ATE514516T1 - Verfahren zum diffusionverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper ; diffusionsverbundene mikrokanalplattenkörper-anordnung - Google Patents

Verfahren zum diffusionverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper ; diffusionsverbundene mikrokanalplattenkörper-anordnung

Info

Publication number
ATE514516T1
ATE514516T1 AT04759029T AT04759029T ATE514516T1 AT E514516 T1 ATE514516 T1 AT E514516T1 AT 04759029 T AT04759029 T AT 04759029T AT 04759029 T AT04759029 T AT 04759029T AT E514516 T1 ATE514516 T1 AT E514516T1
Authority
AT
Austria
Prior art keywords
diffusion
microchannel plate
layer ceramic
ceramic body
mcp
Prior art date
Application number
AT04759029T
Other languages
English (en)
Inventor
Niels Jacksen
Michael Iosue
Miguel Saldana
Jay Tucker
Original Assignee
L 3 Comm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by L 3 Comm Corp filed Critical L 3 Comm Corp
Application granted granted Critical
Publication of ATE514516T1 publication Critical patent/ATE514516T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/50—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output
    • H01J31/506—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output tubes using secondary emission effect
    • H01J31/507—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output tubes using secondary emission effect using a large number of channels, e.g. microchannel plates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
    • H01J43/04—Electron multipliers
    • H01J43/06—Electrode arrangements
    • H01J43/18—Electrode arrangements using essentially more than one dynode
    • H01J43/24—Dynodes having potential gradient along their surfaces
    • H01J43/246—Microchannel plates [MCP]
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2231/00—Cathode ray tubes or electron beam tubes
    • H01J2231/50—Imaging and conversion tubes
    • H01J2231/501—Imaging and conversion tubes including multiplication stage
    • H01J2231/5013—Imaging and conversion tubes including multiplication stage with secondary emission electrodes
    • H01J2231/5016—Michrochannel plates [MCP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
  • Electron Tubes For Measurement (AREA)
AT04759029T 2003-03-31 2004-03-30 Verfahren zum diffusionverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper ; diffusionsverbundene mikrokanalplattenkörper-anordnung ATE514516T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32006903P 2003-03-31 2003-03-31
PCT/US2004/009632 WO2004092785A2 (en) 2003-03-31 2004-03-30 Bonding method for microchannel plates

Publications (1)

Publication Number Publication Date
ATE514516T1 true ATE514516T1 (de) 2011-07-15

Family

ID=33298189

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04759029T ATE514516T1 (de) 2003-03-31 2004-03-30 Verfahren zum diffusionverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper ; diffusionsverbundene mikrokanalplattenkörper-anordnung

Country Status (6)

Country Link
US (2) US6874674B2 (de)
EP (1) EP1613448B1 (de)
JP (1) JP2006522453A (de)
AT (1) ATE514516T1 (de)
RU (1) RU2350446C2 (de)
WO (1) WO2004092785A2 (de)

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WO2004092785A2 (en) * 2003-03-31 2004-10-28 Litton Systems, Inc. Bonding method for microchannel plates
US7153219B2 (en) * 2004-06-14 2006-12-26 Adams Golf Ip, L.P. Golf club head
BRPI0713572A2 (pt) * 2006-06-20 2012-10-23 Stephen Duguay meios livres de soro e seus usos para expansão de condrócitos
US7793819B2 (en) * 2007-03-19 2010-09-14 Infineon Technologies Ag Apparatus and method for connecting a component with a substrate
US8505805B2 (en) * 2008-10-09 2013-08-13 Honeywell International Inc. Systems and methods for platinum ball bonding
JP5458804B2 (ja) * 2009-10-26 2014-04-02 トヨタ紡織株式会社 プレス方法及びプレス装置
JP6875217B2 (ja) * 2017-06-30 2021-05-19 浜松ホトニクス株式会社 電子増倍体
JP6395906B1 (ja) * 2017-06-30 2018-09-26 浜松ホトニクス株式会社 電子増倍体
KR101938804B1 (ko) * 2017-09-05 2019-01-16 한국 천문 연구원 영상 증폭기의 조립 방법
CN111299799B (zh) * 2020-03-17 2022-04-08 信泰电子（西安）有限公司 一种热压焊接系统及焊接方法
CN117491829B (zh) * 2023-11-10 2024-10-22 北方夜视科技(南京)研究院有限公司 微通道板输出电子弥散斑测试方法和测试系统

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ATE514517T1 (de) * 2003-03-30 2011-07-15 L 3 Comm Corp Verfahren zum diffusionsverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper; diffusionsverbundene mikrokanalplattenkörperanordnung
WO2004092785A2 (en) * 2003-03-31 2004-10-28 Litton Systems, Inc. Bonding method for microchannel plates

Also Published As

Publication number Publication date
US20040188500A1 (en) 2004-09-30
US6874674B2 (en) 2005-04-05
EP1613448A2 (de) 2006-01-11
RU2350446C2 (ru) 2009-03-27
WO2004092785A3 (en) 2004-12-09
RU2005129600A (ru) 2006-04-27
US7021522B2 (en) 2006-04-04
EP1613448B1 (de) 2011-06-29
WO2004092785A2 (en) 2004-10-28
US20050098614A1 (en) 2005-05-12
EP1613448A4 (de) 2008-09-10
JP2006522453A (ja) 2006-09-28

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