ATE475197T1 - Halbleiterbauelement und verfahren zur herstellung eines solchen bauelements - Google Patents
Halbleiterbauelement und verfahren zur herstellung eines solchen bauelementsInfo
- Publication number
- ATE475197T1 ATE475197T1 AT05718771T AT05718771T ATE475197T1 AT E475197 T1 ATE475197 T1 AT E475197T1 AT 05718771 T AT05718771 T AT 05718771T AT 05718771 T AT05718771 T AT 05718771T AT E475197 T1 ATE475197 T1 AT E475197T1
- Authority
- AT
- Austria
- Prior art keywords
- region
- semi
- semiconductor
- dielectric layer
- component
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 7
- 238000004519 manufacturing process Methods 0.000 title 1
- 108091006146 Channels Proteins 0.000 abstract 2
- 239000011810 insulating material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
Landscapes
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Formation Of Insulating Films (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP04101769 | 2004-04-27 | ||
| EP04102908 | 2004-06-23 | ||
| EP04103676 | 2004-07-30 | ||
| PCT/IB2005/051293 WO2005104232A1 (en) | 2004-04-27 | 2005-04-20 | Semiconductor device and method of manufacturing such a device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE475197T1 true ATE475197T1 (de) | 2010-08-15 |
Family
ID=34965515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT05718771T ATE475197T1 (de) | 2004-04-27 | 2005-04-20 | Halbleiterbauelement und verfahren zur herstellung eines solchen bauelements |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8084829B2 (de) |
| EP (1) | EP1743372B1 (de) |
| JP (1) | JP2007535162A (de) |
| KR (1) | KR101205115B1 (de) |
| CN (1) | CN1947250B (de) |
| AT (1) | ATE475197T1 (de) |
| DE (1) | DE602005022428D1 (de) |
| TW (1) | TW200539442A (de) |
| WO (1) | WO2005104232A1 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7768092B2 (en) * | 2005-07-20 | 2010-08-03 | Cree Sweden Ab | Semiconductor device comprising a junction having a plurality of rings |
| KR101315282B1 (ko) * | 2006-04-27 | 2013-10-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 전자기기 |
| US7868419B1 (en) * | 2007-10-18 | 2011-01-11 | Rf Micro Devices, Inc. | Linearity improvements of semiconductor substrate based radio frequency devices |
| JP2011119512A (ja) * | 2009-12-04 | 2011-06-16 | Denso Corp | 半導体装置およびその製造方法 |
| US8492868B2 (en) * | 2010-08-02 | 2013-07-23 | International Business Machines Corporation | Method, apparatus, and design structure for silicon-on-insulator high-bandwidth circuitry with reduced charge layer |
| KR101905823B1 (ko) | 2011-07-27 | 2018-10-08 | 엘지이노텍 주식회사 | 웨이퍼 제조 장치 및 웨이퍼 제조 방법 |
| FI127794B (en) * | 2017-02-15 | 2019-02-28 | Aalto Korkeakoulusaeaetioe | Semiconductor structures and their manufacture |
| EP3631855A1 (de) * | 2017-05-29 | 2020-04-08 | Teknologian Tutkimuskeskus VTT Oy | Halbleiterbauelement |
| EP3518280B1 (de) * | 2018-01-25 | 2020-11-04 | Murata Manufacturing Co., Ltd. | Elektronisches produkt mit eingebettetem porösem dielektrikum und herstellungsverfahren |
| EP3789745B1 (de) * | 2019-09-09 | 2024-04-10 | Yageo Nexensos GmbH | Flexible passive elektronische komponente und verfahren zur herstellung davon |
| FR3116151A1 (fr) * | 2020-11-10 | 2022-05-13 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de formation d’une structure de piegeage d’un substrat utile |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3582890B2 (ja) * | 1995-05-23 | 2004-10-27 | 株式会社日立製作所 | 半導体装置 |
| US6680489B1 (en) * | 1995-12-20 | 2004-01-20 | Advanced Technology Materials, Inc. | Amorphous silicon carbide thin film coating |
| KR100297703B1 (ko) * | 1998-02-24 | 2001-08-07 | 김덕중 | 반절연폴리실리콘(sipos)을이용한전력반도체장치및그제조방법 |
| US6356183B1 (en) * | 1999-08-17 | 2002-03-12 | United Microelectronics Corp. | Method of manufacturing an inductor |
| US6503838B1 (en) * | 1999-12-31 | 2003-01-07 | Texas Instruments Incorporated | Integrated circuit isolation of functionally distinct RF circuits |
| EP1231640A4 (de) * | 2000-06-27 | 2008-10-08 | Matsushita Electric Ind Co Ltd | Halbleiterbauelement |
| SE520093C2 (sv) | 2000-12-13 | 2003-05-27 | Ericsson Telefon Ab L M | Skärmad induktor |
| US6737727B2 (en) * | 2001-01-12 | 2004-05-18 | International Business Machines Corporation | Electronic structures with reduced capacitance |
| US6593185B1 (en) * | 2002-05-17 | 2003-07-15 | United Microelectronics Corp. | Method of forming embedded capacitor structure applied to logic integrated circuit |
| JP4463482B2 (ja) | 2002-07-11 | 2010-05-19 | パナソニック株式会社 | Ｍｉｓｆｅｔ及びその製造方法 |
| US7316014B2 (en) | 2002-07-12 | 2008-01-01 | Bsquare Corporation | Application modification system and method |
-
2005
- 2005-04-20 US US11/578,902 patent/US8084829B2/en active Active
- 2005-04-20 KR KR1020067023426A patent/KR101205115B1/ko active IP Right Grant
- 2005-04-20 JP JP2007510185A patent/JP2007535162A/ja active Pending
- 2005-04-20 EP EP05718771A patent/EP1743372B1/de active Active
- 2005-04-20 CN CN2005800131524A patent/CN1947250B/zh active Active
- 2005-04-20 DE DE602005022428T patent/DE602005022428D1/de active Active
- 2005-04-20 WO PCT/IB2005/051293 patent/WO2005104232A1/en active Application Filing
- 2005-04-20 AT AT05718771T patent/ATE475197T1/de not_active IP Right Cessation
- 2005-04-22 TW TW094112959A patent/TW200539442A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007535162A (ja) | 2007-11-29 |
| TW200539442A (en) | 2005-12-01 |
| US20080173974A1 (en) | 2008-07-24 |
| EP1743372B1 (de) | 2010-07-21 |
| DE602005022428D1 (de) | 2010-09-02 |
| US8084829B2 (en) | 2011-12-27 |
| CN1947250A (zh) | 2007-04-11 |
| KR101205115B1 (ko) | 2012-11-26 |
| EP1743372A1 (de) | 2007-01-17 |
| WO2005104232A1 (en) | 2005-11-03 |
| CN1947250B (zh) | 2012-09-26 |
| KR20070004089A (ko) | 2007-01-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |