ATE482577T1 - Verringerung der luftdämpfung in einer mems- vorrichtung - Google Patents

Verringerung der luftdämpfung in einer mems- vorrichtung

Info

Publication number
ATE482577T1
ATE482577T1 AT05795039T AT05795039T ATE482577T1 AT E482577 T1 ATE482577 T1 AT E482577T1 AT 05795039 T AT05795039 T AT 05795039T AT 05795039 T AT05795039 T AT 05795039T AT E482577 T1 ATE482577 T1 AT E482577T1
Authority
AT
Austria
Prior art keywords
facing surfaces
substrate
channels
mems device
damping
Prior art date
Application number
AT05795039T
Other languages
English (en)
Inventor
Peter G Steeneken
Beek J T M Van
Theo Rijks
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Application granted granted Critical
Publication of ATE482577T1 publication Critical patent/ATE482577T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0059—Constitution or structural means for controlling the movement not provided for in groups B81B3/0037 - B81B3/0056
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Fluid-Damping Devices (AREA)
  • Vibration Prevention Devices (AREA)
AT05795039T 2004-10-27 2005-10-24 Verringerung der luftdämpfung in einer mems- vorrichtung ATE482577T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04105342 2004-10-27
PCT/IB2005/053477 WO2006046194A1 (en) 2004-10-27 2005-10-24 Reduction of air damping in mems device

Publications (1)

Publication Number Publication Date
ATE482577T1 true ATE482577T1 (de) 2010-10-15

Family

ID=35589345

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05795039T ATE482577T1 (de) 2004-10-27 2005-10-24 Verringerung der luftdämpfung in einer mems- vorrichtung

Country Status (7)

Country Link
US (1) US7969262B2 (de)
EP (1) EP1808046B1 (de)
JP (1) JP5031573B2 (de)
CN (1) CN101049045B (de)
AT (1) ATE482577T1 (de)
DE (1) DE602005023761D1 (de)
WO (1) WO2006046194A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8339764B2 (en) 2008-05-12 2012-12-25 Nxp B.V. MEMs devices
CN101972847B (zh) * 2010-09-21 2012-11-21 上海盛江特种耐火材料有限公司 特殊钢用铬质引流砂及其制备工艺
US20120211805A1 (en) 2011-02-22 2012-08-23 Bernhard Winkler Cavity structures for mems devices
DE102011102266B4 (de) * 2011-05-23 2013-04-11 Epcos Ag Anordnung mit einem MEMS-Bauelement mit einer PFPE Schicht und Verfahren zur Herstellung
US9136136B2 (en) * 2013-09-19 2015-09-15 Infineon Technologies Dresden Gmbh Method and structure for creating cavities with extreme aspect ratios
KR102632658B1 (ko) 2015-05-11 2024-02-01 바스프 에스이 L-글루포시네이트 및 인다지플람을 포함하는 제초제 조합물
JP6544037B2 (ja) * 2015-05-18 2019-07-17 株式会社リコー 発電素子ユニット、及び発電装置
KR20170004123A (ko) * 2015-07-01 2017-01-11 삼성전기주식회사 센서 소자 및 그 제조 방법
WO2017054868A1 (en) * 2015-09-30 2017-04-06 Tdk Corporation Resiliently mounted sensor system with damping
ITUB20161080A1 (it) * 2016-02-25 2017-08-25 St Microelectronics Srl Dispositivo sensore di pressione di tipo micro-elettro-meccanico con ridotta sensibilita' alla temperatura
US10239746B2 (en) * 2016-11-11 2019-03-26 Analog Devices, Inc. Vertical stopper for capping MEMS devices
US10838366B2 (en) 2017-09-14 2020-11-17 Timex Group Usa, Inc. Bidirectional MEMS driving arrangements with a force absorbing system
CN111834438B (zh) * 2019-04-18 2024-05-31 西部数据技术公司 半导体部件背侧上用于减轻堆叠封装中的分层的孔结构
CN111885469B (zh) * 2020-07-09 2022-09-13 诺思(天津)微系统有限责任公司 Mems扬声器及其制造方法

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Publication number Priority date Publication date Assignee Title
US148550A (en) * 1874-03-17 Improvement in driving-reins
DE2553834C3 (de) * 1975-11-29 1979-01-11 Gardisette Holding Ag, Luzern (Schweiz) Vorrichtung zum Transportieren und Lagern von konfektionierten Gardinen oder Vorhängen
JP3019701B2 (ja) * 1993-12-24 2000-03-13 日産自動車株式会社 加速度センサ
JPH08254544A (ja) * 1995-03-15 1996-10-01 Omron Corp 半導体加速度センサ
US5578976A (en) * 1995-06-22 1996-11-26 Rockwell International Corporation Micro electromechanical RF switch
US5880921A (en) * 1997-04-28 1999-03-09 Rockwell Science Center, Llc Monolithically integrated switched capacitor bank using micro electro mechanical system (MEMS) technology
US5955659A (en) * 1998-01-13 1999-09-21 Massachusetts Institute Of Technology Electrostatically-actuated structures for fluid property measurements and related methods
GB2353410B (en) 1999-08-18 2002-04-17 Marconi Electronic Syst Ltd Electrical switches
US6307452B1 (en) * 1999-09-16 2001-10-23 Motorola, Inc. Folded spring based micro electromechanical (MEM) RF switch
EP1164412B1 (de) * 1999-12-24 2007-10-17 Sumitomo Electric Industries, Ltd. Optsche Übertragungsleitung mit Ramanverstärkung und optisches Übertragungssystem
AU2001236992A1 (en) 2000-02-11 2001-08-20 Zygo Corporation Stiction release mechanism
AU2001265084A1 (en) * 2000-05-30 2001-12-11 Input/Output, Inc. Accelerometer with re-entrant grooves
AU2001268742A1 (en) * 2000-06-28 2002-01-08 The Regents Of The University Of California Capacitive microelectromechanical switches
US20020190267A1 (en) * 2001-06-07 2002-12-19 Robertson Janet K. Electrostatically actuated microswitch
AU2002355553A1 (en) 2001-08-07 2003-02-24 Corporation For National Research Initiatives An electromechanical switch and method of fabrication
JP3651671B2 (ja) * 2001-08-30 2005-05-25 株式会社東芝 マイクロメカニカルスイッチ及びその製造方法
US20030080839A1 (en) * 2001-10-31 2003-05-01 Wong Marvin Glenn Method for improving the power handling capacity of MEMS switches
US6635506B2 (en) 2001-11-07 2003-10-21 International Business Machines Corporation Method of fabricating micro-electromechanical switches on CMOS compatible substrates
US6836029B2 (en) * 2001-11-28 2004-12-28 International Business Machines Corporation Micro-electromechanical switch having a conductive compressible electrode
US6798029B2 (en) 2003-05-09 2004-09-28 International Business Machines Corporation Method of fabricating micro-electromechanical switches on CMOS compatible substrates
JP4447940B2 (ja) * 2004-02-27 2010-04-07 富士通株式会社 マイクロスイッチング素子製造方法およびマイクロスイッチング素子
US7102472B1 (en) * 2004-05-06 2006-09-05 Northrop Grumman Corporation MEMS device

Also Published As

Publication number Publication date
US20100001615A1 (en) 2010-01-07
US7969262B2 (en) 2011-06-28
CN101049045A (zh) 2007-10-03
WO2006046194A1 (en) 2006-05-04
DE602005023761D1 (de) 2010-11-04
EP1808046A1 (de) 2007-07-18
EP1808046B1 (de) 2010-09-22
JP5031573B2 (ja) 2012-09-19
CN101049045B (zh) 2011-09-21
JP2008517786A (ja) 2008-05-29

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties