ATE514516T1 - Verfahren zum diffusionverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper ; diffusionsverbundene mikrokanalplattenkörper-anordnung - Google Patents
Verfahren zum diffusionverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper ; diffusionsverbundene mikrokanalplattenkörper-anordnungInfo
- Publication number
- ATE514516T1 ATE514516T1 AT04759029T AT04759029T ATE514516T1 AT E514516 T1 ATE514516 T1 AT E514516T1 AT 04759029 T AT04759029 T AT 04759029T AT 04759029 T AT04759029 T AT 04759029T AT E514516 T1 ATE514516 T1 AT E514516T1
- Authority
- AT
- Austria
- Prior art keywords
- diffusion
- microchannel plate
- layer ceramic
- ceramic body
- mcp
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/023—Thermo-compression bonding
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J31/00—Cathode ray tubes; Electron beam tubes
- H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
- H01J31/50—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output
- H01J31/506—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output tubes using secondary emission effect
- H01J31/507—Image-conversion or image-amplification tubes, i.e. having optical, X-ray, or analogous input, and optical output tubes using secondary emission effect using a large number of channels, e.g. microchannel plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J43/00—Secondary-emission tubes; Electron-multiplier tubes
- H01J43/04—Electron multipliers
- H01J43/06—Electrode arrangements
- H01J43/18—Electrode arrangements using essentially more than one dynode
- H01J43/24—Dynodes having potential gradient along their surfaces
- H01J43/246—Microchannel plates [MCP]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/124—Metallic interlayers based on copper
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
- C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2231/00—Cathode ray tubes or electron beam tubes
- H01J2231/50—Imaging and conversion tubes
- H01J2231/501—Imaging and conversion tubes including multiplication stage
- H01J2231/5013—Imaging and conversion tubes including multiplication stage with secondary emission electrodes
- H01J2231/5016—Michrochannel plates [MCP]
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32006903P | 2003-03-31 | 2003-03-31 | |
PCT/US2004/009632 WO2004092785A2 (en) | 2003-03-31 | 2004-03-30 | Bonding method for microchannel plates |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE514516T1 true ATE514516T1 (de) | 2011-07-15 |
Family
ID=33298189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04759029T ATE514516T1 (de) | 2003-03-31 | 2004-03-30 | Verfahren zum diffusionverbinden einer mikrokanalplatte mit einem mehrschichtkeramikkörper ; diffusionsverbundene mikrokanalplattenkörper-anordnung |
Country Status (6)
Country | Link |
---|---|
US (2) | US6874674B2 (de) |
EP (1) | EP1613448B1 (de) |
JP (1) | JP2006522453A (de) |
AT (1) | ATE514516T1 (de) |
RU (1) | RU2350446C2 (de) |
WO (1) | WO2004092785A2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006522453A (ja) * | 2003-03-31 | 2006-09-28 | リットン・システムズ・インコーポレイテッド | マイクロチャネルプレートの接合方法 |
US7153219B2 (en) * | 2004-06-14 | 2006-12-26 | Adams Golf Ip, L.P. | Golf club head |
MX2008016429A (es) * | 2006-06-20 | 2009-03-20 | Genzyme Corp | Medios de suero y sus usos para expansion de condrocitos. |
US7793819B2 (en) * | 2007-03-19 | 2010-09-14 | Infineon Technologies Ag | Apparatus and method for connecting a component with a substrate |
US8505805B2 (en) * | 2008-10-09 | 2013-08-13 | Honeywell International Inc. | Systems and methods for platinum ball bonding |
JP5458804B2 (ja) * | 2009-10-26 | 2014-04-02 | トヨタ紡織株式会社 | プレス方法及びプレス装置 |
JP6875217B2 (ja) * | 2017-06-30 | 2021-05-19 | 浜松ホトニクス株式会社 | 電子増倍体 |
JP6395906B1 (ja) * | 2017-06-30 | 2018-09-26 | 浜松ホトニクス株式会社 | 電子増倍体 |
KR101938804B1 (ko) * | 2017-09-05 | 2019-01-16 | 한국 천문 연구원 | 영상 증폭기의 조립 방법 |
CN111299799B (zh) * | 2020-03-17 | 2022-04-08 | 信泰电子(西安)有限公司 | 一种热压焊接系统及焊接方法 |
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US2910338A (en) * | 1954-06-09 | 1959-10-27 | Gen Electric | Method of fabricating electron discharge devices |
GB1353671A (en) * | 1971-06-10 | 1974-05-22 | Int Computers Ltd | Methods of forming circuit interconnections |
US3783299A (en) * | 1972-05-17 | 1974-01-01 | Gen Electric | X-ray image intensifier input phosphor screen and method of manufacture thereof |
US3852133A (en) * | 1972-05-17 | 1974-12-03 | Gen Electric | Method of manufacturing x-ray image intensifier input phosphor screen |
US3853531A (en) * | 1972-06-21 | 1974-12-10 | Monsanto Co | Plant regulation with 2-halo-2{40 ,6{40 -dialkyl-n-acyl-oxymethyl-acetanilides |
US4626694A (en) * | 1983-12-23 | 1986-12-02 | Tokyo Shibaura Denki Kabushiki Kaisha | Image intensifier |
FR2564826B1 (fr) * | 1984-05-25 | 1986-08-22 | Thomson Csf | Procede d'assemblage d'au moins deux pieces en ceramique, presentant chacune au moins une surface plane |
JPS61281078A (ja) * | 1985-06-01 | 1986-12-11 | 枝村 瑞郎 | セラミツクスと金属、同種セラミツクス同志または異種セラミツクス間の接合方法 |
US4729504A (en) * | 1985-06-01 | 1988-03-08 | Mizuo Edamura | Method of bonding ceramics and metal, or bonding similar ceramics among themselves; or bonding dissimilar ceramics |
JPS6270271A (ja) * | 1985-09-19 | 1987-03-31 | 財団法人 ライフテクノロジ−研究所 | セラミツクスの接合方法 |
JPS62124083A (ja) * | 1985-11-20 | 1987-06-05 | Hitachi Ltd | 拡散接合法 |
JPS63155534A (ja) * | 1986-12-18 | 1988-06-28 | Toshiba Corp | X線螢光増倍管 |
GB2202367A (en) * | 1987-03-18 | 1988-09-21 | Philips Electronic Associated | Channel plate electron multipliers |
JPH03103385A (ja) * | 1989-09-18 | 1991-04-30 | Nippon Steel Corp | セラミックスのメタライズ方法、ならびにセラミックスと金属の接合方法 |
US5083697A (en) * | 1990-02-14 | 1992-01-28 | Difrancesco Louis | Particle-enhanced joining of metal surfaces |
FR2676862B1 (fr) * | 1991-05-21 | 1997-01-03 | Commissariat Energie Atomique | Structure multiplicatrice d'electrons en ceramique notamment pour photomultiplicateur et son procede de fabrication. |
US5236118A (en) * | 1992-05-12 | 1993-08-17 | The Regents Of The University Of California | Aligned wafer bonding |
DE4233073A1 (de) * | 1992-10-01 | 1994-04-07 | Siemens Ag | Verfahren zum Herstellen eines Halbleiter-Modulaufbaus |
DE69313399T2 (de) * | 1992-11-02 | 1998-02-26 | Philips Electronics Nv | Vacuumröhre mit keramischem Teil |
US5581151A (en) * | 1993-07-30 | 1996-12-03 | Litton Systems, Inc. | Photomultiplier apparatus having a multi-layer unitary ceramic housing |
US5493111A (en) * | 1993-07-30 | 1996-02-20 | Litton Systems, Inc. | Photomultiplier having cascaded microchannel plates, and method for fabrication |
US5514928A (en) * | 1994-05-27 | 1996-05-07 | Litton Systems, Inc. | Apparatus having cascaded and interbonded microchannel plates and method of making |
US6482231B1 (en) * | 1995-11-20 | 2002-11-19 | Giovanni Abatangelo | Biological material for the repair of connective tissue defects comprising mesenchymal stem cells and hyaluronic acid derivative |
US6082610A (en) * | 1997-06-23 | 2000-07-04 | Ford Motor Company | Method of forming interconnections on electronic modules |
US5994824A (en) * | 1997-07-24 | 1999-11-30 | Itt Manufacturing Enterprises | Light weight/small image intensifier tube |
US6040657A (en) * | 1997-08-15 | 2000-03-21 | Itt Manufacturing Enterprises | Thin faceplate image intensifier tube having an improved vacuum housing |
US6089444A (en) * | 1997-09-02 | 2000-07-18 | Mcdonnell Douglas Corporation | Process of bonding copper and tungsten |
US6483231B1 (en) | 1999-05-07 | 2002-11-19 | Litton Systems, Inc. | Night vision device and method |
US7518136B2 (en) * | 2001-12-17 | 2009-04-14 | Tecomet, Inc. | Devices, methods, and systems involving cast computed tomography collimators |
US7462852B2 (en) * | 2001-12-17 | 2008-12-09 | Tecomet, Inc. | Devices, methods, and systems involving cast collimators |
US6521350B2 (en) * | 2001-06-18 | 2003-02-18 | Alfred E. Mann Foundation For Scientific Research | Application and manufacturing method for a ceramic to metal seal |
JP3618090B2 (ja) * | 2001-10-23 | 2005-02-09 | 株式会社ニレコ | コリメータ及び分光測光装置 |
WO2003043045A2 (en) * | 2001-11-13 | 2003-05-22 | Nanosciences Corporation | Photocathode |
EP1617966B1 (de) * | 2003-03-30 | 2011-06-29 | L-3 Communications Corporation | Verfahren zum Diffusionsverbinden einer Mikrokanalplatte mit einem Mehrschichtkeramikkörper; Diffusionsverbundene Mikrokanalplattenkörperanordnung |
JP2006522453A (ja) * | 2003-03-31 | 2006-09-28 | リットン・システムズ・インコーポレイテッド | マイクロチャネルプレートの接合方法 |
-
2004
- 2004-03-30 JP JP2006509451A patent/JP2006522453A/ja active Pending
- 2004-03-30 WO PCT/US2004/009632 patent/WO2004092785A2/en active Application Filing
- 2004-03-30 AT AT04759029T patent/ATE514516T1/de not_active IP Right Cessation
- 2004-03-30 EP EP04759029A patent/EP1613448B1/de not_active Expired - Lifetime
- 2004-03-30 RU RU2005129600/02A patent/RU2350446C2/ru active
- 2004-03-30 US US10/708,890 patent/US6874674B2/en not_active Expired - Lifetime
-
2005
- 2005-01-24 US US10/905,847 patent/US7021522B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20040188500A1 (en) | 2004-09-30 |
EP1613448B1 (de) | 2011-06-29 |
JP2006522453A (ja) | 2006-09-28 |
RU2005129600A (ru) | 2006-04-27 |
WO2004092785A3 (en) | 2004-12-09 |
WO2004092785A2 (en) | 2004-10-28 |
RU2350446C2 (ru) | 2009-03-27 |
US7021522B2 (en) | 2006-04-04 |
US20050098614A1 (en) | 2005-05-12 |
EP1613448A4 (de) | 2008-09-10 |
EP1613448A2 (de) | 2006-01-11 |
US6874674B2 (en) | 2005-04-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |