WO2006087301A3 - Verfahren und vorrichtung zum verbinden von halbleiterelementen oder interposern mit einem trägerband und verwendung einer derartigen vorrichtung - Google Patents

Verfahren und vorrichtung zum verbinden von halbleiterelementen oder interposern mit einem trägerband und verwendung einer derartigen vorrichtung Download PDF

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Publication number
WO2006087301A3
WO2006087301A3 PCT/EP2006/050866 EP2006050866W WO2006087301A3 WO 2006087301 A3 WO2006087301 A3 WO 2006087301A3 EP 2006050866 W EP2006050866 W EP 2006050866W WO 2006087301 A3 WO2006087301 A3 WO 2006087301A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
interposer
semiconductor
supporting strip
heating
Prior art date
Application number
PCT/EP2006/050866
Other languages
English (en)
French (fr)
Other versions
WO2006087301A2 (de
Inventor
Stefan Bierl
Wolfram Kunze
Matthias Klooss
Volker Poenitz
Dieter Bergmann
Original Assignee
Muehlbauer Ag
Stefan Bierl
Wolfram Kunze
Matthias Klooss
Volker Poenitz
Dieter Bergmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Muehlbauer Ag, Stefan Bierl, Wolfram Kunze, Matthias Klooss, Volker Poenitz, Dieter Bergmann filed Critical Muehlbauer Ag
Priority to EP06708208A priority Critical patent/EP1849341A2/de
Publication of WO2006087301A2 publication Critical patent/WO2006087301A2/de
Publication of WO2006087301A3 publication Critical patent/WO2006087301A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/003—Placing of components on belts holding the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zum Verbinden von ein- oder mehrreihig angeordneten Halbleiterelementen (2) oder Interposem (24) mit einem flexiblen, fortlaufenden Trägerband (1 , 23) mittels bei Erwärmung aushärtbaren Klebstoffen oder Lotmitteln, wobei auf die Oberseiten (2a) der Halbleiterelemente (2) oder Interposer (24) erste Heizelemente (7a-c; 26) mit einer einstellbaren ersten Druckkraft von oben nach unten drücken und an der Unterseite (2b) der Halbleiterelemente (2) oder Interposer (24) mindestens ein zweites Heizelement (8; 27) der ersten Druckkraft von unten nach oben entgegenwirkt, wobei zwischen den ersten Heizelementen (7a-c; 26) und den Halbleiterelementen (2) bzw. Interposem (24) sowie zwischen dem zweiten Heizelement (8; 27) und den Halbleiterelementen (2) bzw. Interposem (24) jeweils ein Endlosband (9, 10; 28, 29) mit der gleichen Laufgeschwindigkeit bezogen auf das Trägerband (1 , 23) parallel zur Laufrichtung (5) des Trägerbandes (1 , 23) fortlaufend bewegt wird, während die ersten Heizelemente (7a-c; 26) mittels Federbeaufschlagung die erste Druckkraft ausüben.
PCT/EP2006/050866 2005-02-15 2006-02-13 Verfahren und vorrichtung zum verbinden von halbleiterelementen oder interposern mit einem trägerband und verwendung einer derartigen vorrichtung WO2006087301A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06708208A EP1849341A2 (de) 2005-02-15 2006-02-13 Verfahren und vorrichtung zum verbinden von halbleiterelementen oder interposern mit einem trägerband und verwendung einer derartigen vorrichtung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005006978A DE102005006978B3 (de) 2005-02-15 2005-02-15 Verfahren und Vorrichtung zum Verbinden von Halbleiterelementen oder Interposern mit einem Trägerband und Verwendung einer derartigen Vorrichtung
DE102005006978.9 2005-02-15

Publications (2)

Publication Number Publication Date
WO2006087301A2 WO2006087301A2 (de) 2006-08-24
WO2006087301A3 true WO2006087301A3 (de) 2006-12-07

Family

ID=36441971

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/050866 WO2006087301A2 (de) 2005-02-15 2006-02-13 Verfahren und vorrichtung zum verbinden von halbleiterelementen oder interposern mit einem trägerband und verwendung einer derartigen vorrichtung

Country Status (3)

Country Link
EP (1) EP1849341A2 (de)
DE (1) DE102005006978B3 (de)
WO (1) WO2006087301A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006050964A1 (de) 2006-10-28 2008-04-30 Man Roland Druckmaschinen Ag Applikator für elektrische oder elektronische Bauelemente
DE102006058892A1 (de) * 2006-12-05 2008-06-12 Somont Gmbh Verfahren und Einrichtung zum Herstellen einer Lötverbindung
DE102009022299B4 (de) 2008-05-26 2014-07-17 Technische Universität Chemnitz Verfahren und Vorrichtung zum Aufbringen eines elektronischen Bauelements auf ein Substrat
DE102012012879B3 (de) 2012-06-28 2013-09-19 Mühlbauer Ag Thermokompressionsvorrichtung und Verfahren zum Verbinden elektrischer Bauteile mit einem Substrat
DE102015006981B4 (de) * 2015-05-29 2018-09-27 Mühlbauer Gmbh & Co. Kg Thermokompressionsvorrichtung und Verfahren zum Verbinden von elektrischen Bauteilen mit einem Substrat

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4863546A (en) * 1983-07-01 1989-09-05 Roland Melzer Apparatus and method for manufacturing plastic cards
US5605547A (en) * 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
DE10140661C1 (de) * 2001-08-24 2003-01-16 Orga Kartensysteme Gmbh Vorrichtung und Verfahren zur Herstellung von Flip-Chip-Modulen
EP1376658A2 (de) * 2002-06-25 2004-01-02 Kabushiki Kaisha Toshiba Verfahren und Vorrichtung zur Herstellung eines Halbleiterbauelements
DE10245398B3 (de) * 2002-09-28 2004-06-03 Mühlbauer Ag Vorrichtung und Verfahren zur Aufbringung von Halbleiterchips auf Trägern

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2599669B1 (fr) * 1986-06-10 1989-06-23 Tech Indles Plastification Machine pour la plastification d'un element de forme plate par application et fusion d'un film en matiere thermo-plastique
EP1030349B2 (de) * 1999-01-07 2013-12-11 Kulicke & Soffa Die Bonding GmbH Verfahren und Vorrichtung zum Behandeln von auf einem Substrat angeordneten elektronischen Bauteilen, insbesondere von Halbleiterchips
ATE240207T1 (de) * 1999-09-17 2003-05-15 Melzer Maschinenbau Gmbh Vorrichtung zum abschnittsweisen laminieren eines schichtaufbaus aus mindestens zwei kunststoffbändern

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4863546A (en) * 1983-07-01 1989-09-05 Roland Melzer Apparatus and method for manufacturing plastic cards
US5605547A (en) * 1995-03-27 1997-02-25 Micron Technology, Inc. Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor
DE10140661C1 (de) * 2001-08-24 2003-01-16 Orga Kartensysteme Gmbh Vorrichtung und Verfahren zur Herstellung von Flip-Chip-Modulen
EP1376658A2 (de) * 2002-06-25 2004-01-02 Kabushiki Kaisha Toshiba Verfahren und Vorrichtung zur Herstellung eines Halbleiterbauelements
DE10245398B3 (de) * 2002-09-28 2004-06-03 Mühlbauer Ag Vorrichtung und Verfahren zur Aufbringung von Halbleiterchips auf Trägern

Also Published As

Publication number Publication date
WO2006087301A2 (de) 2006-08-24
DE102005006978B3 (de) 2006-06-08
EP1849341A2 (de) 2007-10-31

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