ATE481735T1 - Methode zur justage und zum bonding von teilen und ein bauteil aus justierten und gebondeten teilen - Google Patents

Methode zur justage und zum bonding von teilen und ein bauteil aus justierten und gebondeten teilen

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Publication number
ATE481735T1
ATE481735T1 AT08150789T AT08150789T ATE481735T1 AT E481735 T1 ATE481735 T1 AT E481735T1 AT 08150789 T AT08150789 T AT 08150789T AT 08150789 T AT08150789 T AT 08150789T AT E481735 T1 ATE481735 T1 AT E481735T1
Authority
AT
Austria
Prior art keywords
parts
protrusion
main surface
adjusting
adjusted
Prior art date
Application number
AT08150789T
Other languages
English (en)
Inventor
Philippe Soussan
Wouter Ruythooren
Eric Beyne
Munck Koen De
Original Assignee
Imec
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imec filed Critical Imec
Application granted granted Critical
Publication of ATE481735T1 publication Critical patent/ATE481735T1/de

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    • H01L24/90—Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
    • F16B5/04—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of riveting
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    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
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    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06575—Auxiliary carrier between devices, the carrier having no electrical connection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06589—Thermal management, e.g. cooling
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
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    • H01L2924/01029—Copper [Cu]
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    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06—Riveted connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
  • Connection Of Plates (AREA)
AT08150789T 2007-12-27 2008-01-29 Methode zur justage und zum bonding von teilen und ein bauteil aus justierten und gebondeten teilen ATE481735T1 (de)

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US (1) US8440504B2 (de)
EP (1) EP2075832B1 (de)
AT (1) ATE481735T1 (de)
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WO (1) WO2009083582A1 (de)

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Publication number Priority date Publication date Assignee Title
US9401575B2 (en) * 2013-05-29 2016-07-26 Sonion Nederland Bv Method of assembling a transducer assembly
US9893058B2 (en) * 2015-09-17 2018-02-13 Semiconductor Components Industries, Llc Method of manufacturing a semiconductor device having reduced on-state resistance and structure
US11450626B2 (en) * 2020-08-25 2022-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package

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Publication number Priority date Publication date Assignee Title
GB1048520A (en) * 1964-12-23 1966-11-16 Talon Inc Manufacture of a composite electrical contact rivet assembly
US3311729A (en) * 1965-10-04 1967-03-28 Deringer Mfg Company Electrical contact and method of forming the same
GB1326762A (en) * 1970-08-26 1973-08-15 Textron Inc Composite rivets
FR2488037A1 (fr) * 1980-08-01 1982-02-05 Legrand Sa Procede de realisation de lames de contact de commutateur, appareil pour sa mise en oeuvre, et lame de contact realisee par ce procede
US4478543A (en) * 1982-01-25 1984-10-23 Microdot Inc. Blind rivet
US5917707A (en) * 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
DE9107921U1 (de) * 1991-06-27 1991-08-22 Siemens Ag, 8000 Muenchen, De
JPH11162276A (ja) * 1997-11-25 1999-06-18 Matsushita Electric Works Ltd 電気接触子
US6384353B1 (en) * 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
US6577013B1 (en) 2000-09-05 2003-06-10 Amkor Technology, Inc. Chip size semiconductor packages with stacked dies
DE10161317A1 (de) * 2001-12-13 2003-07-03 Matsushita Electric Works Europe Ag Relais-Kontaktelement und Verfahren zur Herstellung davon
TWI231023B (en) 2003-05-27 2005-04-11 Ind Tech Res Inst Electronic packaging with three-dimensional stack and assembling method thereof
KR100537892B1 (ko) * 2003-08-26 2005-12-21 삼성전자주식회사 칩 스택 패키지와 그 제조 방법
US20060012055A1 (en) 2004-07-15 2006-01-19 Foong Chee S Semiconductor package including rivet for bonding of lead posts
US7211510B2 (en) * 2004-09-09 2007-05-01 Advanced Bionics Corporation Stacking circuit elements
DE102005054353A1 (de) * 2005-11-15 2006-08-17 Infineon Technologies Ag Elektronisches Bauelement sowie ein Verfahren zum Herstellen eines solchen Bauelements
KR100800473B1 (ko) * 2006-06-30 2008-02-04 삼성전자주식회사 재배선 칩 패드를 갖는 적층 칩 및 이를 이용한 적층 칩패키지

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US8440504B2 (en) 2013-05-14
EP2075832B1 (de) 2010-09-15
EP2075832A1 (de) 2009-07-01
WO2009083582A1 (en) 2009-07-09
DE602008002541D1 (de) 2010-10-28
US20110006431A1 (en) 2011-01-13

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