ATE476687T1 - Differentielle metrologie für kritische abmessung und überlagerung - Google Patents

Differentielle metrologie für kritische abmessung und überlagerung

Info

Publication number
ATE476687T1
ATE476687T1 AT03800269T AT03800269T ATE476687T1 AT E476687 T1 ATE476687 T1 AT E476687T1 AT 03800269 T AT03800269 T AT 03800269T AT 03800269 T AT03800269 T AT 03800269T AT E476687 T1 ATE476687 T1 AT E476687T1
Authority
AT
Austria
Prior art keywords
dimension
substrate
target
zero diffracted
superposition
Prior art date
Application number
AT03800269T
Other languages
English (en)
Inventor
Christopher Ausschnitt
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of ATE476687T1 publication Critical patent/ATE476687T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0055—Manufacturing logistics
    • B81C99/0065—Process control; Yield prediction
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
AT03800269T 2003-12-19 2003-12-19 Differentielle metrologie für kritische abmessung und überlagerung ATE476687T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2003/041438 WO2005069082A1 (en) 2003-12-19 2003-12-19 Differential critical dimension and overlay metrology apparatus and measurement method

Publications (1)

Publication Number Publication Date
ATE476687T1 true ATE476687T1 (de) 2010-08-15

Family

ID=34793603

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03800269T ATE476687T1 (de) 2003-12-19 2003-12-19 Differentielle metrologie für kritische abmessung und überlagerung

Country Status (8)

Country Link
US (2) US7700247B2 (de)
EP (1) EP1709490B1 (de)
JP (1) JP2007522432A (de)
CN (1) CN100442144C (de)
AT (1) ATE476687T1 (de)
AU (1) AU2003300005A1 (de)
DE (1) DE60333688D1 (de)
WO (1) WO2005069082A1 (de)

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AU2003300005A1 (en) 2005-08-03
DE60333688D1 (de) 2010-09-16
CN1879063A (zh) 2006-12-13
US20100103433A1 (en) 2010-04-29
US20070105029A1 (en) 2007-05-10
US7700247B2 (en) 2010-04-20
US8035824B2 (en) 2011-10-11
EP1709490A4 (de) 2009-03-25
EP1709490A1 (de) 2006-10-11
JP2007522432A (ja) 2007-08-09
EP1709490B1 (de) 2010-08-04
CN100442144C (zh) 2008-12-10

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