ATE483203T1 - Verfahren und vorrichtung zur kopplung eines moduls an eine verwaltungssteuerung auf einem interconnect - Google Patents

Verfahren und vorrichtung zur kopplung eines moduls an eine verwaltungssteuerung auf einem interconnect

Info

Publication number
ATE483203T1
ATE483203T1 AT05854739T AT05854739T ATE483203T1 AT E483203 T1 ATE483203 T1 AT E483203T1 AT 05854739 T AT05854739 T AT 05854739T AT 05854739 T AT05854739 T AT 05854739T AT E483203 T1 ATE483203 T1 AT E483203T1
Authority
AT
Austria
Prior art keywords
interconnect
coupling
module
administration controller
card interfaces
Prior art date
Application number
AT05854739T
Other languages
English (en)
Inventor
Lawson Guthrie
Mark Summers
Steven Denies
Edoardo Campini
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE483203T1 publication Critical patent/ATE483203T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G06F13/4081—Live connection to bus, e.g. hot-plugging
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4004—Coupling between buses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1498—Resource management, Optimisation arrangements, e.g. configuration, identification, tracking, physical location
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H05K7/186—Construction of rack or frame for supporting telecommunication equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multi Processors (AREA)
  • Information Transfer Systems (AREA)
  • Programmable Controllers (AREA)
  • Communication Control (AREA)
  • Debugging And Monitoring (AREA)
  • Electrotherapy Devices (AREA)
AT05854739T 2004-12-29 2005-12-20 Verfahren und vorrichtung zur kopplung eines moduls an eine verwaltungssteuerung auf einem interconnect ATE483203T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/027,142 US7751333B2 (en) 2004-12-29 2004-12-29 Method and apparatus to couple a module to a management controller on an interconnect
PCT/US2005/046078 WO2006071625A1 (en) 2004-12-29 2005-12-20 Method and apparatus to couple a module to a management controller on an interconnect

Publications (1)

Publication Number Publication Date
ATE483203T1 true ATE483203T1 (de) 2010-10-15

Family

ID=36128360

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05854739T ATE483203T1 (de) 2004-12-29 2005-12-20 Verfahren und vorrichtung zur kopplung eines moduls an eine verwaltungssteuerung auf einem interconnect

Country Status (9)

Country Link
US (4) US7751333B2 (de)
EP (1) EP1831793B1 (de)
JP (1) JP2008525912A (de)
KR (1) KR100920499B1 (de)
CN (2) CN1831802A (de)
AT (1) ATE483203T1 (de)
DE (1) DE602005023904D1 (de)
TW (2) TWI324729B (de)
WO (1) WO2006071625A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7751333B2 (en) 2004-12-29 2010-07-06 Intel Corporation Method and apparatus to couple a module to a management controller on an interconnect
DE102005026181A1 (de) * 2005-06-06 2006-12-07 Rittal Res Electronic Systems Gmbh & Co. Kg Baugruppenträger
KR100848316B1 (ko) 2006-12-05 2008-07-24 한국전자통신연구원 Ａｔｃａ 시스템에서 ｉｐｍｉ 메시지를 이용한 보드의상태 정보 제공 방법 및 그 장치
JP5204613B2 (ja) * 2008-10-17 2013-06-05 株式会社バッファロー 端末装置
US8199511B2 (en) * 2009-04-01 2012-06-12 Fusion-Io, Inc. Hot swappable computer card carrier
CN101631345B (zh) * 2009-08-13 2013-10-16 中兴通讯股份有限公司 单板运行状态的监控方法及装置
US8286009B2 (en) 2009-08-31 2012-10-09 GE Intelligent Platforms Embedded Systems, Inc. Computer including a carrier board and methods of assembly
US8755193B2 (en) 2009-10-12 2014-06-17 Netapp, Inc. Method and system for providing a customized storage container
EP2941110B1 (de) * 2010-08-09 2020-12-16 Amazon Technologies, Inc. Datencenter mit rippenmodulen
US9055688B2 (en) 2010-08-20 2015-06-09 Rockwell Automation Technologies, Inc. Input/output circuits having status indicators aligned with respective terminals
US9589598B1 (en) * 2011-08-10 2017-03-07 Lockheed Martin Corporation Configurable spacecraft processor system
CN102385034B (zh) * 2011-10-12 2013-08-07 京信通信系统（中国）有限公司 一种微电信运算架构的电路测试装置及方法
CN103135682B (zh) * 2011-11-30 2016-03-02 英业达科技有限公司 刀锋服务器
CN103984271A (zh) * 2014-05-30 2014-08-13 常州联力自动化科技有限公司 基于模块化技术的矿用本安型控制器及控制方法
GB2528464A (en) 2014-07-22 2016-01-27 Ibm Data processing system with balcony boards
US20170324576A1 (en) * 2014-07-28 2017-11-09 Hewlett-Packard Development Company, L.P. Master module
CN109074414B (zh) * 2016-05-02 2023-06-20 维纳尔电气系统有限公司 用于配置配电箱的方法及系统
IT201600073909A1 (it) * 2016-07-14 2018-01-14 Nebra Micro Ltd Sistema di clustering.
WO2018011425A1 (en) * 2016-07-14 2018-01-18 Nebra Micro Ltd Clustering system
WO2020013807A1 (en) * 2018-07-10 2020-01-16 Hewlett-Packard Development Company, L.P. Modular computing component information transmission
CN116437617A (zh) * 2023-04-11 2023-07-14 小米汽车科技有限公司 车载控制器和车辆

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4935845A (en) * 1988-07-11 1990-06-19 General Electric Company Electronic circuit module with improved cooling
US5761033A (en) * 1993-02-19 1998-06-02 Sejus Corporation Open computer system with externally interconnected peripheral modules
JPH08190395A (ja) * 1995-01-10 1996-07-23 Ekushingu:Kk サーバー装置
JPH09212600A (ja) * 1996-01-31 1997-08-15 Sharp Corp Ｉｃカード挿抜検出制御装置
US6101557A (en) * 1998-05-29 2000-08-08 International Business Machines Corporation Method and system for remote function control and delegation within multifunction bus supported devices
JP3886309B2 (ja) * 1999-11-16 2007-02-28 日本電気株式会社 ネットワーク管理システム及びネットワーク管理方法
US6555858B1 (en) * 2000-11-15 2003-04-29 Motorola, Inc. Self-aligned magnetic clad write line and its method of formation
JP2002353664A (ja) * 2001-05-29 2002-12-06 Synclayer Inc 電装ユニット収納システム
US6456498B1 (en) * 2001-08-07 2002-09-24 Hewlett-Packard Co. CompactPCI-based computer system with mid-plane connector for equivalent front and back loading
US7103761B2 (en) * 2001-08-07 2006-09-05 Hewlett-Packard Development Company, Lp. Server system with multiple management user interfaces
US7051363B2 (en) * 2001-09-20 2006-05-23 Intel Corporation System and method for interfacing to different implementations of the intelligent platform management interface
US7203846B2 (en) * 2001-10-31 2007-04-10 Hewlett-Packard Development Company, Lp. System and method for intelligent control of power consumption of distributed services during periods of reduced load
US7069349B2 (en) * 2002-01-10 2006-06-27 Intel Corporation IPMI dual-domain controller
US7533210B2 (en) * 2002-10-24 2009-05-12 Sun Microsystems, Inc. Virtual communication interfaces for a micro-controller
JP2004343061A (ja) * 2003-03-24 2004-12-02 Schroff Gmbh 組立体支持体に差し込み、組立体支持体から引き抜く差込組立体
US7966389B2 (en) * 2003-04-22 2011-06-21 Hewlett-Packard Development Company, L.P. System and method for application programming interface for extended intelligent platform management
US7281076B2 (en) * 2003-04-30 2007-10-09 Hewlett-Packard Development Company, L.P. Form factor converter and tester in an open architecture modular computing system
JP2004355351A (ja) * 2003-05-29 2004-12-16 Hitachi Ltd サーバ装置
US7415551B2 (en) * 2003-08-18 2008-08-19 Dell Products L.P. Multi-host virtual bridge input-output resource switch
US20050111151A1 (en) * 2003-11-25 2005-05-26 Lam Don T. Isolation circuit for a communication system
CN100397292C (zh) * 2004-03-15 2008-06-25 美高森美股份有限公司-模拟混合信号集团有限公司 高密度装置
US7083422B2 (en) * 2004-04-13 2006-08-01 Intel Corporation Switching system
US7131849B2 (en) * 2004-06-18 2006-11-07 Yamaichi Electronics U.S.A., Inc. Connector for connecting printed circuit boards
US6935868B1 (en) * 2004-06-29 2005-08-30 Intel Corporation Adjustable-width, dual-connector card module
US7817394B2 (en) * 2004-07-28 2010-10-19 Intel Corporation Systems, apparatus and methods capable of shelf management
US20060114923A1 (en) * 2004-11-29 2006-06-01 Overgaard Mark D Disaggregated star platform management bus architecture system
US7280356B2 (en) * 2004-12-14 2007-10-09 Amphenol Corporation Air cooling architecture for orthogonal board architectures
US7751333B2 (en) 2004-12-29 2010-07-06 Intel Corporation Method and apparatus to couple a module to a management controller on an interconnect
US7266627B2 (en) * 2005-03-23 2007-09-04 Intel Corporation Method and apparatus to couple a rear transition module to a carrier board
US7525219B2 (en) * 2005-09-26 2009-04-28 Intel Corporation Providing power to a module
US7388757B2 (en) * 2005-11-28 2008-06-17 Emerson Network Power - Embedded Computing, Inc. Monolithic backplane having a first and second portion
US7458815B2 (en) * 2006-03-30 2008-12-02 Intel Corporation Module to couple to a plurality of backplanes in a chassis
JP2008190395A (ja) 2007-02-02 2008-08-21 Yanmar Co Ltd 燃料噴射ポンプ潤滑構造
JP2009212600A (ja) 2008-02-29 2009-09-17 Kyocera Corp 電話機、通話システム

Also Published As

Publication number Publication date
EP1831793A1 (de) 2007-09-12
US7751333B2 (en) 2010-07-06
US8351198B2 (en) 2013-01-08
EP1831793B1 (de) 2010-09-29
US20060140179A1 (en) 2006-06-29
TWI322349B (en) 2010-03-21
US20130301208A1 (en) 2013-11-14
WO2006071625A1 (en) 2006-07-06
DE602005023904D1 (de) 2010-11-11
CN1831802A (zh) 2006-09-13
CN102096652B (zh) 2015-04-01
KR20070086790A (ko) 2007-08-27
CN102096652A (zh) 2011-06-15
US20100110645A1 (en) 2010-05-06
TW201003382A (en) 2010-01-16
US8913379B2 (en) 2014-12-16
US20150205748A1 (en) 2015-07-23
JP2008525912A (ja) 2008-07-17
KR100920499B1 (ko) 2009-10-08
TWI324729B (en) 2010-05-11
TW200634508A (en) 2006-10-01

Similar Documents

Publication Publication Date Title
ATE483203T1 (de) Verfahren und vorrichtung zur kopplung eines moduls an eine verwaltungssteuerung auf einem interconnect
ATE367036T1 (de) Verfahren und vorrichtung zur bereitstellung elektronischer post an ein mobiles gerät
WO2009001218A3 (fr) Carte électronique apte á exécuter une commande provenant d'un système de simulation et une commande provenant d'un module de diagnostic et procédé de simulation associé
ATE448962T1 (de) Verfahren und system zur ausrichtung eines stationären fahrzeugs auf einen künstlichen horizont
WO2003042785A3 (en) Method and system for computer based testing using customizable templates
EP2053502A3 (de) Vorrichtung und Verfahren für den Zugriff auf Informationen, die mit einem Prozesssteuersystem verknüpft sind
EP1628212A3 (de) Verfahren und Vorrichtung für das Aktualisieren der Software eines Netzwerkgeräts
DE60317654D1 (de) Verfahren und vorrichtung zur veränderung eines kernmodules, um es auf mehreren kernversionen lauffähig zu machen
DE602005015512D1 (de) Vorrichtung und Verfahren zur gesicherte Vervielfältigung von SIM-Karte-Informationen
EP1605350A3 (de) Signalverarbeitungsvorrichtung und entsprechendes Verfahren
WO2007114968A3 (en) Medical resuscitation system and patient information module
PL1832093T3 (pl) Urządzenie testujące do zastosowania w systemie testującym do kontroli procesów transmisji w sieci telefonii bezprzewodowej
TW200710400A (en) Method and apparatus for manufacturing a probe card
ATE512397T1 (de) Verfahren und system zum montieren von leiterplatten auf eine basisplatte
DE502004008355D1 (de) Chipkarte, chipkartenmodul sowie verfahren zur herstellung eines chipkartenmoduls
DE69833565D1 (de) Verfahren und vorrichtung zum verbinden eines allzweckrechners mit einem spezialsystem
EP2222104A3 (de) Informationsaustauschvorrichtung sowie dafür angewendetes Verfahren und Verwaltungssystem
WO2007059025A3 (en) Method and system for testing backplanes utilizing a boundary scan protocol
CN105488916A (zh) 一种体育器材管理系统
ATE534211T1 (de) Konfigurierung eines intelligenten elektronischen geräts
FR2891911B1 (fr) "dispositif modulaire destine a l'analyse d'un fluide biologique, notamment sanguin"
DE602007011462D1 (de) Verfahren und Vorrichtung zur Aktualisierung eines Geräteprofils
DE602004011027D1 (de) Verfahren und vorrichtung zur konfiguration und aufstellung von eingangs/ausgangskarten in einem kommunikationsbereich
DE60312401D1 (de) Verfahren und systems zur simulation eines kommunikationsnetzwerkes, anordnung und dazugehöriges computerprogramm-produkt
DE602004008385D1 (de) Farbfiltersubstrat, Verfahren zu dessen Herstellung, elektro-optische Vorrichtung und elektronisches Gerät

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties