ATE505705T1 - Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird - Google Patents

Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird

Info

Publication number
ATE505705T1
ATE505705T1 AT08775214T AT08775214T ATE505705T1 AT E505705 T1 ATE505705 T1 AT E505705T1 AT 08775214 T AT08775214 T AT 08775214T AT 08775214 T AT08775214 T AT 08775214T AT E505705 T1 ATE505705 T1 AT E505705T1
Authority
AT
Austria
Prior art keywords
wafer
machined
thickness dimensions
reflected
cushion
Prior art date
Application number
AT08775214T
Other languages
English (en)
Inventor
Aglio Carlo Dall
Original Assignee
Marposs Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marposs Spa filed Critical Marposs Spa
Application granted granted Critical
Publication of ATE505705T1 publication Critical patent/ATE505705T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Ceramic Capacitors (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
AT08775214T 2007-07-20 2008-07-18 Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird ATE505705T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT000504A ITBO20070504A1 (it) 2007-07-20 2007-07-20 Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione
PCT/EP2008/059438 WO2009013231A1 (en) 2007-07-20 2008-07-18 Apparatus and method for checking thickness dimensions of an element while it is being machined

Publications (1)

Publication Number Publication Date
ATE505705T1 true ATE505705T1 (de) 2011-04-15

Family

ID=39717703

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08775214T ATE505705T1 (de) 2007-07-20 2008-07-18 Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird

Country Status (9)

Country Link
US (1) US8546760B2 (de)
EP (2) EP2174092B1 (de)
JP (1) JP5335787B2 (de)
KR (1) KR101526311B1 (de)
CN (2) CN103029030B (de)
AT (1) ATE505705T1 (de)
DE (2) DE602008006196D1 (de)
IT (1) ITBO20070504A1 (de)
WO (1) WO2009013231A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITBO20070504A1 (it) * 2007-07-20 2009-01-21 Marposs Spa Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione
DE102009015878A1 (de) * 2009-04-01 2010-10-07 Peter Wolters Gmbh Verfahren zum materialabtragenden Bearbeiten von flachen Werkstücken
GB2478590A (en) 2010-03-12 2011-09-14 Precitec Optronik Gmbh Apparatus and method for monitoring a thickness of a silicon wafer
IT1399875B1 (it) * 2010-05-18 2013-05-09 Marposs Spa Metodo e apparecchiatura per la misura ottica mediante interferometria dello spessore di un oggetto
EP2571655B1 (de) 2010-05-18 2014-04-23 Marposs Societa' Per Azioni Verfahren und vorrichtung zur optischen messung der dicke eines objekts mittels interferometrie
IT1399876B1 (it) * 2010-05-18 2013-05-09 Marposs Spa Metodo e apparecchiatura per la misura ottica mediante interferometria dello spessore di un oggetto
JP5818904B2 (ja) * 2010-11-12 2015-11-18 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェーハスタック内の層厚さ及び欠陥を測定する測定デバイス及び方法
JP5731806B2 (ja) * 2010-12-02 2015-06-10 株式会社ディスコ 研削装置
US9157730B2 (en) 2012-10-26 2015-10-13 Applied Materials, Inc. PECVD process
JP6145342B2 (ja) * 2013-07-12 2017-06-07 株式会社荏原製作所 膜厚測定装置、膜厚測定方法、および膜厚測定装置を備えた研磨装置
ITBO20130403A1 (it) 2013-07-26 2015-01-27 Marposs Spa Metodo e apparecchiatura per il controllo ottico mediante interferometria dello spessore di un oggetto in lavorazione
JP6374169B2 (ja) * 2014-01-23 2018-08-15 株式会社荏原製作所 研磨方法および研磨装置
CN105825902B (zh) * 2015-01-08 2017-08-25 哈电集团（秦皇岛）重型装备有限公司 Ap1000 核电设备部件表面的清洁度检测方法
CN104690637A (zh) * 2015-03-18 2015-06-10 合肥京东方光电科技有限公司 一种柔性基板研磨控制方法及装置
US10234265B2 (en) 2016-12-12 2019-03-19 Precitec Optronik Gmbh Distance measuring device and method for measuring distances
DE102017126310A1 (de) 2017-11-09 2019-05-09 Precitec Optronik Gmbh Abstandsmessvorrichtung
DE102018130901A1 (de) 2018-12-04 2020-06-04 Precitec Optronik Gmbh Optische Messeinrichtung
CN109540897B (zh) * 2018-12-29 2024-04-02 镇江奥博通信设备有限公司 一种光纤适配器检测装置
CN110695849B (zh) * 2019-10-23 2020-09-15 清华大学 一种晶圆厚度测量装置和磨削机台
CN110757278B (zh) * 2019-10-23 2020-09-18 清华大学 一种晶圆厚度测量装置和磨削机台
CN117140236B (zh) * 2023-10-25 2024-01-26 苏州博宏源机械制造有限公司 一种晶圆厚度在线测量装置及方法
CN117438331B (zh) * 2023-12-20 2024-04-12 武汉芯极客软件技术有限公司 一种半导体cp测试程序的混版本兼容方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3382011B2 (ja) * 1993-04-06 2003-03-04 株式会社東芝 膜厚測定装置、ポリシング装置および半導体製造装置
JP3313505B2 (ja) 1994-04-14 2002-08-12 株式会社日立製作所 研磨加工法
US5657123A (en) * 1994-09-16 1997-08-12 Mitsubishi Materials Corp. Film thickness measuring apparatus, film thickness measuring method and wafer polishing system measuring a film thickness in conjunction with a liquid tank
JPH08216016A (ja) 1995-02-14 1996-08-27 Mitsubishi Materials Shilicon Corp 半導体ウェーハの研磨方法および研磨装置
JPH09260317A (ja) 1996-01-19 1997-10-03 Sony Corp 基板研磨装置
US5999264A (en) 1997-06-26 1999-12-07 Mitutoyo Corporation On-the-fly optical interference measurement device, machining device provided with the measurement device, and machine tool suited to on-the-fly optical measurement
SG70097A1 (en) * 1997-08-15 2000-01-25 Disio Corp Apparatus and method for machining workpieces by flushing working liquid to the tool-and-workpiece interface
US6142855A (en) * 1997-10-31 2000-11-07 Canon Kabushiki Kaisha Polishing apparatus and polishing method
US6395130B1 (en) 1998-06-08 2002-05-28 Speedfam-Ipec Corporation Hydrophobic optical endpoint light pipes for chemical mechanical polishing
US6628397B1 (en) 1999-09-15 2003-09-30 Kla-Tencor Apparatus and methods for performing self-clearing optical measurements
US6671051B1 (en) 1999-09-15 2003-12-30 Kla-Tencor Apparatus and methods for detecting killer particles during chemical mechanical polishing
US6437868B1 (en) 1999-10-28 2002-08-20 Agere Systems Guardian Corp. In-situ automated contactless thickness measurement for wafer thinning
JP3854056B2 (ja) 1999-12-13 2006-12-06 株式会社荏原製作所 基板膜厚測定方法、基板膜厚測定装置、基板処理方法及び基板処理装置
WO2001063201A2 (en) 2000-02-25 2001-08-30 Speedfam-Ipec Corporation Optical endpoint detection system for chemical mechanical polishing
US6368881B1 (en) * 2000-02-29 2002-04-09 International Business Machines Corporation Wafer thickness control during backside grind
US6602724B2 (en) * 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring
JP2002198341A (ja) 2000-12-25 2002-07-12 Toshiba Corp 化学的機械的研磨処理システム及び化学的機械的研磨方法
JP4281255B2 (ja) 2001-01-25 2009-06-17 株式会社デンソー ウエハ厚計測装置及びウエハ研磨方法
US7052369B2 (en) 2002-02-04 2006-05-30 Kla-Tencor Technologies Corp. Methods and systems for detecting a presence of blobs on a specimen during a polishing process
JP4020739B2 (ja) * 2002-09-27 2007-12-12 株式会社荏原製作所 ポリッシング装置
US7215431B2 (en) 2004-03-04 2007-05-08 Therma-Wave, Inc. Systems and methods for immersion metrology
JP4714427B2 (ja) 2004-05-14 2011-06-29 株式会社荏原製作所 基板上に形成された薄膜の研磨方法
DE102004034693B4 (de) 2004-07-17 2006-05-18 Schott Ag Verfahren und Vorrichtung zur berührungslosen optischen Messung der Dicke von heißen Glaskörpern mittels der chromatischen Aberration
US7432513B2 (en) * 2005-10-21 2008-10-07 Asml Netherlands B.V. Gas shower, lithographic apparatus and use of a gas shower
ITBO20070504A1 (it) * 2007-07-20 2009-01-21 Marposs Spa Apparecchiatura e metodo per il controllo dello spessore di un elemento in lavorazione

Also Published As

Publication number Publication date
EP2322898A2 (de) 2011-05-18
JP2010533605A (ja) 2010-10-28
KR101526311B1 (ko) 2015-06-05
EP2322898A3 (de) 2011-08-31
CN101755189B (zh) 2013-01-02
CN101755189A (zh) 2010-06-23
US20100182592A1 (en) 2010-07-22
DE202008018535U1 (de) 2015-06-15
CN103029030A (zh) 2013-04-10
DE602008006196D1 (de) 2011-05-26
ITBO20070504A1 (it) 2009-01-21
KR20100051070A (ko) 2010-05-14
EP2174092A1 (de) 2010-04-14
WO2009013231A1 (en) 2009-01-29
US8546760B2 (en) 2013-10-01
CN103029030B (zh) 2016-03-16
JP5335787B2 (ja) 2013-11-06
EP2174092B1 (de) 2011-04-13

Similar Documents

Publication Publication Date Title
ATE505705T1 (de) Vorrichtung und verfahren zum prüfen von dickeabmessungen eines elements, während es maschinenbearbeitet wird
DE602004028718D1 (de) Verfahren und vorrichtung zum steuern eines materialbearbeitungsstrahlsystems
TWI686603B (zh) 用於檢查襯底之檢查系統、襯底切割設備、檢查襯底之方法及襯底切割技術
DE60307322D1 (de) Verfahren und anordnung zum bestrahlen einer schicht mittels eines lichtpunkts
TWI713706B (zh) 切削裝置的設置方法
JPWO2020090962A5 (de)
KR101642280B1 (ko) 레이저 프로파일 스캐닝과 레이저 클래딩을 이용한 철도 레일 보수장치 및 방법
ATE516913T1 (de) Vorrichtung und verfahren zur materialverarbeitung unter verwendung eines transparenten kontaktelements
JP2008215879A (ja) 清浄度判定装置および方法
JP5213112B2 (ja) レーザ加工方法及びレーザ加工装置
DE502005004198D1 (de) Verfahren zur Sitz- oder Unwucht-Prüfung eines Werkzeugs
JP2016213418A5 (de)
CN105500137A (zh) 磨削装置
CN106256476A (zh) 激光加工装置
US11253954B2 (en) Method for measuring inclination of waterjet of laser machining device
CN108943444A (zh) 切削装置
KR101200708B1 (ko) 레이저 가공장치 및 그 제어방법
JP2018160595A (ja) ダイシング方法及びレーザー加工装置
JP6262593B2 (ja) 研削装置
ATE401171T1 (de) Handhabungsvorrichtung und verfahren zum handhaben von werkstücken
ATE462528T1 (de) Verfahren und vorrichtung zum laserstrahl- schweissen zum fügen von blechen, mit einem durch einen den laserplasma erfassenden sensor steuerbaren spalt zwischen den blechen
ATE447193T1 (de) Vorrichtung und verfahren zum erkennen von objekten
JP7289592B2 (ja) 検査用基板及び検査方法
KR101701472B1 (ko) 절삭 가공 장치
KR20190005313A (ko) 작업 품질 검사 기능을 구비한 레이저 클리닝 장치 및 그 방법

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties