WO2006034696A3 - Schicht zwischen grenzflächen unterschiedlicher komponenten in halbleiterbauteilen, sowie verfahren zu deren herstellung - Google Patents
Schicht zwischen grenzflächen unterschiedlicher komponenten in halbleiterbauteilen, sowie verfahren zu deren herstellung Download PDFInfo
- Publication number
- WO2006034696A3 WO2006034696A3 PCT/DE2005/001722 DE2005001722W WO2006034696A3 WO 2006034696 A3 WO2006034696 A3 WO 2006034696A3 DE 2005001722 W DE2005001722 W DE 2005001722W WO 2006034696 A3 WO2006034696 A3 WO 2006034696A3
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- WO
- WIPO (PCT)
- Prior art keywords
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- semiconductor modules
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49586—Insulating layers on lead frames
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/4805—Shape
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S977/742—Carbon nanotubes, CNTs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/831—Of specified ceramic or electrically insulating compositions
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Nanotechnology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800329107A CN101091245B (zh) | 2004-09-30 | 2005-09-28 | 半导体器件中不同部件界面间的层及其制造方法、具有该层的半导体器件及其制造方法 |
US11/692,322 US7834467B2 (en) | 2004-09-30 | 2007-03-28 | Layer between interfaces of different components in semiconductor devices |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004048201.2 | 2004-09-30 | ||
DE102004048201A DE102004048201B4 (de) | 2004-09-30 | 2004-09-30 | Halbleiterbauteil mit Haftvermittlerschicht, sowie Verfahren zu deren Herstellung |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/692,322 Continuation US7834467B2 (en) | 2004-09-30 | 2007-03-28 | Layer between interfaces of different components in semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006034696A2 WO2006034696A2 (de) | 2006-04-06 |
WO2006034696A3 true WO2006034696A3 (de) | 2006-07-06 |
Family
ID=35677532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2005/001722 WO2006034696A2 (de) | 2004-09-30 | 2005-09-28 | Schicht zwischen grenzflächen unterschiedlicher komponenten in halbleiterbauteilen, sowie verfahren zu deren herstellung |
Country Status (4)
Country | Link |
---|---|
US (1) | US7834467B2 (de) |
CN (1) | CN101091245B (de) |
DE (1) | DE102004048201B4 (de) |
WO (1) | WO2006034696A2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005020453B4 (de) * | 2005-04-29 | 2009-07-02 | Infineon Technologies Ag | Halbleiterbauteil mit einer Flachleiterstruktur und Verfahren zur Herstellung einer Flachleiterstruktur und Verfahren zur Herstellung eines Halbleiterbauteils |
DE102005025083B4 (de) | 2005-05-30 | 2007-05-24 | Infineon Technologies Ag | Thermoplast-Duroplast-Verbund und Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material |
US20080026505A1 (en) * | 2006-07-28 | 2008-01-31 | Nirupama Chakrapani | Electronic packages with roughened wetting and non-wetting zones |
US20080067502A1 (en) * | 2006-09-14 | 2008-03-20 | Nirupama Chakrapani | Electronic packages with fine particle wetting and non-wetting zones |
US8530279B2 (en) * | 2008-09-11 | 2013-09-10 | Texas Instruments Incorporated | Offset gravure printing process for improved mold compound and die attach adhesive adhesion on leadframe surface using selective adhesion promoter |
DE102010001711A1 (de) * | 2010-02-09 | 2011-08-11 | Robert Bosch GmbH, 70469 | Halbleiter-Bauelement und entsprechendes Herstellungsverfahren |
JP6278297B2 (ja) * | 2013-07-24 | 2018-02-14 | 株式会社日立製作所 | 接合構造およびそれを用いた半導体装置 |
US9362191B2 (en) * | 2013-08-29 | 2016-06-07 | Infineon Technologies Austria Ag | Encapsulated semiconductor device |
US9281060B1 (en) | 2015-06-01 | 2016-03-08 | International Business Machines Corporation | Device and method for storing or switching |
US9704786B2 (en) * | 2015-09-25 | 2017-07-11 | Infineon Technologies Ag | Direct selective adhesion promotor plating |
US10727085B2 (en) * | 2015-12-30 | 2020-07-28 | Texas Instruments Incorporated | Printed adhesion deposition to mitigate integrated circuit package delamination |
JP6686691B2 (ja) * | 2016-05-16 | 2020-04-22 | 株式会社デンソー | 電子装置 |
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US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
US5817544A (en) * | 1996-01-16 | 1998-10-06 | Olin Corporation | Enhanced wire-bondable leadframe |
WO1999040812A1 (en) * | 1998-02-12 | 1999-08-19 | Board Of Trustees Operating Michigan State University - | Micro-fastening system and method of manufacture |
DE10124047A1 (de) * | 2001-05-16 | 2002-11-21 | Infineon Technologies Ag | Elektronische Bauteile mit Halbleiterchips und Systemträger und Verfahren zur Herstellung derselben |
US20030208888A1 (en) * | 2002-05-13 | 2003-11-13 | Fearing Ronald S. | Adhesive microstructure and method of forming same |
US20040206448A1 (en) * | 2003-04-17 | 2004-10-21 | Nanosys, Inc. | Structures, systems and methods for joining articles and materials and uses therefor |
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US5777433A (en) * | 1996-07-11 | 1998-07-07 | Hewlett-Packard Company | High refractive index package material and a light emitting device encapsulated with such material |
US6790526B2 (en) * | 1998-01-30 | 2004-09-14 | Integument Technologies, Inc. | Oxyhalopolymer protective multifunctional appliqués and paint replacement films |
US6265333B1 (en) * | 1998-06-02 | 2001-07-24 | Board Of Regents, University Of Nebraska-Lincoln | Delamination resistant composites prepared by small diameter fiber reinforcement at ply interfaces |
AUPQ304199A0 (en) * | 1999-09-23 | 1999-10-21 | Commonwealth Scientific And Industrial Research Organisation | Patterned carbon nanotubes |
US6741019B1 (en) * | 1999-10-18 | 2004-05-25 | Agere Systems, Inc. | Article comprising aligned nanowires |
US6407922B1 (en) * | 2000-09-29 | 2002-06-18 | Intel Corporation | Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader |
NL1016779C2 (nl) * | 2000-12-02 | 2002-06-04 | Cornelis Johannes Maria V Rijn | Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs. |
KR20040090976A (ko) * | 2002-01-15 | 2004-10-27 | 나노다이나믹스 인코퍼레이티드 | 현탁된 탄소 나노튜브 조성물, 이를 제조하는 방법 및이의 용도 |
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US6890654B2 (en) * | 2002-04-18 | 2005-05-10 | Northwestern University | Encapsulation of nanotubes via self-assembled nanostructures |
US7153903B1 (en) * | 2002-06-19 | 2006-12-26 | The Board Of Regents Of The University Of Oklahoma | Carbon nanotube-filled composites prepared by in-situ polymerization |
CN1248959C (zh) | 2002-09-17 | 2006-04-05 | 清华大学 | 一种碳纳米管阵列生长方法 |
CN1296994C (zh) * | 2002-11-14 | 2007-01-24 | 清华大学 | 一种热界面材料及其制造方法 |
ATE486906T1 (de) * | 2002-11-27 | 2010-11-15 | Univ Rice William M | Verbundwerkstoffe aus funktionalisierten nanoröhren und polymer und wechselwirkungen mit strahlung |
US7112472B2 (en) * | 2003-06-25 | 2006-09-26 | Intel Corporation | Methods of fabricating a composite carbon nanotube thermal interface device |
US20050238889A1 (en) * | 2003-07-10 | 2005-10-27 | Nancy Iwamoto | Layered components, materials, methods of production and uses thereof |
EP1682815A2 (de) * | 2003-11-05 | 2006-07-26 | Future Camp GmbH | Speichersystem zum speichern eines mediums sowie verfahren zum beladen/entladen eines speichersystems mit einem speichermedium |
US7019391B2 (en) * | 2004-04-06 | 2006-03-28 | Bao Tran | NANO IC packaging |
US7109591B2 (en) * | 2004-06-04 | 2006-09-19 | Hack Jonathan A | Integrated circuit device |
-
2004
- 2004-09-30 DE DE102004048201A patent/DE102004048201B4/de not_active Expired - Fee Related
-
2005
- 2005-09-28 CN CN2005800329107A patent/CN101091245B/zh not_active Expired - Fee Related
- 2005-09-28 WO PCT/DE2005/001722 patent/WO2006034696A2/de active Application Filing
-
2007
- 2007-03-28 US US11/692,322 patent/US7834467B2/en not_active Expired - Fee Related
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US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
US5817544A (en) * | 1996-01-16 | 1998-10-06 | Olin Corporation | Enhanced wire-bondable leadframe |
WO1999040812A1 (en) * | 1998-02-12 | 1999-08-19 | Board Of Trustees Operating Michigan State University - | Micro-fastening system and method of manufacture |
DE10124047A1 (de) * | 2001-05-16 | 2002-11-21 | Infineon Technologies Ag | Elektronische Bauteile mit Halbleiterchips und Systemträger und Verfahren zur Herstellung derselben |
US20030208888A1 (en) * | 2002-05-13 | 2003-11-13 | Fearing Ronald S. | Adhesive microstructure and method of forming same |
US20040206448A1 (en) * | 2003-04-17 | 2004-10-21 | Nanosys, Inc. | Structures, systems and methods for joining articles and materials and uses therefor |
Also Published As
Publication number | Publication date |
---|---|
CN101091245A (zh) | 2007-12-19 |
DE102004048201A1 (de) | 2006-04-13 |
CN101091245B (zh) | 2010-06-16 |
DE102004048201B4 (de) | 2009-05-20 |
US20070205518A1 (en) | 2007-09-06 |
WO2006034696A2 (de) | 2006-04-06 |
US7834467B2 (en) | 2010-11-16 |
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