air outlet 4 11 Rubber Ring 4 2 second nozzle intake hole 4 3 second nozzle inner tube 4 4 second nozzle outer ring 4 5 second nozzle elastic member 4 6 nut 5 positioning module 5 1 positioning pin 5 2 push-button optical sensor 6 Gas Filler 6 1 Control Unit 6 11 Gas Pressure Sensor 17 M341303 6 2 Gas 7 Controller 8 Sensing Element 8 1 Light Sensing Li 8 2 Push Button Optical Sensor 9 Wafer Box 9 0 Back Surface 901 First Type wafer cassette
902 第二種類晶圓盒 91 特定位置 92 填充氣嘴 9 3 定位孔 9 5 底面 96 特定位置902 Type 2 wafer cassette 91 Specific position 92 Filling nozzle 9 3 Positioning hole 9 5 Bottom surface 96 Specific position
9 6 1 凹槽 9 7 填充氣嘴 9 8 定位孔 189 6 1 Groove 9 7 Filling nozzle 9 8 Positioning hole 18